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Электронный компонент: G2996F1UF

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Ver: 2.3
May 16, 2006
TEL:
886-3-5788833
http://www.gmt.com.tw
1
G2996
Global Mixed-mode Technology Inc.
DDR I/II Termination Regulator
Features
Operation Supply Voltage: 1.6V to 5.5V
Low Supply Current: 280
A @ 2.5V
Low Output Offset
Source and Sink Current
Low External Component Count
No Inductor Required
No external Resistors Required
Thermal Shutdown Protection
Suspend to RAM (STR) function
SOP-8 with Power-Pad package
Applications
DDR-SDRAM Termination Voltage
DDR-I / DDR-II Termination Voltage
SSTL-2
SSTL-3
General Description
The G2996 is a linear regulator designed to meet the
JEDEC SSTL-18 ,SSTL-2 and SSTL-3 (Series Stub
Termination Logic) specifications for termination of
DDR-SDRAM. It contains a high-speed operational
amplifier that provides excellent response to the load
transients. This device can deliver 1.5A/0.9A continu-
ous current and transient peaks up to 3A/1.8A in the
application as required for DDRI/II-SDRAM termination.
With an independent V
SENSE
pin, the G2996 can pro-
vide superior load regulation. The G2996 provides a
V
REF
output as the reference for the applications of the
chipset and DIMMs.
The G2996 can easily provide the accurate V
TT
and
V
REF
voltages without external resistors that PCB ar-
eas can be reduced. The quiescent current is as low
as 280
A @ 2.5V. So the power consumption can
meet the low power consumption applications.
The G2996 also has an active low shutdown (
SD ) pin
that provides Suspend to RAM (STR) functionality.
When SD is pulled low, the V
TT
output will be tri-state
providing a high impendence, but V
REF
will remain ac-
tive. A power saving advantage can be obtained in this
mode through lowering the quiescent current to180
A
@ 2.5V.
Ordering Information
ORDER
NUMBER
ORDER
NUMBER
(Pb free)
MARKING
TEMP.
RANGE
PACKAGE
G2996P1U G2996P1Uf G2996 -40
C to 85
C SOP-8
G2996F1U G2996F1Uf G2996 -40
C to 85
C SOP-8
(FD)
Note: P1:SOP-8 F1:SOP-8(FD)
U: Tape & Reel (FD): Thermal Pad
Pin Configuration
Typical Application Circuit
VSENSE
8
6
5
1
2
3
4
SD
GND
VTT
PVIN
AVIN
VDDQ
SOP-8
G2996
7
VREF
Thermal
Pad
+
+
+
SD
V
REF
V
DDQ
AV
IN
V
SENSE
PV
IN
V
TT
GND
V
TT
=1.25V
V
REF
=1.25V
V
DDQ
=2.5V
V
DD
=2.5V
SD
47
F
220
F
0.01
F
VSENSE
8
6
5
1
2
3
4
SD
GND
VTT
PVIN
AVIN
VDDQ
SOP-8
G2996
7
VREF
Thermal
Pad
+
+
+
SD
V
REF
V
DDQ
AV
IN
V
SENSE
PV
IN
V
TT
GND
V
TT
=1.25V
V
REF
=1.25V
V
DDQ
=2.5V
V
DD
=2.5V
SD
47
F
220
F
0.01
F
Ver: 2.3
May 16, 2006
TEL:
886-3-5788833
http://www.gmt.com.tw
2
G2996
Global Mixed-mode Technology Inc.
Absolute Maximum Ratings
(1)
Supply Voltage
PVIN, AVIN, VDDQ to GND . . . . . . . . . . . -0.3V to +6V
Operating Ambient Temperature Range
T
A
. . . . . . . . . . . . . . . . . . . . . . . . . . . .-40
C to +125
C
Maximum Junction Temperature, T
J
. . . . . . . . ..150
C
Storage Temperature Range, T
STG
. . -65
C to+150
C
Reflow Temperature (soldering, 10 sec) . . . . . .260
C
Electrostatic Discharge, V
ESD
Human body mode . . . . . . . . . . . . . . . . . . . . .2000V
(2)
Thermal Resistance Junction to Ambient, (
JA
)
SOP-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .130
C/W
SOP-8 (FD) . . . . . . . . . . . . . . . . . . . . . . . . 110
C/W
(3)
SOP-8 (FD) . . . . . . . . . . . . . . . . . . . . . . . . . 50
C/W
(4)
SOP-8 (FD) . . . . . . . . . . . . . . . . . . . . . . . . . 41
C/W
(5)
Thermal Resistance Junction to Case, (
JC
)
SOP-8 (FD) . . . . . . . . . . . . . . . . . . . . . . . . . ..12
C/W
Recommend Operation Range
Operating Ambient Temperature Range
T
A
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40
C to +85
C
AVIN to GND . . . . . . . . . . . . . . . . . . . . . 1.6V to +5.5V
PVIN, SD, VDDQ to GND . . . . . . . . . . . . 1.6V to AVIN
Note:
(1)
: Absolute maximum rating indicates limits beyond which damage to the device may occurs.
(2)
: Human body model : C = 100pF, R = 1500
, 3 positive pulses plus 3 negative pulses
(3)
: The package is placed on a 2-layer PCB (1oz/1oz) with minimum footprint.
(4)
: The package is placed on a 2-layer PCB (2oz/2oz) with 6 vias. Please refer the evaluation board manual (EV2996-10) for pcb layout.
(5)
: The package is placed on a 2-layer PCB (2oz/2oz) with 6 vias. The airflow is used. Please refer the evaluation board manual
(EV2996-10) for pcb layout.

Electrical
Characteristics
Specifications with standard typeface are for T
A
=25
C. unless otherwise specified, AVIN=PVIN=2.5V,
VDDQ=2.5V for DDR I, AVIN=PVIN=VDDQ=1.8V for DDRII.
PARAMETER SYMBOL
CONDITION
MIN
TYP
MAX
UNIT
V
REF
Voltage
V
REF
VDDQ=1.7V
VDDQ=1.8V
VDDQ=1.9V
0.810
0.860
0.910
0.849
0.898
0.949
0.890
0.940
0.990
V
V
V
V
REF
Voltage
V
REF
VDDQ=2.3V
VDDQ=2.5V
VDDQ=2.7V
1.11
1.21
1.31
1.145
1.245
1.345
1.19
1.29
1.39
V
V
V
V
REF
Output impendence
Z
REF
I
REF
=-30
A to + 30
A
--- 1.15 --- k
V
TT
Output voltage
V
TT
I
OUT
=0A
VDDQ=1.7V
VDDQ=1.8V
VDDQ=1.9V
I
OUT
=
0.9A
VDDQ=1.7V
VDDQ=1.8V
VDDQ=1.9V
0.810
0.860
0.910
0.810
0.860
0.910
0.847
0.896
0.947
0.847
0.896
0.947
0.890
0.940
0.990
0.890
0.940
0.990
V
V
V
V
V
V
V
TT
Output voltage
V
TT
I
OUT
=0A
VDDQ=2.3V
VDDQ=2.5V
VDDQ=2.7V
I
OUT
=
1.5A
VDDQ=2.3V
VDDQ=2.5V
VDDQ=2.7V
1.11
1.21
1.31
1.11
1.21
1.31
1.152
1.252
1.352
1.152
1.252
1.352
1.19
1.29
1.39
1.19
1.29
1.39
V
V
V
V
V
V

Ver: 2.3
May 16, 2006
TEL:
886-3-5788833
http://www.gmt.com.tw
3
G2996
Global Mixed-mode Technology Inc.
Electrical
Characteristics
Specifications with standard typeface are for T
A
=25
C. unless otherwise specified, AVIN=PVIN=2.5V,
VDDQ=2.5V for DDR I, AVIN=PVIN=VDDQ=1.8V for DDRII.
PARAMETER SYMBOL
CONDITION
MIN
TYP
MAX
UNIT
V
TT
Output Voltage Offset (V
REF-
V
TT
)
V
os
Vtt
I
OUT
=0A
I
OUT
=-0.9A
I
OUT
=+0.9A
-40
-40
-40
0
0
0
40
40
40
mV
mV
mV
V
TT
Output Voltage Offset (V
REF-
V
TT
)
V
os
Vtt
I
OUT
=0A
I
OUT
=-1.5A
I
OUT
=+1.5A
-40
-40
-40
0
0
0
40
40
40
mV
mV
mV
Quiescent Current
I
Q
I
OUT
=0A ---
280
500
A
VDDQ input Impedence
Z
VDDQ
--- 100 --- k
Quiescent Current in shutdown
I
SD
SD
=0 ---
180
300
A
Shutdown leakage current
I
Q_SD
---
0.01
---
A
V
SENSE
input current
I
SENSE
---
20
---
nA
V
TT
leakage current in shutdown
I
V
SD
=0, V
TT
=1.25V
---
0.01 ---
A
Minimum Shutdown High Level
V
IH
1.6 --- --- V
Maximum Shutdown Low Level
V
IL
--- --- 0.8 V
Thermal Shutdown
T
SD
--- 150 ---
C
Thermal Shutdown Hystersis
T
Hsy
--- 25 ---
C
Ver: 2.3
May 16, 2006
TEL:
886-3-5788833
http://www.gmt.com.tw
4
G2996
Global Mixed-mode Technology Inc.
Typical Performance Characteristics
AV
IN
=2.5V, P
VIN
=2.5V, V
DDQ
=2.5V, C
AVIN
=0.1
F/Ceramic X7R/0603/6.3V/TDK, C
PVIN
=68
F/6.3V POSCAP Se-
ries/SANYO, C
VTT
=330
F*2/6.3V POSCAP Series/SANYO, T
A
=25
C, unless otherwise noted.
I
Load
=0.5A Transient (Sinking)
I
Load
=0.5A Transient (Sourcing)
I
Load
=1A Transient (Sinking)
I
Load
=1A Transient (Sourcing)
I
Load
=1.5A Transient (Sinking)
I
Load
=1.5A Transient (Sourcing)
Ver: 2.3
May 16, 2006
TEL:
886-3-5788833
http://www.gmt.com.tw
5
G2996
Global Mixed-mode Technology Inc.
Typical Performance Characteristics
AV
IN
=2.5V, P
VIN
=2.5V, V
DDQ
=2.5V, C
AVIN
=0.1
F, C
PVIN
=47
F, C
VREF
=0.01
F, V
SD
=2.5V, C
VTT
=220
F, T
A
=25
C,
unless otherwise noted.
I
O
=200m
I
Q
vs AV
IN
in SD
100
110
120
130
140
150
160
2
2.5
3
3.5
4
4.5
5
5.5
AV
IN
(V)
I
Q
(
A)
I
Q
vs AV
IN
150
170
190
210
230
250
270
2
2.5
3
3.5
4
4.5
5
5.5
AV
IN
(V)
I
Q
(
A)
V
IH
and V
IL
0.8
1
1.2
1.4
1.6
1.8
2
2
2.5
3
3.5
4
4.5
5
5.5
AV
IN
(V)
V
SD
(V)
V
REF
vs I
REF
1.18
1.2
1.22
1.24
1.26
1.28
1.3
-30
-20
-10
0
10
20
30
I
REF
(
A)
V
RE
F
(V
)
V
REF
vs V
DDQ
0
0.5
1
1.5
2
2.5
3
2
2.5
3
3.5
4
4.5
5
5.5
V
DDQ
(V)
V
RE
F
(V
)
V
TT
vs I
OUT
Temperature
1.232
1.236
1.24
1.244
1.248
1.252
-100
-75
-50
-25
0
25
50
75
100
I
OUT
(mA)
V
TT
(V)
25
C
85
C
0
C
V
IH
V
IL