HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6423-B
Issued Date : 1992.11.25
Revised Date : 2000.09.20
Page No. : 1/3
HSMC Product Specification
HBC557
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HBC557 is designed for use in driver stage of audio amplifier
applications.
Features
High Breakdown Voltage: 45V
High AC Current Gain: 75-800 at IC=2mA
Absolute Maximum Ratings
Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150
C
Junction Temperature ................................................................................... +150
C Maximum
Maximum Power Dissipation
Total Power Dissipation (Ta=25
C) ............................................................................... 500 mW
Maximum Voltages and Currents (Ta=25
C)
VCBO Collector to Base Voltage ....................................................................................... -50 V
VCEO Collector to Emitter Voltage .................................................................................... -45 V
VEBO Emitter to Base Voltage ............................................................................................ -5 V
IC Collector Current ..................................................................................................... -100 mA
Characteristics
(Ta=25
C)
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
BVCBO
-50
-
-
V
IC=-100uA
BVCEO
-45
-
-
V
IC=-1mA
BVEBO
-5
-
-
V
IE=-10uA
ICBO
-
-
-100
nA
VCB=-20V
IEBO
-
-
-1
uA
VEB=-5V
VBE(on)1
-600
-
-750
mV
IC=-2mA, VCE=-5V
VBE(on)2
-
-
-820
mV
IC=-10mA, VCE=-5V
*VCE(sat)1
-
-
-300
mV
IC=-10mA, IB=-1mA
*VCE(sat)2
-
-
-650
mV
IC=-100mA, IB=-10mA
*hFE
75
-
800
VCB=-5V, IC=-2mA
fT
-
300
-
MHz
VCE=-5V, IC=-10mA, f=100MHz
Cob
-
4.5
-
PF
VCB=-10V, IE=0, f=1MHz
*Pulse Test : Pulse Width
380us, Duty Cycle
2%
Classification of hFE
Rank
A
B
C
Normal
Range
125-260 240-500 420-800
75-260
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6423-B
Issued Date : 1992.11.25
Revised Date : 2000.09.20
Page No. : 2/3
HSMC Product Specification
Characteristics Curve
Current Gain & Collector Current
1
10
100
1000
1
10
100
1000
Collector Current (mA)
hF
E
V
CE
=5V
Saturation Voltage & Collector Current
0.010
0.100
1.000
10.000
100.000
1
10
100
1000
Collector Current (mA)
S
a
tu
r
a
ti
o
n
V
o
l
t
a
g
e
(
m
V
)
V
CE(sat)
@ I
C
=10I
B
On Voltage & Collector Current
0.1
1
10
1
10
100
1000
Collector Current (mA)
On
V
o
l
t
a
g
e
(
m
V
)
V
BE(on)
@ V
CE
=5V
Cutoff Frequency & Collector Current
1
10
100
1000
1
10
100
1000
Collector Current (mA)
C
u
to
ff F
r
e
q
u
e
n
c
y
(
M
H
z
)
V
CE
=5V
Capacitance & Reverse-Biased Voltage
1
10
1
10
100
Reverse Biased Voltage (V)
Ca
p
a
c
i
t
a
n
c
e
(
p
F
)
Cob
Safe Operating Area
0.01
0.1
1
10
1
10
100
Forward Voltage-VCE (V)
C
o
l
l
e
c
t
o
r
C
u
rre
n
t
-I
C
(m
A
)
PT=1s
PT=100ms
PT=1ms
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6423-B
Issued Date : 1992.11.25
Revised Date : 2000.09.20
Page No. : 3/3
HSMC Product Specification
TO-92 Dimension
*:Typical
Inches
Millimeters
Inches
Millimeters
DIM
Min.
Max.
Min.
Max.
DIM
Min.
Max.
Min.
Max.
A
0.1704
0.1902
4.33
4.83
G
0.0142
0.0220
0.36
0.56
B
0.1704
0.1902
4.33
4.83
H
-
*0.1000
-
*2.54
C
0.5000
-
12.70
-
I
-
*0.0500
-
*1.27
D
0.0142
0.0220
0.36
0.56
1
-
*5
-
*5
E
-
*0.0500
-
*1.27
2
-
*2
-
*2
F
0.1323
0.1480
3.36
3.76
3
-
*2
-
*2
Notes :
1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
Lead : 42 Alloy ; solder plating
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5977061 Fax : 886-3-5979220
3
1
A
D
B
C
I
1
E
F
2
3
G
H
2
Style : Pin 1.Collector 2.Base 3.Emitter
3-Lead TO-92 Plastic Package
HSMC Package Code : A
Marking :
HSMC Logo
Part Number
Date Code
Product Series
Rank
Laser Mark
HSMC Logo
Part Number
Product Series
Ink Mark
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