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Электронный компонент: HMM4148

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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. :Preliminary Data
Issued Date : 1999.05.01
Revised Date : 1999.09.01
Page No. : 1/3
HSMC Product Specification
HMM4148
SURFACE MOUNT SWITCHING DIODES
Description
The HMM4148 is designed for high-speed switching application in hybrid thick-and thin-film
circuits.
Absolute Maximum Ratings
( Operating temperature range applies unless otherwise specified )
Characteristics
Symbol
Value
Unit
Reverse Voltage
V
R
75
V
Peak Reverse Voltage
I
RM
100
V
Rectified Current(Average)
Half Wave Rectification with Resistive Load at
Tamb=25
C and f
50Hz
I
O
150
mA
Surge Forward Current at t<1s and Tj=25
C
I
FSM
500
mA
Power Dissipation at Tamb=25
C
P
tot
500
mW
Junction Temperature
T
j
200
C
Storage Temperature Range
T
s
-65 to +200
C
Characteristics
( Tj=25
C)
Characteristics
Symbol Min Typ Max
Unit
Forward Voltage at I
F
=10mA
V
F
-
-
1
V
V
R
=20V
-
-
25
nA
V
R
=75V
-
-
5
uA
Leakage Current at
V
R
=20V, Tj=150
C
I
R
-
-
50
uA
Reverse Breakdown Voltage tested with 100us Pulses
V
(BR)R
100
-
-
V
Capacitance at V
F
= V
R
=0
C
tot
-
-
-4
pF
Voltage Rise when Switching On Tested with 50mA
Forward Pulses T
p
=0.1us, Rise Time<30ns, fp=5~100kHz
V
fr
-
-
2.5
V
Reverse Recovery Time From
I
F
=-I
R
=10mA to I
RR
=-1mA, V
R
=6V, R
L
=100
t
rr
-
-
4
ns
Thermal Resistance
Function to Ambient Air
R
thA
-
-
0.35 K/mW
Rectification Efficiency at f=100MHz, V
RF
=2V
v
0.45
-
-
-
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. :Preliminary Data
Issued Date : 1999.05.01
Revised Date : 1999.09.01
Page No. : 2/3
HSMC Product Specification
Characteristics Curve
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. :Preliminary Data
Issued Date : 1999.05.01
Revised Date : 1999.09.01
Page No. : 3/3
HSMC Product Specification
Dimension
*:Typical
Inches
Millimeters
Inches
Millimeters
DIM
Min.
Max.
Min.
Max.
DIM
Min.
Max.
Min.
Max.
A
0.0512
0.0591
1.30
1.50
C
0.0118
0.0197
0.30
0.50
B
0.0118
0.0197
0.30
0.50
D
0.1260
0.1417
3.2
3.6
Notes :
1.Dimension and tolerance based on our Spec. dated Sep. 30,1999
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5977061 Fax : 886-3-5979220
A
B
C
D
Cathode Mark
LL-34
Mini-Melf
SOD-80C