2005 Fairchild Semiconductor Corporation
DS012408
www.fairchildsemi.com
March 1995
Revised January 2005
7
4
LCX00 Low
V
o
l
t
a
ge Quad
2-I
nput
NAND Gat
e
wi
th
5V T
o
l
e
rant
Input
s
74LCX00
Low Voltage Quad 2-Input NAND Gate
with 5V Tolerant Inputs
General Description
The LCX00 contains four 2-input NAND gates. The inputs
tolerate voltages up to 7V allowing the interface of 5V sys-
tems to 3V systems.
The 74LCX00 is fabricated with advanced CMOS technol-
ogy to achieve high speed operation while maintaining
CMOS low power dissipation.
Features
s
5V tolerant inputs
s
2.3V3.6V V
CC
specifications provided
s
5.2 ns t
PD
max (V
CC
=
3.3V), 10
A I
CC
max
s
Power down high impedance inputs and outputs
s
24 mA output drive (V
CC
=
3.0V)
s
Implements patented noise/EMI reduction circuitry
s
Latch-up performance exceeds JEDEC 78 conditions
s
ESD performance:
Human body model
>
2000V
Machine model
>
200V
s
Leadless Pb-Free DQFN package
Ordering Code:
Devices also available in Tape and Reel. Specify by appending the suffix letter "X" to the ordering code.
Pb-Free package per JEDEC J-STD-020B.
Note 1: DQFN package available in Tape and Reel only.
Note 2: "_NL" package available in Tape and Reel only.
Order Number
Package
Package Description
Number
74LCX00M
M14A
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
74LCX00MX_NL
(Note 2)
M14A
Pb-Free 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
74LCX00SJ
M14D
Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LCX00BQX
(Note 1)
MLP014A
Pb-Free 14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC
MO-241, 2.5 x 3.0mm
74LCX00MTC
MTC14
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
74LCX00MTCX_NL
(Note 2)
MTC14
Pb-Free 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
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2
74L
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X
00
Logic Symbol
IEEE/IEC
Pin Descriptions
Connection Diagrams
Pin Assignments for SOIC, SOP, and TSSOP
Pad Assignments for DQFN
(Top View)
Pin Names
Description
A
n
, B
n
Inputs
O
n
Outputs
3
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74
L
C
X
0
0
Absolute Maximum Ratings
(Note 3)
Recommended Operating Conditions
(Note 5)
Note 3: The Absolute Maximum Ratings are those values beyond which the safety of the device cannot be guaranteed. The device should not be operated
at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the Absolute Maximum Ratings. The "Recom-
mended Operating Conditions" table will define the conditions for actual device operation.
Note 4: I
O
Absolute Maximum Rating must be observed.
Note 5: Unused inputs must be held HIGH or LOW. They may not float.
DC Electrical Characteristics
Symbol
Parameter
Value
Conditions
Units
V
CC
Supply Voltage
-
0.5 to
+
7.0
V
V
I
DC Input Voltage
-
0.5 to
+
7.0
V
V
O
DC Output Voltage
-
0.5 to V
CC
+
0.5
Output in HIGH or LOW State (Note 4)
V
I
IK
DC Input Diode Current
-
50
V
I
<
GND
mA
I
OK
DC Output Diode Current
-
50
V
O
<
GND
mA
+
50
V
O
>
V
CC
I
O
DC Output Source/Sink Current
50
mA
I
CC
DC Supply Current per Supply Pin
100
mA
I
GND
DC Ground Current per Ground Pin
100
mA
T
STG
Storage Temperature
-
65 to
+
150
C
Symbol
Parameter
Min
Max
Units
V
CC
Supply Voltage
Operating
2.0
3.6
V
Data Retention
1.5
3.6
V
I
Input Voltage
0
5.5
V
V
O
Output Voltage
HIGH or LOW State
0
V
CC
V
I
OH
/I
OL
Output Current
V
CC
=
3.0V
-
3.6V
24
mA
V
CC
=
2.7V - 3.0V
12
V
CC
=
2.3V - 2.7V
8
T
A
Free-Air Operating Temperature
-
40
85
C
t/
V
Input Edge Rate, V
IN
=
0.8V2.0V, V
CC
=
3.0V
0
10
ns/V
Symbol
Parameter
Conditions
V
CC
T
A
=
-
40
C to
+
85
C
Units
(V)
Min
Max
V
IH
HIGH Level Input Voltage
2.3
-
2.7
1.7
V
2.7
-
3.6
2.0
V
IL
LOW Level Input Voltage
2.3
-
2.7
0.7
V
2.7
-
3.6
0.8
V
OH
HIGH Level Output Voltage
I
OH
=
-
100
A
2.3
-
3.6
V
CC
-
0.2
V
I
OH
=
-
8 mA
2.3
1.8
I
OH
=
-
12 mA
2.7
2.2
I
OH
=
-
18 mA
3.0
2.4
I
OH
=
-
24 mA
3.0
2.2
V
OL
LOW Level Output Voltage
I
OL
=
100
A
2.3
-
3.6
0.2
V
I
OL
=
8mA
2.3
0.6
I
OL
=
12 mA
2.7
0.4
I
OL
=
16 mA
3.0
0.4
I
OL
=
24 mA
3.0
0.55
I
I
Input Leakage Current
0
V
I
5.5V
2.3
-
3.6
5.0
A
I
OFF
Power-Off Leakage Current
V
I
or V
O
=
5.5V
0
10
A
I
CC
Quiescent Supply Current
V
I
=
V
CC
or GND
2.3
-
3.6
10
A
3.6V
V
I
5.5V
2.3
-
3.6
10
I
CC
Increase in I
CC
per Input
V
IH
=
V
CC
-
0.6V
2.3
-
3.6
500
A
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AC Electrical Characteristics
Note 6: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The
specification applies to any outputs switching in the same direction, either HIGH-to-LOW (t
OSHL
) or LOW-to-HIGH (t
OSLH
).
Dynamic Switching Characteristics
Capacitance
Symbol
Parameter
T
A
=
-
40
C to
+
85
CF, R
L
=
500
Units
V
CC
=
3.3V
0.3V
V
CC
=
2.7V
V
CC
=
2.5V
0.2V
C
L
=
50pF
C
L
=
50pF
C
L
=
30pF
Min
Max
Min
Max
Min
Max
t
PHL
Propagation Delay
1.5
5.2
1.5
6.0
1.5
6.2
ns
t
PLH
1.5
5.2
1.5
6.0
1.5
6.2
t
OSHL
Output to Output Skew (Note 6)
1.0
ns
t
OSLH
1.0
Symbol
Parameter
Conditions
V
CC
T
A
=
25
C
Unit
(V)
Typical
V
OLP
Quiet Output Dynamic Peak V
OL
C
L
=
50 pF, V
IH
=
3.3V, V
IL
=
0V
3.3
0.8
V
C
L
=
30 pF, V
IH
=
2.5V, V
IL
=
0V
2.5
0.6
V
OLV
Quiet Output Dynamic Valley V
OL
C
L
=
50 pF, V
IH
=
3.3V, V
IL
=
0V
3.3
-
0.8
V
C
L
=
30 pF, V
IH
=
2.5V, V
IL
=
0V
2.5
-
0.6
Symbol
Parameter
Conditions
Typical
Units
C
IN
Input Capacitance
V
CC
=
Open, V
I
=
0V or V
CC
7
pF
C
OUT
Output Capacitance
V
CC
=
3.3V, V
I
=
0V or V
CC
8
pF
C
PD
Power Dissipation Capacitance
V
CC
=
3.3V, V
I
=
0V or V
CC
, f
=
10 MHz
25
pF
5
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74
L
C
X
0
0
AC LOADING and WAVEFORMS
Generic for LCX Family
FIGURE 1. AC Test Circuit (C
L
includes probe and jig capacitance)
Waveform for Inverting and Non-Inverting Functions
Propagation Delay. Pulse Width and t
rec
Waveforms
3-STATE Output Low Enable and
Disable Times for Logic
3-STATE Output High Enable and
Disable Times for Logic
Setup Time, Hold Time and Recovery Time for Logic
t
rise
and t
fall
FIGURE 2. Waveforms
(Input Characteristics; f =1MHz, t
r
= t
f
= 3ns)
Test
Switch
t
PLH
, t
PHL
Open
t
PZL
, t
PLZ
6V at V
CC
=
3.3
0.3V
V
CC
x 2 at V
CC
=
2.5
0.2V
t
PZH
,t
PHZ
GND
Symbol
V
CC
3.3V
0.3V
2.7V
2.5V
0.2V
V
mi
1.5V
1.5V
V
CC
/2
V
mo
1.5V
1.5V
V
CC
/2
V
x
V
OL
+
0.3V
V
OL
+
0.3V
V
OL
+
0.15V
V
y
V
OH
-
0.3V
V
OH
-
0.3V
V
OH
-
0.15V
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6
74L
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Schematic Diagram
Generic for LCX Family
7
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74
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Tape and Reel Specification
Tape Format for DQFN
TAPE DIMENSIONS inches (millimeters)
REEL DIMENSIONS inches (millimeters)
Package
Tape
Number
Cavity
Cover Tape
Designator
Section
Cavities
Status
Status
Leader (Start End)
125 (typ)
Empty
Sealed
BQX
Carrier
3000
Filled
Sealed
Trailer (Hub End)
75 (typ)
Empty
Sealed
Tape Size
A
B
C
D
N
W1
W2
12 mm
13.0
0.059
0.512
0.795
2.165
0.488
0.724
(330.0)
(1.50)
(13.00)
(20.20)
(55.00)
(12.4)
(18.4)
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8
74L
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Physical Dimensions
inches (millimeters) unless otherwise noted
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
Package Number M14A
9
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74
L
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X
0
0
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M14D
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10
74L
C
X
00
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
Pb-Free 14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.0mm
Package Number MLP014A
11
www.fairchildsemi.com
7
4
LCX00 Low
V
o
l
t
a
ge Quad
2-I
nput
NAND Gat
e
wi
th
5V T
o
l
e
rant
Input
s
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC14
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be rea-
sonably expected to result in a significant injury to the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be rea-
sonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
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