5.0 mm DIA LED LAMP
PACKAGE DIMENSIONS
DRAWING NO. : DS-35-04-XXXX
DATE : 2005-02-18
Page :
1
HD-R/RD013
Note:
1.All Dimensions are in millimeters.
2.Tolerance is 0.25mm(0.010 ")
Unless otherwise specified.
3.Protruded resin under flange
is 1.5mm(0.059 ") max.
4.Lead spacing is measured where
the leads emerge from the package.
5.Specification are subject to change
without notice
520HR3C-F2
5.0 mm DIA LED LAMP
FEATURES
* 5.0 mm DIA LED LAMP
* HIGH LUMINOUS INTENSITY OUTPUT.
* LOW POWER CONSUMPTION.
* HIGH EFFICIENCY.
* VERSATILE MOUNTING ON P.C. BOARD OR PANEL.
* I.C. COMPATIBLE.
* Pb FREE PRODUCTS
CHIP MATERIALS
* Dice Material : GaAlInP/GaAs
* Light Color : ULTRA RED
* Lens Color : WATER CLEAR
ABSOLUTE MAXIMUM RATING : ( Ta = 25C )
SYMBOL PARAMETER ULTRA
RED
UNIT
P
AD
Power Dissipation Per Chip
80
mW
V
R
Reverse Voltage Per Chip
5
V
I
AF
Continuous Forward Current Per Chip
30
mA
I
PF
Peak Forward Current Per Chip (Duty0.1,1KHz)
60 mA
Derating Linear From 25C Per Chip
0.40
mA/C
Topr Operating
Temperature
Range
-25C to 85C
Tstg Storage
Temperature
Range
-40C to 85C
Lead Soldering Temperature1.6mm(0.063 inch) From Body260C 5C for 5 Seconds
ELECTRO-OPTICAL CHARACTERISTICS : ( Ta = 25C )
SYMBOL PARAMETER TEST
CONDITION
MIN. TYP. MAX. UNIT
V
F
Forward
Voltage
I
F
= 20mA
2.0
2.6
V
I
R
Reverse
Current
V
R
= 5V
100
A
D
Dominant
Wavelength
I
F
= 20mA
633
nm
Spectral Line Half-Width
I
F
= 20mA
20
nm
21/2
Half Intensity Angle
I
F
= 20mA
20 deg
I
V
Luminous
Intensity
I
F
= 20mA
2500
mcd
FBLK
IC Flicker Frequency
1.30
1.60 1.90
Hz
VDD Operating
Voltage
Vdd=5Vdc
2 5
15
V
DRAWING NO. : DS-35-04-XXXX
DATE : 2005-02-18
Page :
2
HD-R/RD014
520HR3C-F2
5.0 mm DIA LED LAMP
DRAWING NO. : DS-35-04-XXXX
DATE : 2005-02-18
Page :
3
520HR3C-F2
5.0 mm DIA LED LAMP
SOLDERING
METHOD SOLDERING
CONDITIONS
REMARK
DIP
SOLDERING
Bath temperature: 2605
Immersion time: with 5 sec
Solder no closer than 3mm from the
base of the package
Using soldering flux," RESIN FLUX"
is recommended.
SOLDERING
IRON
Soldering iron: 30W or smaller
Temperature at tip of iron: 260 or lower
Soldering time: within 5 sec.
During soldering, take care not to
press the tip of iron against the
lead.
(To prevent heat from being
transferred directly to the lead, hold
the lead with a pair of tweezers
while soldering
1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1),
be careful not to stress the leads with iron tip.
2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package.
Regarding solution in the tinning oven for product-tinning, compound sub-solution made of tin &
copper and sliver is proposed with the temperature of Celsius 260. The proportion of the
alloyed solution is tin 95.5: copper 3.5: silver 0.5 by percentage. The time of tinning is constantly 3
seconds.
DRAWING NO. : DS-35-04-XXXX
DATE : 2005-02-18
Page :
4
P a n e l
(Fig.1)
L e a d w r i e s
L e a v e a s l i g h t
c l e a r a n c e
L e a d w r i e s
( F i g . 2 )
520HR3C-F2
5.0 mm DIA LED LAMP
3) Similarly, when a jig is used to solder the LED to PC board, take care as much as possible to
avoid steering the leads (See Fig.3).
4) Repositioning after soldering should be avoided as much as possible. If inevitable, be sure to
preserve the soldering conditions with irons stated above: select a best-suited method that
assures the least stress to the LED.
5) Lead cutting after soldering should be performed only after the LED temperature has returned to
normal temperature.
LED MOUNTING METHOD
1) When mounting the LED by using a case, as shown Fig.4, ensure that the mounting holds on
the PC board match the pitch of the leads correctly-tolerance of dimensions of the respective
components including the LED should be taken into account especially when designing the
case, PC board, etc. to prevent pitch misalignment between the leads and board holes, the
diameter of the board holes should be slightly larger than the size of the lead. Alternatively, the
shape of the holes should be made oval. (See Fig.4)
DRAWING NO. : DS-35-04-XXXX
DATE : 2005-02-18
Page :
5
P C b o a r d
ig.3
F
jig
Fig.4
case
pc board
520HR3C-F2
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