HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : Preliminary Data
Issued Date : 2000.04.15
Revised Date : 2000.04.20
Page No. : 1/3
HSMC Product Specification
HSMA400X Series
1.0AMP. SURFACE MOUNT RECTIFIERS
Features
For surface mounted application
Low forward voltage drop
High current capability
Easy pick and place
High surge current capability
Plastic material used carries Underwriters Laboratory Classification 94V-0
High temperature soldering: 250
C/10 seconds at terminals
Mechanical Data
Case: SMA/DO-214AC Molded Plastic.
Terminals: Solder plated.
Polarity: Indicated by cathode band.
Packaging: 12mm tape per EIA STD RS-481.
Weight: 0.064 gram.
Maximum Ratings and Electrical Characteristics
Rating at 25
C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive
or inductive load. For capacitive load, derate current by 20%.
Type Number
HSMA
4001
HSMA
4002
HSMA
4003
HSMA
4004
HSMA
4005
HSMA
4006
HSMA
4007
Units
Maximum Recurrent Peak Reverse Voltage
50
100
200
400
600
800
1000
V
Maximum RMS Voltage
35
70
140
280
420
560
700
V
Maximum DC Blocking Voltage
50
100
200
400
600
800
1000
V
Maximum Average
Forward Rectified Current @TL=110
C
1
A
Peak Forward Surge Current, 8.3ms Single
Half Sine-wave Superimposed on
Rated Load(JEDEC method)
30
A
Maximum Instantaneous
Forward Voltage @ 1.0A
1.1
V
Maximum DC Reverse Current at
Rated DC Blocking Voltage
5(@Ta=25
C)
50(@Ta=125
C)
uA
Maximum Reverse Recovery Time
(Note 1)
1.8
uS
Typical Junction Capacitance
(Note 2)
12
pF
Operating Temperature Range Tj
-55 to +150
C
Storage Temperature Range Tstg
-55 to +150
C
Note1: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A
Note2: Measured at 1 MHz and Applied VR=4.0Volts
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : Preliminary Data
Issued Date : 2000.04.15
Revised Date : 2000.04.20
Page No. : 3/3
HSMC Product Specification
SMA/DO-214AC Dimension
*:Typical
Inches
Millimeters
Inches
Millimeters
DIM
Min.
Max.
Min.
Max.
DIM
Min.
Max.
Min.
Max.
A
0.5000
0.0642
1.27
1.63
E
0.0299
0.0598
0.76
1.52
B
0.0901
0.1150
2.29
2.92
F
0.0039
0.0079
0.10
0.20
C
0.1575
0.1811
4.00
4.60
G
0.1890
0.2201
4.80
5.59
D
0.0783
0.1028
1.99
2.61
H
0.0059
0.0122
0.15
0.31
Notes :
1.Dimension and tolerance based on our Spec. dated Mar. 6,1995.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
Lead : 42 Alloy ; solder plating
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5977061 Fax : 886-3-5979220
A
B
C
H
E
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D
F
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