HIGH TECH
CHIPS, INC.
01/03/00
1
GENERAL PURPOSE PWM
1.0 General description.
HTC852 is a general-purpose PWM controller with fixed
output frequency of 31250Hz. It requires minimum number
of external components and provides wide range of power
control ( 32 possible settings).
It's very easy to use and provides general DC power control
solution in wide range of applications. Output pulse width is
determined by input voltage value on D[0:4].
Refer to Output Period selection table.
Features
Low power consumption.
Single chip solution.
High output frequency of 31250Hz.
Sleep mode of operation with power consumption in range of uA.
2.0 Applications.
DC motor controllers including model airplanes and electric cars.
LED and LED display brightness control.
Instrumental panel illumination control.
Typical connection diagram.
PDIP, SOIC
1
8
2
7
3
6
4
5
HTC852
VDD GND
PWMOUT D0
D4 D1
D3 D2
HIGH TECH
CHIPS, INC.
01/03/00
2
With this application we can control brightness of super bright LED by changing dip switch settings.
We can have thirty-two different brightness settings. See output period selection table for dip switch
settings. Please note that if only some settings of DIP switch is used, then connect D [0:4] unused
pins directly to ground or VDD. C1 is used as de-coupling capacitor and it is not required for HTC852
operation. Setting DIP switch to all on position will set highest brightness of LED and part will enter
into SLEEP mode to preserve power. Setting DIP switch to all off position will turn off LED and part
will enter into SLEEP mode to preserve power. In SLEEP mode power consumption of HTC852 is in
micro amp range and that allows us power it directly from battery without power switch. Note that
HTC852 is monitoring its D[0:4] inputs constantly. Any change of input will be reflected on output
setting in about 32uS.
3.0 Pin out description.
Abbreviations used: O - output, I - input, P - power.
Pin number Name
I / O Description
Notes
1
VDD
P
Power
+2.5V to + 5.5V.
2
PWMOUT
O
Clock Output
Output frequency.
3
D4
I
Period selector input(MSB).
Tie to GND or VDD.
4
D3
I
Period selector input.
Tie to GND or VDD.
5
D2
I
Period selector input.
Tie to GND or VDD.
6
D1
I
Period selector input.
Tie to GND or VDD.
7
D0
I
Period selector input (LSB).
Tie to GND or VDD.
8
GND
P
Ground
Connect to ground.
Output Period Selection.
Abbreviations used: 0 connection to GND, 1 connection to
VDD.
D4
D3
D2
D1
D0
PWMOUT high pulse period
0
0
0
0
0
Output is set to low and part is in
sleep mode. Wakes up at D[0:4]
change.
0
0
0
0
1
1uS
0
0
0
1
0
2uS
0
0
0
1
1
3uS
0
0
1
0
0
4uS
0
0
1
0
1
5uS
0
0
1
1
0
6uS
0
0
1
1
1
7uS
0
1
0
0
0
8uS
0
1
0
0
1
9uS
0
1
0
1
0
10uS
0
1
0
1
1
11uS
HIGH TECH
CHIPS, INC.
01/03/00
3
0
1
1
0
0
12uS
0
1
1
0
1
13uS
0
1
1
1
0
14uS
0
1
1
1
1
15uS
1
0
0
0
0
16uS
1
0
0
0
1
17uS
1
0
0
1
0
18uS
1
0
0
1
1
19uS
1
0
1
0
0
20uS
1
0
1
0
1
21uS
1
0
1
1
0
22uS
1
0
1
1
1
23uS
1
1
0
0
0
24uS
1
1
0
0
1
25uS
1
1
0
1
0
26uS
1
1
0
1
1
27uS
1
1
1
0
0
28uS
1
1
1
0
1
29uS
1
1
1
1
0
30uS
1
1
1
1
1
Output is set high and part is in
sleep mode. Wakes up at D[0:4]
change.
Notes:
Output periods specified in this table are about 1% accurate at room temperature and about
10% accurate in temperature range.
4.0 Electrical characteristics.
Voltage on VDD pin in respect to GND
+2.5 to +5.5V
Current consumption with no load attached
3 mA
1
In active mode.
Current consumption with no load attached
7 uA
1
In sleep mode.
PWMOUT
output low voltage (5mA load)
0.4V
1
PWMOUT
output low voltage (25mA load)
0.75V
1
PWMOUT
output high voltage (5mA source)
VDD-0.7V
1
PWMOUT
output source current max
25mA
1
PWMOUT
output sink current max
25mA
1
NOTES:
1. Those values are characterized but not tested.
HIGH TECH
CHIPS, INC.
01/03/00
4
5.0 Ordering information.
H
T
C
8
5
2
X
X
OPTIONAL: Temperature range:
C = 0
o
C to +70
o
C , I = - 40
o
C to + 85
o
C.
PACKAGE:
S 208 mil SOIC
D 300 mil PDIP.
PART NUMBER.
HIGH TECH
CHIPS, INC.
01/03/00
5
6.0 Mechanical information.
8-Lead Plastic Dual In-line (P) 300 mil (PDIP)
Units
INCHES*
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
n
8
8
Pitch
p
.100
2.54
Top to Seating Plane
A
.140
.155
.170
3.56
3.94
4.32
Molded Package Thickness
A2
.115
.130
.145
2.92
3.30
3.68
Base to Seating Plane
A1
.015
0.38
Shoulder to Shoulder Width
E
.300
.313
.325
7.62
7.94
8.26
Molded Package Width
E1
.240
.250
.260
6.10
6.35
6.60
Overall Length
D
.360
.373
.385
9.14
9.46
9.78
Tip to Seating Plane
L
.125
.130
.135
3.18
3.30
3.43
Lead Thickness
c
.008
.012
.015
0.20
0.29
0.38
Upper Lead Width
B1
.045
.058
.070
1.14
1.46
1.78
Lower Lead Width
B
.014
.018
.022
0.36
0.46
0.56
Overall Row Spacing
eB
.310
.370
.430
7.87
9.40
10.92
Mold Draft Angle Top
5
10
15
5
10
15
Mold Draft Angle Bottom
5
10
15
5
10
15
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash protrusions. Mold flash or protrusions shell
not exceed .010" (0.254mm)per side.
JEDEC Equivalent:MS-001
8-Lead Plastic Small Outline (SM) Medium, 208 mil (SOIC)
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