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Электронный компонент: 2SD2423

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2SD2423
Silicon NPN Epitaxial, Darlington
Application
Low frequency power amplifier
Features
The transistor with a built-in zener diode of surge absorb.
Outline
UPAK
1. Base
2. Collector
3. Emitter
4. Collector (Flange)
4
1
2
3
2 k
(Typ)
0.5
(Typ)
I
D
1
2, 4
3
2SD2423
2
Absolute Maximum Ratings (Ta = 25C)
Item
Symbol
Ratings
Unit
Collector to base voltage
V
CBO
50
V
Collector to emitter voltage
V
CEO
50
V
Emitter to base voltage
V
EBO
7
V
Collector current
I
C
1.5
A
Collector power dissipation
P
C
*
1
1
W
Junction temperature
Tj
150
C
Storage temperature
Tstg
55 to +150
C
Collector to emitter diode forward current
I
D
1.5
A
Note:
1. When using the ceramic board 0.7 mm thick (12.5 mm x 20 mm).
Electrical Characteristics (Ta = 25C)
Item
Symbol
Min
Typ
Max
Unit
Test conditions
Collector to base breakdown
voltage
V
(BR)CBO
50
--
70
V
I
C
= 100
A, I
E
= 0
Collector to emitter breakdown
voltage
V
(BR)CEO
50
--
--
V
I
C
= 10 mA, R
BE
=
Collector to emitter sustaining
voltage
V
CEO(sus)
50
--
70
V
I
C
= 1.5 A, R
BE
=
,
L = 10 mH*
1
Emitter to base breakdown
voltage
V
(BR)EBO
7
--
--
V
I
E
= 50 mA, I
C
= 0
Collector cutoff current
I
CEO
--
--
10
A
V
CE
= 40 V, R
BE
=
DC current transfer ratio
h
FE
2000
--
10000
V
CE
= 3 V, I
C
= 1 A*
1
Collector to emitter saturation
voltage
V
CE(sat)1
--
--
1.5
V
I
C
= 1 A, I
B
= 1 mA*
1
Collector to emitter saturation
voltage
V
CE(sat)2
--
--
2.3
V
I
C
= 1.5 A, I
B
= 1.5 mA*
1
Base to emitter saturation
voltage
V
BE(sat)1
--
--
2.0
V
I
C
= 1 A, I
B
= 1 mA*
1
Base to emitter saturation
voltage
V
BE(sat)2
--
--
2.5
V
I
C
= 1.5 A, I
B
= 1.5 mA*
1
Emitter to collector diode
forward voltage
V
D
--
--
3.5
V
I
D
= 1.5 A*
1
Notes: 1. Pulse test
2. Marking is "GT".
2SD2423
3
2.0
1.5
1.0
0.5
0
50
100
150
200
Ambient Temperature Ta (
C)
Collector Power Dissipation Pc (W)
(on the alumina ceramic board)
Maximum Collector Dissipation Curve
10
1
0.1
0.01
0.001
0.1
1
10
100
Cellector to Emitter Voltage V (V)
CE
Collector Current I (A)
C
1 ms
Pw = 10 ms
DC Operation
Ta = 25
C
1 shot pulse
Area of Safe Operation
2.0
1.6
1.2
0.8
0.4
0
1
2
3
4
5
Collector to Emitter Voltage V (V)
CE
Collector Current I (A)
C
Ta = 25
C
I = 0
B
0.2 mA
1 mA
0.3 mA
0.4 mA
0.5 mA
0.9 mA
0.8 mA
0.6 mA
Pc = 1 W
0.7 mA
Typical Output Characteristics
10000
5000
2000
1000
500
200
100
0.1
0.2
0.5
1
2
5
10
Collector Current I (A)
C
DC Current Transfer Ratio h
FE
V = 3 V
pulse
CE
Ta = 75
C
25
C
25
C
DC Current Transfer Ratio vs.
Collector Current
2SD2423
4
10
5
2
1
0.5
0.2
0.1
0.1
0.2
0.5
1
2
5
10
Collector Current I (A)
C
V (V)
CE(sat)
I / I = 200
pulse
C
25
C
Ta = 25
C
Collector to Emitter Saturation Voltage
B
75
C
Collector to Emitter Saturation Voltage vs.
Collector Current
10
5
2
1
0.5
0.2
0.1
0.1
0.2
0.5
1
2
5
10
Collector Current I (A)
C
V (V)
BE(sat)
I / I = 200
pulse
C
Ta = 25
C
25
C
75
C
Base to Emitter Saturation Voltage
B
Base to Emitter Saturation Voltage vs.
Collector Current
3000
1000
300
100
30
10
3
1
0
0.4
0.8
1.2
1.6
2.0
Base to Emitter Voltage V (V)
BE
Collector Current I (mA)
C
V = 3 V
pulse
CE
Ta = 25
C
25
C
75
C
Collector Current vs.
Base to Emitter Voltage
100
50
20
10
5
2
1
0.1
0.2
0.5
1
2
5
10
Collector to Base Voltage V (V)
CB
Collector Output Capacitance Cob (pF)
Ta = 25
C
I = 0
f = 1 MHz
E
Collector Output Capacitance vs.
Collector to Base Voltage
4.5
0.1
1.8 Max
1.5
0.1
0.44 Max
0.44 Max
0.48 Max
0.53 Max
1.5 1.5
3.0
2.5
0.1
4.25 Max
0.8 Min
1
0.4
(1.5)
(2.5)
(0.4)
(0.2)
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
UPAK
--
Conforms
0.050 g
Unit: mm
Cautions
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of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-
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consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
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