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Электронный компонент: 3011C

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843011CG
www.icst.com/products/hiperclocks.html
REV. A JANUARY 25, 2006
1
Integrated
Circuit
Systems, Inc.
ICS843011C
F
EMTO
C
LOCKS
TM C
RYSTAL
-
TO
-
3.3V LVPECL C
LOCK
G
ENERATOR
PRELIMINARY
G
ENERAL
D
ESCRIPTION
The ICS843011C is a Fibre Channel Clock
Generator and a member of the HiPerClocks
TM
family of high performance devices from ICS.
The ICS843011C uses a 26.5625MHz crystal to
synthesize 106.25MHz or a 25MHz crystal to
synthesize 100MHz. The ICS843011C has excellent <1ps
phase jitter performance, over the 637kHz 10MHz
integration range. The ICS843011C is packaged in a small
8-pin TSSOP, making it ideal for use in systems with limit-
ed board space.
F
EATURES
One differential 3.3V LVPECL output
Crystal oscillator interface designed for 26.5625MHz
18pF parallel resonant crystal
Output frequency: 106.25MHz or 100MHz
VCO range: 560MHz - 680MHz
RMS phase jitter @ 100MHz, using a 25MHz crystal
(637kHz - 10MHz): 0.29ps (typical)
3.3V operating supply
-40C to 85C ambient operating temperature
Available in both standard and lead-free RoHS compliant
packages
HiPerClockSTM
ICS
F
REQUENCY
T
ABLE
)
z
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ICS843011C
8-Lead TSSOP
4.40mm x 3.0mm x 0.925mm package body
G Package
Top View
V
CCA
V
EE
XTAL_OUT
XTAL_IN
1
2
3
4
V
CC
Q
nQ
nc
8
7
6
5
OSC
Phase
Detector
VCO
637.5MHz w/
26.5625MHz Ref.
M = 24 (fixed)
6
B
LOCK
D
IAGRAM
P
IN
A
SSIGNMENT
Q
nQ
XTAL_IN
XTAL_OUT
The Preliminary Information presented herein represents a product in prototyping or pre-production. The noted characteristics are based on
initial product characterization. Integrated Circuit Systems, Incorporated (ICS) reserves the right to change any circuitry or specifications
without notice.
843011CG
www.icst.com/products/hiperclocks.html
REV. A JANUARY 25, 2006
2
Integrated
Circuit
Systems, Inc.
ICS843011C
F
EMTO
C
LOCKS
TM C
RYSTAL
-
TO
-
3.3V LVPECL C
LOCK
G
ENERATOR
PRELIMINARY
T
ABLE
2. P
IN
C
HARACTERISTICS
T
ABLE
1. P
IN
D
ESCRIPTIONS
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843011CG
www.icst.com/products/hiperclocks.html
REV. A JANUARY 25, 2006
3
Integrated
Circuit
Systems, Inc.
ICS843011C
F
EMTO
C
LOCKS
TM C
RYSTAL
-
TO
-
3.3V LVPECL C
LOCK
G
ENERATOR
PRELIMINARY
T
ABLE
3A. P
OWER
S
UPPLY
DC C
HARACTERISTICS
,
V
CC
= 3.3V5%, T
A
= -40C
TO
85C
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3B. LVPECL DC C
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,
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CC
= 3.3V5%, T
A
= -40C
TO
85C
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ABLE
5. AC C
HARACTERISTICS
,
V
CC
= 3.3V5%, T
A
= -40C
TO
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T
ABLE
4. C
RYSTAL
C
HARACTERISTICS
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A
BSOLUTE
M
AXIMUM
R
ATINGS
Supply Voltage, V
CC
4.6V
Inputs, V
I
-0.5V to V
CC
+ 0.5V
Outputs, I
O
Continuous Current
50mA
Surge Current
100mA
Package Thermal Impedance,
JA
101.7C/W (0 mps)
Storage Temperature, T
STG
-65C to 150C
NOTE: Stresses beyond those listed under Absolute
Maximum Ratings may cause permanent damage to the
device. These ratings are stress specifications only. Functional
operation of product at these conditions or any conditions be-
yond those listed in the
DC Characteristics
or
AC Character-
istics
is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect product reliability.
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843011CG
www.icst.com/products/hiperclocks.html
REV. A JANUARY 25, 2006
4
Integrated
Circuit
Systems, Inc.
ICS843011C
F
EMTO
C
LOCKS
TM C
RYSTAL
-
TO
-
3.3V LVPECL C
LOCK
G
ENERATOR
PRELIMINARY
P
ARAMETER
M
EASUREMENT
I
NFORMATION
O
UTPUT
D
UTY
C
YCLE
/P
ULSE
W
IDTH
/P
ERIOD
O
UTPUT
R
ISE
/F
ALL
T
IME
3.3V O
UTPUT
L
OAD
AC T
EST
C
IRCUIT
SCOPE
Qx
nQx
LVPECL
2V
-1.3V 0.165V
Clock
Outputs
20%
80%
80%
20%
t
R
t
F
V
SW I N G
t
PW
t
PERIOD
t
PW
t
PERIOD
odc =
x 100%
Q
nQ
V
EE
V
CC
RMS P
HASE
J
ITTER
Phase Noise Mask
Offset Frequency
f
1
f
2
Phase Noise Plot
RMS Jitter = Area Under the Masked Phase Noise Plot
Noise P
o
w
er
843011CG
www.icst.com/products/hiperclocks.html
REV. A JANUARY 25, 2006
5
Integrated
Circuit
Systems, Inc.
ICS843011C
F
EMTO
C
LOCKS
TM C
RYSTAL
-
TO
-
3.3V LVPECL C
LOCK
G
ENERATOR
PRELIMINARY
A
PPLICATION
I
NFORMATION
Figure 2. C
RYSTAL
I
NPU
t I
NTERFACE
C
RYSTAL
I
NPUT
I
NTERFACE
The ICS843011C has been characterized with 18pF parallel
resonant crystals. The capacitor values, C1 and C2, shown in
Figure 2
below were determined using a 26.5625MHz, 18pF
parallel resonant crystal and were chosen to minimize the
ppm error. The optimum C1 and C2 values can be slightly
adjusted for different board layouts.
As in any high speed analog circuitry, the power supply pins
are vulnerable to random noise. The ICS843011C provides
separate power supplies to isolate any high switching
noise from the outputs to the internal PLL. V
CC
and V
CCA
should be individually connected to the power supply
plane through vias, and bypass capacitors should be
used for each pin. To achieve optimum jitter performance,
power supply isolation is required.
Figure 1
illustrates how
a 10
resistor along with a 10F and a .01F bypass
capacitor should be connected to each V
CCA
pin.
P
OWER
S
UPPLY
F
ILTERING
T
ECHNIQUES
F
IGURE
1. P
OWER
S
UPPLY
F
ILTERING
10
V
CCA
10
F
.01
F
3.3V
.01
F
V
CC
C1
33p
X1
18pF Parallel Crystal
C2
22p
XTAL_OUT
XTAL_IN
843011CG
www.icst.com/products/hiperclocks.html
REV. A JANUARY 25, 2006
6
Integrated
Circuit
Systems, Inc.
ICS843011C
F
EMTO
C
LOCKS
TM C
RYSTAL
-
TO
-
3.3V LVPECL C
LOCK
G
ENERATOR
PRELIMINARY
A
PPLICATION
S
CHEMATIC
Figure 3A
shows a schematic example of the ICS843011C.
An example of LVEPCL termination is shown in this sche-
matic. Additional LVPECL termination approaches are shown
in the LVPECL Termination Application Note. In this example,
an 18 pF parallel resonant 26.5625MHz crystal is used for
generating 106.25MHz output frequency. The C1 = 27pF and
C2 = 33pF are recommended for frequency accuracy. For
different board layout, the C1 and C2 values may be slightly
adjusted for optimizing frequency accuracy.
F
IGURE
3A. ICS843011C S
CHEMATIC
E
XAMPLE
F
IGURE
3B. ICS843011 PC B
OARD
L
AYOUT
E
XAMPLE
PC B
OARD
L
AYOUT
E
XAMPLE
Figure 3B
shows an example of ICS843011C P.C. board lay-
out. The crystal X1 footprint shown in this example allows
installation of either surface mount HC49S or through-hole
HC49 package. The footprints of other components in this
example are listed in the
Table 6.
There should be at least one
decoupling capacitor per power pin. The decoupling capaci-
tors should be located as close as possible to the power pins.
The layout assumes that the board has clean analog power
ground plane.
T
ABLE
6. F
OOTPRINT
T
ABLE
e
c
n
e
r
e
f
e
R
e
z
i
S
2
C
,
1
C
2
0
4
0
3
C
5
0
8
0
5
C
,
4
C
3
0
6
0
2
R
3
0
6
0
t
n
e
n
o
p
m
o
c
s
t
s
il
,
6
e
l
b
a
T
:
E
T
O
N
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e
z
i
s
R5
50
Zo = 50 Ohm
C4
0.1u
C2
33pF
XTAL_IN
Q
nQ
18pF
VCCA
R5
133
R2
10
Zo = 50 Ohm
C5
0.1u
R6
50
Zo = 50 Ohm
R4
82.5
+
-
Optional
Y-Termination
Q
XTAL_OUT
X1
26.5625MHz
Zo = 50 Ohm
nQ
VCC
VCC
C1
27pF
+
-
R7
50
U2
843011C
1
2
3
4
8
7
6
5
VCCA
VEE
XTAL_OUT
XTAL_IN
VCC
Q
nQ
nc
R6
82.5
C3
10uF
VCC
R3
133
843011CG
www.icst.com/products/hiperclocks.html
REV. A JANUARY 25, 2006
7
Integrated
Circuit
Systems, Inc.
ICS843011C
F
EMTO
C
LOCKS
TM C
RYSTAL
-
TO
-
3.3V LVPECL C
LOCK
G
ENERATOR
PRELIMINARY
P
OWER
C
ONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS843011C.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS843011C is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
CC
= 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX
= V
CC_MAX
* I
EE_MAX
= 3.465V * 68mA = 235.6mW
Power (outputs)
MAX
= 30mW/Loaded Output pair
Total Power
_MAX
(3.465V, with all outputs switching) = 235.6mW + 30mW = 265.6mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
TM
devices is 125C.
The equation for Tj is as follows: Tj =
JA
* Pd_total + T
A
Tj = Junction Temperature
JA
= Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A
= Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
JA
must be used. Assuming a
moderate air flow of 1 meter per second and a multi-layer board, the appropriate value is 90.5C/W per Table
7 below.
Therefore, Tj for an ambient temperature of 85C with all outputs switching is:
85C + 0.266W * 90.5C/W = 109.1C. This is well below the limit of 125C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
T
ABLE
7. T
HERMAL
R
ESISTANCE


JA
FOR
8-
PIN
TSSOP, F
ORCED
C
ONVECTION


JA
by Velocity (Meters per Second)
0
1
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
101.7C/W
90.5C/W
89.8C/W
843011CG
www.icst.com/products/hiperclocks.html
REV. A JANUARY 25, 2006
8
Integrated
Circuit
Systems, Inc.
ICS843011C
F
EMTO
C
LOCKS
TM C
RYSTAL
-
TO
-
3.3V LVPECL C
LOCK
G
ENERATOR
PRELIMINARY
3. Calculations and Equations.
The purpose of this section is to derive the power dissipated into the load.
LVPECL output driver circuit and termination are shown in
Figure 4.
T
o calculate worst case power dissipation into the load, use the following equations which assume a 50
load, and a termination
voltage of V
CC
- 2V.
For logic high, V
OUT
= V
OH_MAX
= V
CC_MAX
0.9V
(V
CCO_MAX
- V
OH_MAX
) = 0.9V
For logic low, V
OUT
= V
OL_MAX
= V
CC_MAX
1.7V
(V
CCO_MAX
- V
OL_MAX
) = 1.7V
Pd_H is power dissipation when the output drives high.
Pd_L is the power dissipation when the output drives low.
Pd_H = [(V
OH_MAX
(V
CC_MAX
- 2V))/R
L
] * (V
CC_MAX
- V
OH_MAX
) = [(2V - (V
CC_MAX
- V
OH_MAX
))/R
L
] * (V
CC_MAX
- V
OH_MAX
) =
[(2V - 0.9V)/50
] * 0.9V = 19.8mW
Pd_L = [(V
OL_MAX
(V
CC_MAX
- 2V))/R
L
] * (V
CC_MAX
- V
OL_MAX
) = [(2V - (V
CC_MAX
- V
OL_MAX
))/R
L
] * (V
CC_MAX
- V
OL_MAX
) =
[(2V - 1.7V)/50
] * 1.7V = 10.2mW
Total Power Dissipation per output pair = Pd_H + Pd_L = 30mW
F
IGURE
4. LVPECL D
RIVER
C
IRCUIT
AND
T
ERMINATION
Q1
V
OUT
V
CC
RL
50
V
CC
- 2V
843011CG
www.icst.com/products/hiperclocks.html
REV. A JANUARY 25, 2006
9
Integrated
Circuit
Systems, Inc.
ICS843011C
F
EMTO
C
LOCKS
TM C
RYSTAL
-
TO
-
3.3V LVPECL C
LOCK
G
ENERATOR
PRELIMINARY
R
ELIABILITY
I
NFORMATION
T
RANSISTOR
C
OUNT
The transistor count for ICS843011C is: 2436
T
ABLE
8.
JA
VS
. A
IR
F
LOW
T
ABLE
FOR
8 L
EAD
TSSOP


JA
by Velocity (Meters per Second)
0
1
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
101.7C/W
90.5C/W
89.8C/W
843011CG
www.icst.com/products/hiperclocks.html
REV. A JANUARY 25, 2006
10
Integrated
Circuit
Systems, Inc.
ICS843011C
F
EMTO
C
LOCKS
TM C
RYSTAL
-
TO
-
3.3V LVPECL C
LOCK
G
ENERATOR
PRELIMINARY
P
ACKAGE
O
UTLINE
- G S
UFFIX
FOR
8 L
EAD
TSSOP
T
ABLE
9. P
ACKAGE
D
IMENSIONS
Reference Document: JEDEC Publication 95, MO-153
L
O
B
M
Y
S
s
r
e
t
e
m
i
l
l
i
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m
u
m
i
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8
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843011CG
www.icst.com/products/hiperclocks.html
REV. A JANUARY 25, 2006
11
Integrated
Circuit
Systems, Inc.
ICS843011C
F
EMTO
C
LOCKS
TM C
RYSTAL
-
TO
-
3.3V LVPECL C
LOCK
G
ENERATOR
PRELIMINARY
T
ABLE
10. O
RDERING
I
NFORMATION
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems, Incorporated (ICS) assumes no responsibility for either its use
or for infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use
in normal commercial and industrial applications. Any other applications such as those requiring ehigh reliability or other extraordinary environmental requirements are not
recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS product
for use in life support devices or critical medical instruments.
The aforementioned trademarks, HiPerClockS and FemtoClocks are trademarks of Integrated Circuit Systems, Inc. or its subsidiaries in the United States and/or other countries.
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