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Электронный компонент: HMBTA13

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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6842
Issued Date : 1994.07.29
Revised Date : 2002.12.27
Page No. : 1/4
HMBTA13
HSMC Product Specification
HMBTA13
NPN EPITAXIAL PLANAR TRANSISTOR
Description
Darlington Amplifier Transistor
Absolute Maximum Ratings
Maximum Temperatures
Storage Temperature ........................................................................................... -55 ~ +150
C
Junction Temperature.................................................................................... +150
C Maximum
Maximum Power Dissipation
Total Power Dissipation (Ta=25
C) ............................................................................... 225 mW
Thermal Resistance
Junction To Ambient R
ja............................................................................................ 556
o
C/W
Maximum Voltages and Currents (Ta=25
C)
VCBO Collector to Base Voltage......................................................................................... 30 V
VCES Collector to Emitter Voltage ...................................................................................... 30 V
VEBO Emitter to Base Voltage............................................................................................ 10 V
IC Collector Current........................................................................................................ 300 mA
Characteristics
(Ta=25
C)
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
BVCBO
30
-
-
V
IC=100uA
BVCES
30
-
-
V
IC=100uA
BVEBO
10
-
-
V
IE=10uA
ICBO
-
-
100
nA
VCB=30V
IEBO
-
-
100
nA
VEB=10V
*VCE(sat)
-
-
1.5
V
IC=100mA, IB=0.1mA
VBE(on)
-
-
2.0
V
VCE=5V, IC=100mA
*hFE1
5K
-
-
VCE=5V, IC=10mA
*hFE2
10K
-
-
VCE=5V, IC=100mA
fT
125
-
-
MHz
VCE=5V, IC=10mA, f=100MHz
Cob
-
-
6
pF
VCB=10V, f=1MHz
*Pulse Test: Pulse Width
380us, Duty Cycle
2%
SOT-23
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6842
Issued Date : 1994.07.29
Revised Date : 2002.12.27
Page No. : 2/4
HMBTA13
HSMC Product Specification
Characteristics Curve
Current Gain & Collector Current
10k
100k
1000k
0.1
1
10
100
1000
Collector Current (mA)
hF
E
hFE @ V
CE
=5V
Saturation Voltage & Collector Current
100
1000
10000
1
10
100
1000
Collector Current (mA)
S
a
tu
r
a
ti
o
n
V
o
l
t
a
g
e
(
m
V
)
V
CE(sat)
@ I
C
=1000I
B
V
BE(sat)
@ I
C
=1000I
B
On Voltage & Collector Current
100
1000
10000
0.1
1
10
100
1000
Collector Current (mA)
O
n
V
o
l
t
age (
m
V
)
V
BE(on)
@ V
CE
=5V
Capacitance & Reverse-Biased Voltage
1
10
1
10
100
Reverse-Biased Voltage (V)
C
apa
c
i
t
a
n
c
e (
p
F
)
Cob
Cutoff Frequency & Collector Current
10
100
1000
1
10
100
1000
Collector Current (mA)
C
u
to
ff F
r
e
q
u
e
n
c
e
(
M
H
z
)
V
CE
=5V
Safe Operating Area
1
10
100
1000
10000
1
10
100
Forward Voltage (V)
Co
l
l
e
c
t
o
r
Cu
r
r
e
n
t
(
m
A
)
PT=1ms
PT=100ms
PT=1s
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6842
Issued Date : 1994.07.29
Revised Date : 2002.12.27
Page No. : 3/4
HMBTA13
HSMC Product Specification
Power Derating Curve
0
50
100
150
200
250
0
50
100
150
200
Ambient Temperature-Ta (
o
C)
Po
w
e
r
D
i
s
s
i
p
a
t
i
o
n
-
PD
(
m
W
)
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6842
Issued Date : 1994.07.29
Revised Date : 2002.12.27
Page No. : 4/4
HMBTA13
HSMC Product Specification
SOT-23 Dimension
*: Typical
Inches
Millimeters
Inches
Millimeters
DIM
Min.
Max.
Min.
Max.
DIM
Min.
Max.
Min.
Max.
A
0.1102
0.1204
2.80
3.04
J
0.0034
0.0070
0.085
0.177
B
0.0472
0.0630
1.20
1.60
K
0.0128
0.0266
0.32
0.67
C
0.0335
0.0512
0.89
1.30
L
0.0335
0.0453
0.85
1.15
D
0.0118
0.0197
0.30
0.50
S
0.0830
0.1083
2.10
2.75
G
0.0669
0.0910
1.70
2.30
V
0.0098
0.0256
0.25
0.65
H
0.0005
0.0040
0.013
0.10
Notes:
1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
Lead: 42 Alloy; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
H
J
K
D
A
L
G
V
C
B
3
2
1
S
Style: Pin 1.Base 2.Emitter 3.Collector
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
Marking:
Rank Code
1 M
Control Code