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Электронный компонент: S1M

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S1A THRU S1M
SURFACE MOUNT RECTIFIER
Reverse Voltage - 50 to 1000 Volts Forward Current - 1.0 Ampere
FEATURES
Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
For surface mounted applications
Low profile package
Built-in strain relief, ideal for
automated placement
Glass passivated chip junction
High temperature soldering:
250C/10 seconds at terminals
MECHANICAL DATA
Case: JEDEC DO-214AC molded plastic over
passivated chip
Terminals: Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode end
Weight: 0.002 ounce, 0.064 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25C ambient temperature unless otherwise specified.
SYMBOLS
S1A
S1B
S1D
S1G
S1J
S!K
S1M
UNITS
Device marking code
SA
SB
SD
SG
SJ
SK
SM
Maximum recurrent peak reverse voltage
V
RRM
50
100
200
400
600
800
1000
Volts
Maximum RMS voltage
V
RMS
35
70
140
280
420
560
700
Volts
Maximum DC blocking voltage
VDC
50
100
200
400
600
800
1000
Volts
Maximum average forward rectified current
See Figure 1
I
(AV)
1.0
Amp
Peak forward surge current
8.3ms single half sine-wave superimposed on
I
FSM
40.0
30.0
Amps
rated load (JEDEC Method) T
L
=110C
Maximum instantaneous forward voltage at 1.0A
V
F
1.10
Volts
Maximum DC reverse current
T
A
=25C
1.0
5.0
at Rated DC blocking voltage
T
A
=125C
I
R
50.0
A
Typical reverse recovery time
(NOTE 1)
t
rr
1.8
s
Typical junction capacitance
(NOTE 2)
C
J
12.0
pF
Typical thermal resistance
(NOTE 3)
R
JA
75.0
85.0
R
JL
27.0
30.0
C/W
Operating junction and storage temperature range
T
J
, T
STG
-55 to +150
C
NOTES:
(1) Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
(2) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to ambient and from junction to lead mounted on
0.2 x 0.2" (5.0 x 5.0mm) copper pad areas
4/98
DO-214AC
0.157 (3.99)
0.177 (4.50)
0.006 (0.152)
0.012 (0.305)
0.030 (0.76)
0.060 (1.52)
0.008 (0.203) MAX.
0.194 (4.93)
0.208 (5.28)
0.100 (2.54)
0.110 (2.79)
0.078 (1.98)
0.090 (2.29)
0.049 (1.25)
0.065 (1.65)
Dimensions are in inches and (millimeters)
0
20
40
60
80
100
120
140
160
0
0.2
0.4
0.6
0.8
1.0
1.2
1
10
100
1
10
100
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0.01
0.1
1
10
100
0.01
0.1
1
10
100
1
10
100
0.01
0.1
1
10
100
1
10
100
1,000
0
20
40
60
80
100
0.001
0.01
0.1
1
10
100
RATING AND CHARACTERISTIC CURVES S1A THRU S1M
FIG. 1 - FORWARD CURRENT DERATING CURVE
LEAD TEMPERATURE, C
A
VERA
GE FOR
W
ARD CURRENT
,
AMPERES
FIG. 2 - MAXIMUM NON-REPETITIVE PEAK
FORWARD SURGE CURRENT
NUMBER OF CYCLES AT 60 H
Z
PEAK FOR
W
ARD SURGE CURRENT
,
AMPERES
FIG. 3 - TYPICAL INSTANTANEOUS FORWARD
CHARACTERISTICS
FIG. 4 - TYPICAL REVERSE CHARACTERISTICS
INST
ANT
ANEOUS FOR
W
ARD CURRENT
,
AMPERES
INST
ANT
ANEOUS REVERSE CURRENT
,
MICR
O
AMPERES
INSTANTANEOUS FORWARD VOLTAGE, VOLTS
FIG. 5 - TYPICAL JUNCTION CAPACITANCE
JUNCTION CAP
A
CIT
ANCE, pF
REVERSE VOLTAGE, VOLTS
TL=110
C
8.3ms SINGLE HALF SINE-WAVE
(JEDEC Method)
T
J
=25C
T
J
=25C
S1(K,M)
S1(A-J)
PULSE WIDTH=300
s
1% DUTY CYCLE
T
J
=25C
f=1.0 MH
Z
Vsig=50mVp-p
T
J
=125C
0.2 x 0.2" (5.0 x 5.0mm)
THICK COPPER PAD AREAS
RESISTIVE OR INDUCTIVE LOAD
PERCENT OF RATED PEAK REVERSE
VOLTAGE, %
T
J
=75C
FIG. 6 - TRANSIENT THERMAL IMPEDANCE
TRANSIENT THERMAL IMPED
ANCE, C/W
t, PULSE DURATION,
UNITS MOUNTED on
0.20 x 0.20" (5.0 x 5.0mm) x 0.5 mil.
INCHES (0.013mm)
THICK COPPER LAND AREAS
S1(K,M)
S1(A-J)
S1(K,M)
S1(A-J)