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Электронный компонент: FAN5631MPX

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2005 Fairchild Semiconductor Corporation
1
www.fairchildsemi.com
October 2005
FAN5631/FAN5632 Rev. 1.0.0
F
AN5631/F
AN5632 Regulated Step-Do
wn Char
g
e
Pump DC/DC Con
ver
ter
FAN5631/FAN5632
Regulated Step-Down Charge Pump DC/DC Converter
Features
90% Peak Efficiency
Low EMI
Low Ripple
Selectable Output Voltage 1.2V/1.5V for FAN5631
Efficiency Optimizer Feature for FAN5632
Input Voltage Range: 2.2V to 5.5V
Output Current: Up to 250mA
5% Output Voltage Accuracy
30A Operating Current
I
CC
< 1A in Shutdown Mode
1.5MHz Operating Frequency
Shutdown Isolates Output from Input
Soft-Start Limits In-Rush Current
Short Circuit and Over Temperature Protection
Minimum External Component Count
Available in a 3x3mm 10-Lead MLP Package
Applications
Cell Phones
Handheld Computers
Portable Electronic Equipment
Core Supply to Next Generation Processors
Low Voltage DC Bus
Digital Cameras
DSP Supplies
Description
The FAN5631/FAN5632 is an advanced, third-generation
switched capacitor step-down DC/DC converter utilizing Fair-
child's proprietary ScalarPumpTM technology. This innovative
architecture utilizes scalar switch re-configuration and fractional
switching techniques to produce low output ripple, lower ESR
spikes, and improve efficiency over a wide load range.
The FAN5631/FAN5632 produces a fixed regulated output volt-
age from an input voltage of 2.2V to 5V. Customized output volt-
ages are available in 100mV increments from 1V to 1.8V.
Contact a Fairchild sales representative for customized output
voltage options.
In order to maximize efficiency, the FAN5631/5632 achieves
regulation by skipping pulses. Depending upon load current, the
size of the switches are scaled dynamically; consequently,
current spikes and EMI are minimized. An internal soft-start
circuitry prevents excessive current drawn from the supply. The
device is internally protected against short circuit and over
temperature conditions.
The FAN5631 has a dual output voltage feature. When V
SEL
is
high, V
OUT
is 1.5V and when V
SEL
is low, V
OUT
is 1.2V. Other
output voltage options are available upon request.
In addition, the FAN5632 has an efficiency optimizer feature
that, when enabled, changes the switch mode configuration
from 2:1 to 1:1 at the lower threshold of V
IN
. The efficiency is
then maintained at its peak level over a wider range of input volt-
ages. In addition, V
OUT
will vary between 1.2V to 1.5V as a
result of this efficiency optimization. If the efficiency optimizer is
not enabled, V
OUT
is regulated to 1.5V.
Both the FAN5631 and FAN5632 are available in a 3x3mm
10-lead MLP package.
Ordering Information
Product Number
Package Type
Order Code
FAN5631
3x3mm 10-Lead MLP
FAN5631MPX
FAN5632
3x3mm 10-Lead MLP
FAN5632MPX
2
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FAN5631/FAN5632 Rev. 1.0.0
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AN5631/F
AN5632 Regulated Step-Do
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Typical Application
Pin Assignment
Figure 3. Pin Assignment
Pin Description
Pin No.
Pin Name
Pin Description
1
V
SEL
Output Voltage Select Logic Input Pin.
The V
SEL
pin can not be left floating and must be
connected to either a logic high or logic low level.
FAN5631:
If a logic low is applied to the V
SEL
pin then V
OUT
is 1.2V. If a logic high is
applied then V
OUT
is 1.5V.
FAN5632:
If a logic low is applied to the V
SEL
pin, the efficiency optimization mode is enabled,
and the output voltage accuracy is relaxed in order to meet optimum efficiency. However, if a
logic high is applied, the device will operate like a typical charge pump converter.
2
EN
Enable Input Pin.
If a logic high is applied to the EN pin, the device is enabled. However, if a
logic low is applied, the device is disabled and the supply current is reduced to less than 1A.
The EN pin can not be left floating and must be connected to either a logic high or logic low level.
3
C
B
+
Bucket Capacitor Positive Pin.
4 GND
Ground Pin.
This pin is connected to the internal MOSFET switches. This pin must be externally
connected to GND.
5
C
B
-
Bucket Capacitor Negative Pin.
6
V
OUT
Output Voltage Pin.
7
NC
Not Connected.
This pin is not internally connected.
8
NC
Not Connected.
This pin is not internally connected.
9
V
IN
Supply Voltage Input.
10
NC
Not Connected.
This pin is not internally connected.
V
SEL
EN
V
OUT
= 1.2V to 1.5V
V
IN
= 2.7V to 5.5V
I
OUT_MAX
= 250mA
C
OUT
10
F
C
IN
10
F
NC
NC
NC
C
B
+
C
B
-
GND
10
9
6
7
8
1
2
3
4
5
ON
OFF
40
50
60
70
80
90
FAN5631
FAN5632 with
optimization
1:1 Mode
2:1 Mode
Average Efficiency (over V
IN
= 2.7V to 5V) = 66%, With optimization = 77%
Average Efficiency (over V
IN
= 2.7V to 4.2V) = 67%, With optimization = 84%
2.
7
2.
97
Efficiency %
3.
24
3.
51
3.
78
4.
05
4.
32
4.
59
4.
86
5.
13
Input Voltage (V)
V
IN
V
OUT
NC
NC
NC
C
B
+
C
B
-
GND
V
SEL
EN
10
9
6
7
8
1
2
3
4
5
3x3mm 10-Lead MLP
Top View
Figure 2. Typical Efficiency Graph
Figure 1. Typical Application
3
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FAN5631/FAN5632 Rev. 1.0.0
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AN5631/F
AN5632 Regulated Step-Do
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Pump DC/DC Con
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Absolute Maximum Ratings
(Note1)
Recommended Operating Conditions
Notes:
1. Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at these or any other conditions above those indicated
in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Absolute maximum ratings apply individually only, not in combination.
Unless otherwise specified, all other voltages are referenced to AGND.
2. Junction to ambient thermal resistance,
JA
,
is a strong function of PCB material, board thickness, thickness and
number of copper planes, number of via used, diameter of via used, available copper surface, and attached heat
sink characteristics. The estimated value for zero air flow at 0.5W is 60C/W.
3. Using Mil Std. 883E, method 3015.7(Human Body Model) and EIA/JESD22C101-A (Charge Device Model).
Parameter
Min
Max
Unit
V
IN
to GND
-0.3
6
V
All other pins to GND
-0.3
V
IN
+ 0.3V
V
Load Current
0.5
A
Thermal Resistance-Junction to Tab (
JC
), 3mmx3mm 10-lead MLP (Note 2)
8
C/W
Lead Soldering Temperature (10 seconds)
260
C
Storage Temperature
-65
150
C
Junction Temperature
-40
150
C
Electrostatic Discharge (ESD) Protection Level (Note 3)
HBM
2.5
kV
CDM
0.2
Parameter
Min
Typ
Max
Unit
Supply Voltage Range
2.2
5.5
V
Output Current (V
IN
> 2.7V)
250
mA
Operating Ambient Temperature Range
-40
25
+85
C
4
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FAN5631/FAN5632 Rev. 1.0.0
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AN5631/F
AN5632 Regulated Step-Do
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Pump DC/DC Con
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Electrical Characteristics
V
IN
= 2.2V to 5.5V, I
OUT
= 1mA, C
IN
= 10F, C
OUT
= 10F, C
B
= 1F, T
A
= -40C to +85C, unless otherwise
noted. Typical values are at T
A
= 25C.
Notes:
4. The short circuit protection is designed to protect against pre-existing short circuit conditions, i.e. assembly shorts
that exist prior to device power-up. The short circuit current limit is 25mA
Average
. Short circuit currents in normal
operation are inherently limited by the ON-resistance of the internal FET. Since this resistance is in the range of 1
,
in some cases thermal shutdown may occur. However, immediately following the first thermal shutdown event, the
short circuit condition will be treated as pre-existing, and the load current will reduce to 25mA
Average
.
Parameter
Conditions
Min.
Typ.
Max.
Units
Input Under-Voltage Lockout
2
V
No Load Supply Current
No switching
60
A
Output Voltage
V
SEL
= High/V
SEL
= Low
1.5/1.2
V
Output Voltage Accuracy
1mA
I
OUT
150mA,
V
IN
= 2.7V to 5.5V
-5
+5
%
Load Regulation
0mA
I
OUT
150mA, V
IN
= 3.6V
0.25
mV/mA
Line Regulation
I
OUT
= 0.1mA
0.2
3
mV/V
Shutdown Supply Current
V
EN
= 0V
0.1
1
A
Output Short Circuit Current (Note 4)
V
OUT
150mV
25
mA
Peak Efficiency
90
%
V
IN
at Configuration Change
2.22xV
OUT
V
Oscillator Frequency
1.5
MHz
Thermal Shutdown Threshold
150
C
Thermal Shutdown Threshold Hysteresis
15
C
Enable Logic Input High Voltage, V
IH
1.3
V
Enable Logic Input Low Voltage, V
IL
0.4
V
Enable Logic Input Current
-1
1
A
V
SEL
Logic Input High Voltage, V
IH
1.3
V
V
SEL
Logic Input Low Voltage, V
IL
0.4
V
V
SEL
Logic Input Current
-1
1
A
V
OUT
Turn On Time
1.6
mS
5
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FAN5631/FAN5632 Rev. 1.0.0
F
AN5631/F
AN5632 Regulated Step-Do
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Typical Performance Characteristics
T
A
= 25C, V
OUT
= 1.5V, V
IN
= 3.6V, C
IN
= 10F, C
OUT
= 10F, C
B
= 1F, unless otherwise noted.
Load Regulation
Line Regulation
Efficiency vs. Load Current
Thermal Regulation
Lo
Load Regulation (mV/mA)
ad Current (mA)
2.5
3.0
3.5
4.0
4.5
5.0
5.5
1.40
1.45
1.50
1.55
1.60
Input Voltage(V)
Ou
tpu
t V
o
lt
ag
e
(V)
Ou
tpu
t V
o
lt
ag
e
(V)
Ou
tpu
t V
o
lt
ag
e
(V)
I
Load
= 50mA
T
A
= -40
C
T
A
= 85
C
T
A
= 25
C
2
2.5
3
3.5
4
4.5
5
5.5
Efficiency (%)
Input Voltage (V)
Input Voltage (V)
Efficiency (%)
Efficiency vs. Input Voltage
-2
-1.5
-1
-0.5
0
0.5
0
20
40
60
80
100
120
140
160
180
2.7V
3.2V
5.5V
2.2V
30
35
40
45
50
55
60
65
70
75
80
85
90
V
OUT
= 1.5V
V
SEL
= HIGH
I
LOAD
= 150mA
40
45
50
55
60
65
70
75
80
85
90
1
10
100
Load Current (mA)
Power Efficiency (%)
V
IN
= 3.3V
V
SEL
= HIGH
V
IN
= 4.2V
V
IN
= 2.7V
FAN5632 Efficiency Optimizer
Efficiency and Output Voltage vs. Input Voltage
50
60
70
80
90
100
2.5
3
3.5
4
4.5
5
5.5
1.2
1.3
1.4
1.5
I
LOAD
= 100mA, V
SEL
= LOW
1.50
1.51
1.52
1.53
1.54
-50
-25
0
25
50
75
100
125
150
Ambient Temperature (
C)
V
IN
= 3.6V
I
LOAD
= 1mA
3.6V
6
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FAN5631/FAN5632 Rev. 1.0.0
F
AN5631/F
AN5632 Regulated Step-Do
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Pump DC/DC Con
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Typical Performance Characteristics
T
A
= 25C, V
OUT
= 1.5V, V
IN
= 3.6V, C
IN
= 10F, C
OUT
= 10F, C
B
= 1F, unless otherwise noted.
Output Voltage Ripple Spectrum
Dynamic V
OUT
Change (FAN5631)
Voltage Ripple
V
OUT
V
IN
I
LOAD
= 150mA
Low
V
SEL
V
OUT
1.2V
(20
s/div)
1.2V
1.5V
Low
High
V
IN
= 3.6V
I
LOAD
= 150mA
Start Up
V
EN
V
OUT
I
IN
75mA
0mA
7
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FAN5631/FAN5632 Rev. 1.0.0
F
AN5631/F
AN5632 Regulated Step-Do
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Block Diagram
Figure 4. Block Diagram
Detailed Description
The FAN5631/FAN5632 switched capacitor DC/DC converter
automatically configures switches to achieve high efficiency and
provides a regulated output voltage by means of the Pulse Fre-
quency Modulation (PFM) pulse-skipping mode. An internal
soft-start circuit prevents excessive in-rush current drawn from
the supply. The switches are split into three segments. Based on
the values of V
IN
,
V
OUT
and I
OUT
, an internal circuitry deter-
mines the number of segments to be used to reduce current
spikes.
Step-Down Charge Pump Operation
When V
IN
2 V
OUT
/0.9, a 2:1 configuration, as shown in Fig.
5, is enabled. The factor 0.9 is used instead of 1 in order to
account for the effect of resistive losses across the switches and
to accommodate hysteresis in the voltage detector comparator.
Two phase non-overlapping clock signals are generated to drive
four switches. When switches 1 and 3 are ON, switches 2 and 4
are OFF and C
B
is charged. When switches 2 and 4 are ON,
switches 1 and 3 are OFF and charge is transferred from C
B
to
C
OUT
.
When V
IN
< 2
V
OUT
/0.9, a 1:1 configuration, as shown in Fig. 6
is enabled. In the 1:1 configuration switch 3 is always OFF and
switch 4 is always ON. At the 1.6V output setting the configura-
tion changes from 2:1 to 1:1 at V
IN
= 3.56V. At the 1.3V output
setting the change occurs at V
IN
= 3.06V.
Pulse-Skipping PFM and Fractional Switch
Operation
When the regulated output voltage reaches its upper limit, the
switches are turned off and the output voltage reaches its lower
limit. Considering a step-down 2:1 mode of operation, 1.6V out-
put as an example, when the output reaches about 1.62V
(upper limit), the control logic turns off all switches. Switching
stops completely. This is pulse-skipping mode. Since the supply
is isolated from the output, the output voltage will drop. Once
the output drops to about 1.58V (lower limit), the device will
return to regular switching mode with one quarter of each switch
turning on first. Another quarter of each switch will be turned on
if V
OUT
cannot reach regulation by the time of the third charge
cycle. Full switch operation occurs only during startup or under
heavy load condition, when a half switch operation cannot
achieve regulation within seven charge cycles.
Soft-Star
t
The soft-start feature limits in-rush current when the device is ini-
tially powered up and enabled. The reference voltage is used to
UVLO
+
-
SHUTDOWN
CONTROL
LOGIC
CONFIGURATION
PULSE_SKIP
SHORT_CKT.
+
-
+
-
+
-
THERMAL
SHUTDOWN
IN
OUT
Vref. RAMP
FB
OUTPUT
150mV
1V
0.5* INPUT
VOLTAGE
REF.
SOFT START
Vref. RAMP
OSCILLATOR
(2MHz)
C+
C-
ENABLE
VIN
GND.
D
R
I
V
E
R
S
0.25SW1 0.25SW1
0.25SW4 0.25SW4 0.5SW4
0.25SW3 0.25SW3 0.5SW3
0.5SW2
0.25SW2
0.25SW2
0.5SW1
FB
V
OUT
8
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FAN5631/FAN5632 Rev. 1.0.0
F
AN5631/F
AN5632 Regulated Step-Do
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Switch Configuration
Figure 5. Mode 2:1 Configuration
control the rate of the output voltage ramp-up to its final value.
Typical start-up time is 1ms. Since the rate of the output voltage
ramp-up is controlled by an internally generated slow ramp,
pulse-skipping occurs and in-rush current is automatically lim-
ited.
Shutdown, UVLO, Short Circuit Current Limit
and Thermal Shutdown
The device has an active-low shutdown pin to decrease supply
current to less than 1
A. In shutdown mode, the supply is dis-
connected from the output. UVLO triggers when supply voltage
drops below 2V. When the output voltage is lower than 150mV, a
short circuit protection is triggered. In this mode 15 out of 16
pulses during the switching will be skipped and the supply cur-
rent is limited. Thermal shutdown triggers at 150C.
Efficiency Optimizer (FAN5632)
For higher efficiency in the FAN5632, V
SEL
should be tied to
ground to enable the efficiency optimizer feature. To achieve an
optimized efficiency, the switch mode configuration transition
point is shifted from a 2:1 to a 1:1 mode until the output voltage
falls to 20% of its nominal value. For example, when the nominal
output voltage is 1.5V, the output voltage is allowed to drop to
1.2V. This will maintain a peak efficiency of 85% for the input
voltage range of 2.9V to 3.5V. For normal operation, V
SEL
should be tied high.
Figure 6. Mode 1:1 Configuration
Applications Information
The FAN5631/FAN5632 requires one ceramic bucket capacitor
in the 0.1F to 1F range; one 10F output bypass capacitor
and one 10F input bypass capacitor. To obtain optimum output
ripple and noise performance, use of low ESR (<0.05
) ceramic
input and output bypass capacitors is recommended. The X5R-
and X7R-rated capacitors provide adequate performance over
the -40C to 85C temperature range.
The bucket capacitor's value is dependent on load current
requirements. A 1F bucket capacitor will work well in all appli-
cations at all load currents, while a 0.1F capacitor will support
most applications under 100mA of load current. The choice of
bucket capacitor values should be verified in the actual applica-
tion at the lowest input voltage and highest load current. A 30%
margin of safety is recommended in order to account for the tol-
erance of the bucket capacitor and the variations in the on-resis-
tance of the internal switches.
One of the key benefits of the ScalarPumpTM architecture is that
the dynamically scaled on-resistance of the switches effectively
reduces the peak current in the bucket capacitor and therefore
input and output ripple currents are also reduced. Nevertheless,
due to the ESR of the input and output bypass capacitors, these
current spikes generate voltage spikes at the input and output
pins. However, these ESR spikes can be easily filtered because
their frequencies lie at up to 12 times the clock frequencies. In
S1
S3
S4
V
IN
GND
C+
VOUT
C-
C
OUT
C
B
S2
S1
S2
S3
S4
V
IN
GND
C+
VOUT
C-
C
OUT
C
B
This configuration shows the switches in the charging
This configuration shows the S1 and S2 swithces in phase 1 position.
phase position. For the pumping phase, reverse all
switch positions.
For phase 2, reverse the positions of the S1 and S2 switches.
The S3 switch is always OFF, and the S4 switch is always ON.
9
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FAN5631/FAN5632 Rev. 1.0.0
F
AN5631/F
AN5632 Regulated Step-Do
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applications where conductive and radiated EMI/RFI interfer-
ence has to be kept as low as possible, consider the use of
additional input and output filtering.
PCB Layout Considerations
While evaluating the FAN5631/FAN5632 (or any other switched
capacitor DC-DC converter) the user should be careful to keep
the power supply source impedance low; use of long wires
causing high lead inductances and resistive losses should be
avoided. A carefully laid out ground plane is essential because
current spikes are generated as the bucket capacitor is charged
and discharged. The input and output bypass capacitors should
be placed as close to the device pins as possible.
10
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FAN5631/FAN5632 Rev. 1.0.0
F
AN5631/F
AN5632 Regulated Step-Do
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Mechanical Dimensions
3x3mm 10-Lead MLP
2.10
3.0
3.0
3.30
1.30
(0.80)
0.50 TYP
0.30 TYP
10
1
5
6
1.70
RECOMMENDED LAND PATTERN
0.8 MAX
(0.20)
0.05
0.00
TOP VIEW
SIDE VIEW
SEATING PLANE
2.00
0.50
PIN #1 IDENT
0.65
0.45
2.10
2.00
1.30
1.20
Notes:
1. Conforms to JEDEC registration MO-229, variation weed-2, dated 11/2001
2. Dimensions are in millimeters
3. Dimensions and tolerances per ASME Y14.5M, 1994
1
10
6
0.18~0.30
5
MLP10A rev A
11
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FAN5631/FAN5632 Rev. 1.0.0
F
AN5631/F
AN5632 Regulated Step-Do
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Pump DC/DC Con
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DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY
ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT
CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
LIFE SUPPORT POLICY
FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Formative or
In Design
First Production
Full Production
Not In Production
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