Power
2.0 W
Z2SMB6V2 ........ Z2SMB200
2.0 W Surface Mounted Glass Passivated Zener Diode
Glass passivated junction
The plastic material carries UL 94 V-0
Low profile package
Easy pick and place
High temperature soldering 260 C 10 sec
Dimensions in mm.
CASE:
SMB/DO-214AA
Maximum Ratings and Electrical Characteristics at 25 C
P
tot
MECHANICAL DATA
Terminals: Solder plated, solderable per IEC 68-2-20.
Standard Packaging: 8 mm. tape (EIA-RS-481).
Weight: 0.093 g.
Typical Thermal Resistance
(5x5 mm
2
x 130 Copper Area)
R
th (j-l)
R
th (j-a)
Power dissipation at Tamb = 25 C
T
j
Operating temperature range
T
stg
Storage temperature range
V
F
Max. forward voltage drop at I
F
= 1.0 A
Other voltages upon request
20 C/W
60 C/W
2.0 W
- 65 to + 175 C
1.1 V
- 65 to + 175 C
Jun - 03
2.0
4.2
Standard soldering pad
1.25
0.25
5.1
0.3
1.25
0.25
Year code
Voltage
6.2 to 200 V
Week code
Type No. Closs
Z2SMB
Rating And Characteristic Curves
1000
100
10
1.0
500
TYPICAL ZENER IMPEDANCE
0.5
1 2
5 10 20 50 100 200
T
J
= 25 C
I
Z
(RMS) = 0.1 Iz (D.C.)
V
Z
= 91 V
V
Z
= 55 V
V
Z
= 6.2 V
MAXIMUM CONTINUOUS POWER DISSIPATION
25
50
75
100 125 150 175
3
2
1
0
0
5x5mm
2
x 130
Thick Copper Land Areas
0.4
10
TYPICAL FORWARD CHARACTERISTIC
0.6
0.8
1.2
1.4
1.6
2
1
0.2
0.1
0.01
0
10
5
2
1
0.5
0.2
0.1
0.05
0.02
0.01
TYPICAL REVERSE CHARACTERISTIC
20
40
60
80
100
1
T
J
= 25C
T
J
= 100C
T
J
= 25C
V
Z
= 30 V
I
ZT
, zener test current (mA)
Lead temperature (C)
V
F
, instantaneous forward
voltage (V)
Percent of rated zener
voltage, %
Jun - 03