HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : Preliminary Data
Issued Date : 2000.01.15
Revised Date : 2001.05.01
Page No. : 1/3
HSMA5817, HSMA5818, HSMA5819
HSMC Product Specification
HSMA5817
thru
HSMA5819
1.0 AMP. SURFACE MOUNT SCHOTTKY BARRIER RECTIFIERS
Features
Low Forward Voltage Drop
High Current Capability
High Reliability
High Surge Current Capability
Mechanical Data
Cases: SMA Molded Plastic
Epoxy: UL 94V-0 rate flame retardant
Lead: Axial leads, solderable per MIL-STD-202, Method 208 guaranteed
Polarity: Color band denotes cathode end
High temperature soldering guaranteed: 250
C/10 seconds/.375"(9.5mm) lead lengths at 5 lbs.,
(2.3kg) tension, Weight:0.33gram
Maximum Ratings and Electrical Characteristics
Rating at 25
C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz,
resistive or inductive load. For capacitive load, derate current by 20%.
Type Number
HSMA5817 HSMA5818 HSMA5819 Units
Maximum Recurrent Peak Reverse Voltage
20
30
40
V
Maximum RMS Voltage
14
21
28
V
Maximum DC Blocking voltage
20
30
40
V
Maximum Average Forward Rectified Current
See Fig.1
1.0
A
Peak Forward Surge Current, 8.3ms Single
Half Sine-wave Superimposed on Rated
Load(JEDEC method)
40
A
Maximum Instantaneous Forward Voltage
@1.0A
0.45
0.55
0.60
V
0.5(@T
A
=25
C)
mA
Maximum D.C. Reverse Current
(Note 1)
at
Rated DC Blocking Voltage
10(@T
A
=100
C)
5.0(@T
A
=100
C)
mA
Typical Thermal Resistance
(Note 2)
R
JA
88
C/W
Operating Junction Temperature Range T
J
-65 to +125
-65 to +150
C
Storage Temperature Range T
STG
-65 to +150
C
Notes: 1.Pulse Test with PW=300 usec, 1% Duty Cycle
2. Measured on P.C. Board with 0.2x0.2"(5.0x5.0mm) Copper Pad Areas.
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : Preliminary Data
Issued Date : 2000.01.15
Revised Date : 2001.05.01
Page No. : 3/3
HSMA5817, HSMA5818, HSMA5819
HSMC Product Specification
SMA/DO-214AC Dimension
*:Typical
Inches
Millimeters
Inches
Millimeters
DIM
Min.
Max.
Min.
Max.
DIM
Min.
Max.
Min.
Max.
A
0.5000
0.0642
1.27
1.63
E
0.0299
0.0598
0.76
1.52
B
0.0901
0.1150
2.29
2.92
F
0.0039
0.0079
0.10
0.20
C
0.1575
0.1811
4.00
4.60
G
0.1890
0.2201
4.80
5.59
D
0.0783
0.1028
1.99
2.61
H
0.0059
0.0122
0.15
0.31
Notes :
1.Dimension and tolerance based on our Spec. dated Mar. 6,2000.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
A
B
C
H
E
G
D
F
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