2005 Fairchild Semiconductor Corporation
DS011626
www.fairchildsemi.com
July 1993
Revised February 2005
7
4
VH
CU04 Hex Inver
ter
74VHCU04
Hex Inverter
General Description
The VHCU04 is an advanced high speed CMOS Inverter
fabricated with silicon gate CMOS technology. It achieves
the high speed operation similar to equivalent Bipolar
Schottky TTL while maintaining the CMOS low power dissi-
pation.
Since the internal circuit is composed of a single stage
inverter, it can be used in analog applications such as crys-
tal oscillators. An input protection circuit ensures that 0V to
7V can be applied to the input pins without regard to the
supply voltage. This device can be used to interface 5V to
3V systems and two supply systems such as battery
backup. This circuit prevents device destruction due to mis-
matched supply and input voltages.
Features
s
High Speed: t
PD
3.5 ns (typ) at V
CC
5V
s
Low Power Dissipation: I
CC
2
P
A (Max) @ T
A
25
q
C
s
High Noise Immunity: V
NIH
V
NIL
28% V
CC
(Min)
s
Power down protection is provided on all inputs
s
Low Noise: V
OLP
0.8V (Max)
s
Pin and Function Compatible with 74HCU04
Ordering Code:
Surface mount packages are also available on Tape and Reel. Specify by appending the suffix letter "X" to the ordering code.
Pb-Free package per JEDEC J-STD-020B.
Note 1: "_NL" indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.
Order Number
Package
Package Description
Number
74VHCU04M
M14A
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
74VHCU04MX_NL
(Note 1)
M14A
Pb-Free 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
74VHCU04SJ
M14D
Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74VHCU04MTC
MTC14
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
74VHCU04MTCX_NL
(Note 1)
MTC14
Pb-Free 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
74VHCU04N
N14A
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
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2
74VHC
U04
Logic Symbol
IEEE/IEC
Pin Descriptions
Connection Diagram
Truth Table
Pin Names
Description
A
n
Inputs
O
n
Outputs
A
O
L
H
H
L
3
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7
4
VH
CU04
Absolute Maximum Ratings
(Note 2)
Recommended Operating
Conditions
(Note 3)
Note 2: Absolute Maximum Ratings are values beyond which the device
may be damaged or have its useful life impaired. The databook specifica-
tions should be met, without exception, to ensure that the system design is
reliable over its power supply, temperature, and output/input loading vari-
ables. Fairchild does not recommend operation outside databook specifica-
tions.
Note 3: Unused inputs must be held HIGH or LOW. They may not float.
DC Electrical Characteristics
Supply Voltage (V
CC
)
0.5V to
7.0V
DC Input Voltage (V
IN
)
0.5V to
7.0V
DC Output Voltage (V
OUT
)
0.5V to V
CC
0.5V
Input Diode Current (I
IK
)
20 mA
Output Diode Current (I
OK
)
r
20 mA
DC Output Current (I
OUT
)
r
25 mA
DC V
CC
/GND Current (I
CC
)
r
50 mA
Storage Temperature (T
STG
)
65
q
C to
150
q
C
Lead Temperature (T
L
)
(Soldering, 10 seconds)
260
q
C
Supply Voltage (V
CC
)
2.0V to
5.5V
Input Voltage (V
IN
)
0V to
5.5V
Output Voltage (V
OUT
)
0V to V
CC
Operating Temperature (T
OPR
)
40
q
C to
85
q
C
Symbol
Parameter
V
CC
T
A
25
q
C
T
A
40
q
C to
85
q
C
Units
Conditions
(V)
Min
Typ
Max
Min
Max
V
IH
HIGH Level
2.0
1.70
1.70
V
Input Voltage
3.0
5.5
0.8 V
CC
0.8 V
CC
V
IL
LOW Level
2.0
0.30
0.30
V
Input Voltage
3.0
5.5
0.20 V
CC
0.20 V
CC
V
OH
HIGH Level
2.0
1.8
2.0
1.8
V
IN
V
IL
I
OH
50
P
A
Output Voltage
3.0
2.7
3.0
2.7
V
4.5
4.0
4.5
4.0
3.0
2.58
2.48
V
V
IN
GND
I
OH
4 mA
4.5
3.94
3.80
I
OH
8 mA
V
OL
LOW Level
2.0
0.0
0.2
0.2
V
IN
V
IH
I
OL
50
P
A
Output Voltage
3.0
0.0
0.3
0.3
V
4.5
0.0
0.5
0.5
3.0
0.36
0.44
V
V
IN
V
CC
I
OL
4 mA
4.5
0.36
0.44
I
OL
8 mA
I
IN
Input Leakage Current
0
5.5
r
0.1
r
1.0
P
A
V
IN
5.5V or GND
I
CC
Quiescent Supply Current
5.5
2.0
20.0
P
A
V
IN
V
CC
or GND
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4
74VHC
U04
Noise Characteristics
Note 4: Parameter guaranteed by design.
AC Electrical Characteristics
Note 5: C
PD
is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average
operating current can be obtained by the equation: I
CC
(opr.)
C
PD
* V
CC
* f
IN
I
CC
/6 (per gate).
Symbol
Parameter
V
CC
T
A
25
q
C
Units
Conditions
(V)
Typ
Limits
V
OLP
Quiet Output Maximum
5.0
0.5
0.8
V
C
L
50 pF
(Note 4)
Dynamic V
OL
V
OLV
Quiet Output Minimum
5.0
0.5
0.8
V
C
L
50 pF
(Note 4)
Dynamic V
OL
V
IHD
Minimum HIGH Level
5.0
4.0
V
C
L
50 pF
(Note 4)
Dynamic Input Voltage
V
ILD
Maximum LOW Level
5.0
1.0
V
C
L
50 pF
(Note 4)
Dynamic Input Voltage
Symbol
Parameter
V
CC
T
A
25
q
C
T
A
40
q
C to
85
q
C
Units
Conditions
(V)
Min
Typ
Max
Min
Max
t
PHL
Propagation Delay
3.3
r
0.3
5.0
8.9
1.0
10.5
ns
C
L
15 pF
t
PLH
7.5
11.4
1.0
13.0
C
L
50 pF
5.0
r
0.5
3.5
5.5
1.0
6.5
ns
C
L
15 pF
5.0
7.0
1.0
8.0
C
L
50 pF
C
IN
Input Capacitance
5
10
10
pF
V
CC
Open
C
PD
Power Dissipation
9
pF
(Note 5)
Capacitance
5
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7
4
VH
CU04
Physical Dimensions
inches (millimeters) unless otherwise noted
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow
Package Number M14A
www.fairchildsemi.com
6
74VHC
U04
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M14D
7
www.fairchildsemi.com
7
4
VH
CU04
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC14
www.fairchildsemi.com
8
74VHCU04 Hex
I
nver
ter
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Package Number N14A
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be rea-
sonably expected to result in a significant injury to the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be rea-
sonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
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