2002 Fairchild Semiconductor Corporation
Rev. A1, July 2002
2N53
66
TO-92
1
Absolute Maximum Ratings
T
C
=25
C unless otherwise noted
Electrical Characteristics
T
C
=25
C unless otherwise noted
Thermal Characteristics
T
A
=25
C unless otherwise noted
Symbol
Parameter
Value
Units
V
CEO
Collector-Emitter Voltage
40
V
V
CBO
Collector-Base Voltage
40
V
V
EBO
Emitter-Base Voltage
4.0
V
I
C
Collector current
- Continuous
500
mA
T
J
, T
STG
Operating and Storage Junction Temperature Range
-55 ~ +150
C
Symbol
Parameter
Test Condition
Min.
Typ.
Max.
Units
V
CBO
Collector-Base Breakdown Voltage
I
C
= 10
A
40
V
V
CEO
Collector-Emitter Breakdown Voltage
I
C
= 10mA
40
V
V
EBO
Emitter-Base Breakdown Voltage
I
C
= 10
A
4.0
V
I
CBO
Collector Cut-off Current
V
CB
= 40V
100
nA
I
CES
Collector Cut-off Current
V
CB
= 40V
100
nA
I
EBO
Emitter Cut-off Current
V
EB
= 4.0V
10
A
h
FE
DC Current Gain
V
CE
= 10V, I
C
= 2.0mA
V
CE
= 1.0V, I
C
= 50mA
V
CE
= 5.0V, I
C
= 300mA
80
100
40
300
V
CE
(sat)
Collector-Emitter Saturation Voltage
I
C
= 50mA, I
B
= 2.5mA
I
C
= 300mA, I
B
= 30mA
0.25
1.0
V
V
BE
(sat)
Collector-Emitter Saturation Voltage
I
C
= 50mA, I
B
= 2.5mA
I
C
= 300mA, I
B
= 30mA
1.1
2.0
V
BE
(on)
Base-Emitter On Voltage
V
CE
= 10V, I
C
= 2.0mA
0.5
0.8
V
C
ob
Output Capacitance
V
CB
= 10V, f = 1MHz
8.0
pF
C
ib
Input Capacitance
V
CB
= 0.5V, f = 1MHz
35
pF
h
fe
Small-Signal Current Gain
V
CE
= 10V, I
C
= 2.0mA, f = 1MHz
80
450
Symbol
Parameter
Max.
Units
P
D
Total Device Dissipation
Derate above 25
C
625
5.0
mW
mW/
C
R
JA
Thermal Resistance, Junction to Ambient
200
C/W
2N5366
PNP General Purpose Amplifier
This device is designed for general purpose amplifiers applications at
collector currents to 300mA.
Sourced from process 68.
1. Emitter 2. Collector 3. Base
Package Dimensions
2N53
66
0.46
0.10
1.27TYP
(R2.29)
3.86MAX
[1.27
0.20
]
1.27TYP
[1.27
0.20
]
3.60
0.20
14.47
0.40
1.02
0.10
(0.25)
4.58
0.20
4.58
+0.25
0.15
0.38
+0.10
0.05
0.38
+0.10
0.05
TO-92
Dimensions in Millimeters
2002 Fairchild Semiconductor Corporation
Rev. A1, July 2002
2002 Fairchild Semiconductor Corporation
Rev. I
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DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
LIFE SUPPORT POLICY
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Formative or
In Design
First Production
Full Production
Not In Production
ImpliedDisconnect
ISOPLANAR
LittleFET
MicroFET
MicroPak
MICROWIRE
MSX
MSXPro
OCX
OCXPro
OPTOLOGIC
OPTOPLANAR
FACT
FACT Quiet Series
FAST
FASTr
FRFET
GlobalOptoisolator
GTO
HiSeC
I
2
C
Rev. I
ACEx
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CoolFET
CROSSVOLT
DOME
EcoSPARK
E
2
CMOS
TM
EnSigna
TM
Across the board. Around the world.
The Power Franchise
PACMAN
POP
Power247
PowerTrench
QFET
QS
QT Optoelectronics
Quiet Series
RapidConfigure
RapidConnect
SILENT SWITCHER
SMART START
SPM
Stealth
SuperSOT-3
SuperSOT-6
SuperSOT-8
SyncFET
TinyLogic
TruTranslation
UHC
UltraFET
VCX
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