1N5624GP thru 1N5627GP
Vishay Semiconductors
formerly General Semiconductor
Document Number 88524
www.vishay.com
11-Feb-02
1
Glass Passivated Junction Rectifiers
Rev. Voltage 200 to 800V
Forward Current 3.0A
Maximum Ratings & Thermal Characteristics
Ratings at 25C ambient temperature unless otherwise specified.
Parameter
Symbol
1N5624
1N5625
1N5626
1N5627
Unit
*Maximum repetitive peak reverse voltage
V
RRM
200
400
600
800
V
*Maximum DC blocking voltage
V
DC
200
400
600
800
V
*Maximum average forward rectified current
0.375" (9.5mm) lead length at T
A
= 70C
I
F(AV)
3.0
A
*Peak forward surge current 8.3ms single half sine-wave
superimposed on rated load (JEDEC Method)
I
FSM
125
A
Maximum full load reverse current, full cycle average,
0.375" (9.5mm) lead length at T
A
= 70C
I
R(AV)
200
A
Typical thermal resistance
(1)
R
JA
20
C/W
Operating junction and storage temperature range
T
J,
T
STG
65 to +175
C
Electrical Characteristics
Ratings at 25C ambient temperature unless otherwise specified.
*Maximum instantaneous
T
A
= 25C
V
F
1.0
V
forward voltage at 3.0A
T
A
= 70C
0.95
Maximum reverse current
T
A
= 25C
5.0
at rated DC blocking voltage
T
A
= 150C
I
R
300
200
A
Typical reverse recovery time at
t
rr
3.0
s
I
F
= 0.5A, I
R
= 1.0A, I
rr
= 0.25A
Typical junction capacitance at 4.0V, 1MHz
C
J
40
pF
Note: (1) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead length, P.C.B. mounted
*JEDEC registered values
Patented*
0.210 (5.3)
0.190 (4.8)
Dia.
0.052 (1.32)
0.048 (1.22)
Dia.
1.0 (25.4)
Min.
0.375 (9.5)
0.285 (7.2)
1.0 (25.4)
Min.
DO-201AD
Features
Plastic package has Underwriters Laboratories
Flammability Classification 94V-0
High temperature metallurgically bonded construction
Cavity-free glass passivated junction
Capable of meeting environmental standards of
MIL-S-19500
3.0 Ampere operation at T
A
=70C with no thermal runaway
Typical I
R
less than 0.1
A
High temperature soldering guaranteed: 350C/10 seconds,
0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension
Mechanical Data
Case: JEDEC DO-201AD, molded plastic over glass body
Terminals: Plated axial leads, solderable per
MIL-STD-750, Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.04 oz., 1.12 g
Dimensions in inches
and (millimeters)
*
Glass-plastic encapsulation
technique is covered by
Patent No. 3,996,602 and
brazed-lead assembly
by Patent No. 3,930,306
1N5624GP thru 1N5627GP
Vishay Semiconductors
formerly General Semiconductor
www.vishay.com
Document Number 88524
2
11-Feb-02
200
100
10
1
100
10
A
verage Forward Current (A)
Number of Cycles at 60 H
Z
0
25
0
50
75
100
125
150
175
A
verage Forward Rectified Current (A)
Ambient Temperature (
C)
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
Fig. 3 Typical Instantaneous
Forward Characteristics
0
20
60
40
100
80
Fig. 4 Typical Reverse Characteristics
Instantaneous Reverse Current (
A)
Percent of Rated Peak Reverse Voltage (%)
4.0
3.0
1.0
2.0
0.1
10
100
1
Instantaneous Forward Current (A)
T
J
= 25
C
Reverse Voltage (V)
Junction Capacitance (pF)
1
10
100
100
10
0.01
0.1
1
10
Fig. 5 Typical Junction Capacitance
T
J
= 25
C
f = 1.0MH
Z
Vsig = 50mVp-p
g
Derating Curve
g
Forward Surge Current
Instantaneous Forward Voltage (V)
T
J
= T
J max
8.3ms Single Half Sine-Wave
(JEDEC Method)
Pulse Width = 300
s
1% Duty Cycle
T
J
= 25
C
60 H
Z
Resistive or Inductive Load
T
J
= 75
C
T
J
= 125
C
0.375" (9.5mm) Lead Length
Ratings and
Characteristic Curves
(T
A
= 25C unless otherwise noted)
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