ChipFind - документация

Электронный компонент: 1N5416

Скачать:  PDF   ZIP
1N5415 THRU 1N5420
GLASS PASSIVATED FAST SWITCHING RECTIFIER
Reverse Voltage - 50 to 600 Volts Forward Current - 3.0 Amperes
FEATURES
Glass passivated cavity-free junction
High temperature metallurgically bonded construction
Hermetically sealed package
Capable of meeting
environmental
standards of
MIL-S-19500
Fast switching for
high efficiency
High temperature soldering guaranteed:
350C/10 seconds, 0.375" (9.5mm) lead length,
5 lbs. (2.3kg) tension
MECHANICAL DATA
Case: Solid glass body
Terminals: Solder plated axial leads, solderable per
MIL-STD-750, Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.037 ounce, 1.04 grams
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25C ambient temperature unless otherwise specified.
SYMBOLS
1N5415
1N5416
1N5417
1N5418
1N5419
1N5420
UNITS
*Maximum repetitive peak reverse voltage
V
RRM
50
100
200
400
500
600
Volts
Maximum RMS voltage
V
RMS
35
70
140
280
350
420
Volts
*Maximum DC blocking voltage
V
DC
50
100
200
400
500
600
Volts
*Minimum reverse breakdown voltage at 50
A
V
BR
55
110
220
440
550
660
Volts
*Maximum average forward rectified current
0.375" (9.5mm) lead lengths atT
A
=55C
I
(AV)
3.0
Amps
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method) at T
A
=100C
I
FSM
80.0
Amps
Maximum instantaneous forward voltage at 3.0A*
1.10
9.0A
V
F
1.50
Volts
Maximum DC reverse current
*T
A
=25C 1.0
at rated DC blocking voltage
T
A
=100C
I
R
20.0
A
*T
A
=175C
2.0
*Maximum reverse recovery time
(NOTE 1)
t
rr
150
250
400
ns
*Maximum junction capacitance
(NOTE 2)
C
J
200
175
150
120
110
100
pF
Typical thermal resistance
(NOTE3)
R
JA
22.0
C/W
*Operating and storage temperature range
T
J
,T
STG
-65 to +175
C
NOTES:
(1) Reverse recovery test conditions: I
F
=0.5A, I
R
= 1.0A, Irr=0.25A
(2) Measured at 1.0 MH
Z
and applied reverse voltage of 12.0 Volts
(3) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead length, with both leads to heat sink
*JEDEC registered values
4/98
PA
TENTED*
0.180 (4.6)
0.115 (2.9)
0.042 (1.07)
0.038 (0.962)
DIA.
DIA.
MAX.
0.300 (7.6)
1.0 (25.4)
MIN.
1.0 (25.4)
MIN.
Case Style G4
Dimensions in inches and (millimeters)
*
Brazed-lead assembly is covered by Patent No. 3,930,306
0
25
50
75
100
125
150
175
200
0
1.0
2.0
3.0
4.0
1
10
100
10
100
200
1
10
100
10
100
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0.01
0.1
1
10
50
0
20
40
60
80
100
0.01
0.1
1
10
30
RATINGS AND CHARACTERISTIC CURVES 1N5415 THRU 1N5420
FIG. 1 - FORWARD CURRENT DERATING CURVE
FIG. 3 - TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS
RESISTIVE OR
INDUCTIVE LOAD
T
J
=25
C
PULSE WIDTH=300
s
1%DUTY CYCLE
AMBIENT TEMPERATURE,
C
NUMBER OF CYCLES AT 60 Hz
INSTANTANEOUS FORWARD VOLTAGE,
VOLTS
AVERAGE FORWARD CURRENT,
AMPERES
FIG. 2 - MAXIMUM NON-REPETITIVE PEAK
FORWARD SURGE CURRENT
PEAK FORWARD
SURGE
CURRENT,
AMPERES
INSTANTANEOUS FORWARD CURRENT,
AMPERES
L=0.375" (9.5mm)
0.8 x 0.8 x .040"
(20 x 20 x 1mm) COPPER
HEATSINKS
T
A
=100
C
8.3ms SINGLE HALF-WAVE
SINE-WAVE (JEDEC Method)
REVERSE VOLTAGE, VOLTS
FIG. 5 - TYPICAL JUNCTION CAPACITANCE
JUNCTION
CAPACITANCE, pF
PERCENT OF RATED PEAK REVERSE
VOLTAGE, %
FIG. 4 -TYPICAL REVERSE CHARACTERISTICS
T
J
=25
C
T
J
=75
C
T
J
=125
C
T
J
=150
C
T
J
=25
C
f=1.0 MHz
Vsig=50mVp-p
AVERAGE
REVERSE
CURRENT,
MICROAMPERES