MICROWAVE CORPORATION

12 - 78

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

MIXERS - SMT

HMC258LM3

GaAs MMIC SUB-HARMONIC

SMT MIXER, 14 - 20 GHz

v01.1201

General Description

Features

Functional Diagram

The HMC258LM3 is a 14 - 20 GHz surface mount
sub-harmonically pumped (x2) MMIC mixer with
an integrated LO amplifi er in a SMT leadless chip
carrier package. The 2LO to RF isolation is an
excellent 40 dB, eliminating the need for addi-
tional fi ltering. The LO amplifi er is a single bias
(+5V) two stage design with only 0 dBm drive
requirement. All data is with the non-hermetic,
epoxy sealed LM3 packaged device mounted in
a 50 ohm test fi xture. Utilizing the HMC258LM3
eliminates the need for wirebonding, thereby pro-
viding a consistent connection interface for the
customer.

Integrated LO Amplifi er: 0 dBm Input

Sub-Harmonically Pumped (x2) LO

High 2LO/RF Isolation: > 40 dB

LM3 SMT Package

Electrical Specifi cations,

= +25° C, LO Drive = 0 dBm

Typical Applications

The HMC258LM3 is ideal for:

· 14 and 20 GHz Microwave Radios

· Point to Point Radios

· VSAT and SATCOM

*Unless otherwise noted, all measurements performed as downconverter, IF= 1 GHz.

Parameter

IF = 1 GHz

Vdd = +5.0V

Units

Min.

Typ.

Max.

Frequency Range, RF

14 - 20

GHz

Frequency Range, LO

7 - 10.5

GHz

Frequency Range, IF

DC - 3

GHz

Conversion Loss

Noise Figure (SSB)

2LO to RF Isolation

2LO to IF Isolation

IP3 (Input)

dBm

1 dB Compression (Input)

-5

dBm

Supply Current (Idd)

MICROWAVE CORPORATION

12 - 79

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

MIXERS - SMT

GaAs MMIC SUB-HARMONIC

SMT MIXER, 14 - 20 GHz

v01.1201

-25

-20

-15

-10

-5

+25C

-40C

+85C

CONVERSION GAIN (dB)

RF FREQUENCY (GHz)

-25

-20

-15

-10

-5

CONVERSION GAIN (dB)

RF FREQUENCY (GHz)

0 dBm

-2 dBm

+2 dBm

-4 dBm

+4 dBm

Conversion Gain vs.
Temperature @ LO = 0 dBm

HMC258LM3

Conversion Gain vs. LO Drive

-60

-50

-40

-30

-20

-10

ISOLATION (dB)

RF FREQUENCY (GHz)

2LO/RF

LO/RF

RF/IF

2LO/IF

LO/IF

Isolation @ LO = 0 dBm

-25

-20

-15

-10

-5

IF CONVERSION GAIN (dB)

IF FREQUENCY (GHz)

IF Bandwidth @ LO = 0 dBm

-40

-30

-20

-10

LO
RF

RETURN LOSS (dB)

FREQUENCY (GHz)

RF & LO Return Loss @ LO = 0 dBm

-40

-30

-20

-10

RETURN LOSS (dB)

IF FREQUENCY (GHz)

IF Return Loss @ LO = 0 dBm

MICROWAVE CORPORATION

12 - 80

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

MIXERS - SMT

GaAs MMIC SUB-HARMONIC

SMT MIXER, 14 - 20 GHz

v01.1201

HMC258LM3

MxN Spurious Outputs@ LO = 0 dBm

-25

-20

-15

-10

-5

CONVERSION GAIN (dB)

RF FREQUENCY (GHz)

Upconverter Performance
Conversion Gain @ LO = 0 dBm

-10

-5

INPUT IP3 (dBm)

RF FREQUENCY (GHz)

-2 dBm

0 dBm

+2 dBm

INPUT IP2 (dBm)

RF FREQUENCY (GHz)

-2 dBm

0 dBm

+2 dBm

Input IP3 vs. LO Drive *

Input IP2 vs. LO Drive *

-4

-3

-2

-1

INPUT P1dB (dBm)

RF FREQUENCY (GHz)

Input P1dB

* Two-tone input power = -10 dBm each tone, 1 MHz spacing.

Absolute Maximum Ratings

nLO

mRF

±5

±4

±3

±2

±1

-3

-2

-1

-16

RF = 18 GHz @ -10 dBm
LO = 8.5 GHz @ 0 dBm
All values in dBc below IF power level.

RF / IF Input (Vdd = +5V)

+13 dBm

LO Drive (Vdd = +5V)

+13 dBm

Vdd

+5.5V

Continous Pdiss (Ta = 85 °C)
(derate 4.28 mW/°C above 85 °C)

386 mW

Storage Temperature

-65 to +150 °C

Operating Temperature

-40 to +85 °C

MICROWAVE CORPORATION

12 - 81

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

MIXERS - SMT

GaAs MMIC SUB-HARMONIC

SMT MIXER, 14 - 20 GHz

v01.1201

HMC258LM3

Outline Drawing

NOTES:

1. MATERIAL: PLASTIC

2. PLATING: GOLD OVER NICKEL

3. DIMENSIONS ARE IN INCHES [MILLIMETERS].

4. ALL TOLERANCES ARE ± 0.005 [± 0.13].

5. ALL GROUNDS MUST BE SOLDERED TO PCB RF GROUND.

INDICATES PIN 1

Pin Number

Function

Description

Interface Schematic

1, 2

N/C

This pin may be connected to the housing ground or left
unconnected.

Vdd

Power Supply for the LO Amplifi er. An external RF bypass
capacitor of 100 - 330 pF is required as close to the package as
possible.

IF Port. This pin is DC coupled and should be DC blocked exter-
nally using a series capacitor whose value has been chosen to
pass the necessary IF frequency range. Any applied DC voltage
to this pin will result in die non-function and possible die failure.

RF Port. This pin is AC coupled and matched to 50 Ohm from
4 - 20 GHz.

LO Port. This pin is AC coupled and matched to 50 Ohm from
7 - 10 GHz.

GND

Must be soldered to PCB RF ground.

Pin Description

MICROWAVE CORPORATION

12 - 82

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

MIXERS - SMT

GaAs MMIC SUB-HARMONIC

SMT MIXER, 14 - 20 GHz

v01.1201

HMC258LM3

The grounded Co-Planar Wave Guide (CPWG) PCB input/output transitions allow use of Ground-Signal-Ground
(GSG) probes for testing. Suggested probe pitch is 400mm (16 mils). Alternatively, the board can be mounted in
a metal housing with 2.4 mm coaxial connectors.

Evaluation PCB

Evalution Circuit Board Layout Design Details

LM3 package mounted to evaluation PCB

Layout Technique

Micro Strip to CPWG

Material

Rogers 4003 with 1/2 oz. Cu

Dielectric Thickness

0.008" (0.20 mm)

Microstrip Line Width

0.018" (0.46 mm)

CPWG Line Width

0.016" (0.41 mm)

CPWG Line to GND Gap

0.005" (0.13 mm)

Ground Via Hole Diameter

0.008" (0.20 mm)

100 pF Capacitor, 0402 Pkg.

MICROWAVE CORPORATION

12 - 84

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

MIXERS - SMT

GaAs MMIC SUB-HARMONIC

SMT MIXER, 14 - 20 GHz

v01.1201

HMC258LM3

HMC258LM3 Recommended SMT Attachment Technique

Preparation & Handling of the LM3 Millimeterwave Package for Surface Mounting

The HMC LM3 package was designed to be compatible with
high volume surface mount PCB assembly processes. The
LM3 package requires a specifi c mounting pattern to allow
proper mechanical attachment and to optimize electrical per-
formance at millimeterwave frequencies. This PCB layout pat-
tern can be found on each LM3 product data sheet. It can also
be provided as an electronic drawing upon request from Hittite
Sales & Application Engineering.

Follow these precautions to avoid permanent damage:

Cleanliness: Observe proper handling procedures to ensure
clean devices and PCBs. LM3 devices should remain in their
original packaging until component placement to ensure no
contamination or damage to RF, DC & ground contact areas.

Static Sensitivity: Follow ESD precautions to protect against ESD strikes.

General Handling: Handle the LM3 package on the top with a vacuum collet or along the edges with a sharp pair of bent
tweezers. Avoiding damaging the RF, DC, & ground contacts on the package bottom. Do not apply excess pressure to
the top of the lid.

Solder Materials & Temperature Profi le: Follow the information contained in the application note. Hand soldering is not
recommended. Conductive epoxy attachment is not recommended.

Solder Paste

Solder paste should be selected based on the user's experience and be compatible with the metallization systems
used. See the LM3 data sheet Outline drawing for pin & ground contact metallization schemes.

Solder Paste Application

Solder paste is generally applied to the PCB using either a stencil printer or dot placement. The volume of solder paste
will be dependent on PCB and component layout and should be controlled to ensure consistent mechanical & electrical
performance. Excess solder may create unwanted electrical parasitics at high frequencies.

Solder Refl ow

The soldering process is usually accomplished in a refl ow oven but may also use a vapor phase process. A solder
refl ow profi le is suggested above.

Prior to refl owing product, temperature profi les should be measured using the same mass as the actual assemblies.
The thermocouple should be moved to various positions on the board to account for edge and corner effects and vary-
ing component masses. The fi nal profi le should be determined by mounting the thermocouple to the PCB at the location
of the device.

Follow solder paste and oven vendor's recommendations when developing a solder refl ow profi le. A standard profi le
will have a steady ramp up from room temperature to the pre-heat temperature to avoid damage due to thermal shock.
Allow enough time between reaching pre-heat temperature and refl ow for the solvent in the paste to evaporate and the
fl ux to completely activate. Refl ow must then occur prior to the fl ux being completely driven off. The duration of peak
refl ow temperature should not exceed 15 seconds. Packages have been qualifi ed to withstand a peak temperature of
235°C for 15 seconds. Verify that the profi le will not expose device to temperatures in excess of 235°C.

Cleaning

A water-based fl ux wash may be used.

100

125

150

175

200

225

TEMPERATURE (

TIME (min)

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: HMC258LM3

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: HMC258LM3