2002 Integrated Device Technology, Inc.
1
JANUARY 2002
DSC-4852/3
I/O
Control
Address
Decoder
128Kx8
MEMORY
ARRAY
70V09
ARBITRATION
INTERRUPT
SEMAPHORE
LOGIC
CE
0L
OE
L
R/
W
L
A
16L
A
0L
I/O
0-7L
SEM
L
INT
L
(2)
BUSY
L
(1,2)
R/
W
L
CE
0L
OE
L
I/O
Control
Address
Decoder
OE
R
R/
W
R
CE
0R
A
16R
A
0R
I/O
0-7R
SEM
R
INT
R
(2)
R
BUSY
(1,2)
M/
S
(1)
CE
1L
R/
W
R
CE
0R
OE
R
CE
1R
4852 drw 01
1L
CE
1R
CE
17
17
.unctional Block Diagram
x
x
x
x
x
M/
S = V
IH
for
BUSY output flag on Master,
M/
S = V
IL
for
BUSY input on Slave
x
x
x
x
x
Busy and Interrupt Flags
x
x
x
x
x
On-chip port arbitration logic
x
x
x
x
x
Full on-chip hardware support of semaphore signaling
between ports
x
x
x
x
x
Fully asynchronous operation from either port
x
x
x
x
x
LVTTL-compatible, single 3.3V (0.3V) power supply
x
x
x
x
x
Available in a 100-pin TQFP
x
x
x
x
x
Industrial temperature range (40C to +85C) is available
for selected speeds
.eatures
x
x
x
x
x
True Dual-Ported memory cells which allow simultaneous
access of the same memory location
x
x
x
x
x
High-speed access
Commercial: 15/20ns (max.)
Industrial: 20ns (max.)
x
x
x
x
x
Low-power operation
IDT70V09L
Active: 440mW (typ.)
Standby: 660W (typ.)
x
x
x
x
x
Dual chip enables allow for depth expansion without
external logic
x
x
x
x
x
IDT70V09 easily expands data bus width to 16 bits or
more using the Master/Slave select when cascading more
than one device
HIGH-SPEED 3.3V
128K x 8 DUAL-PORT
STATIC RAM
PRELIMINARY
IDT70V09L
NOTES:
1.
BUSY is an input as a Slave (M/S=V
IL
) and an output when it is a Master (M/
S=V
IH
).
2.
BUSY and INT are non-tri-state totem-pole outputs (push-pull).
IDT70V09L Preliminary
High-Speed 128K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges
2
Description
The IDT70V09 is a high-speed 128K x 8 Dual-Port Static RAM.
The IDT70V09 is designed to be used as a stand-alone 1024K-bit
Dual-Port RAM or as a combination MASTER/SLAVE Dual-Port RAM
for 16-bit-or-more word system. Using the IDT MASTER/SLAVE Dual-
Port RAM approach in 16-bit or wider memory system applications
results in full-speed, error-free operation without the need for addi-
tional discrete logic.
This device provides two independent ports with separate control,
address, and I/O pins that permit independent, asynchronous access
for reads or writes to any location in memory. An automatic power
down feature controlled by the chip enables (either
CE
0
or CE
1
)
permit the on-chip circuitry of each port to enter a very low standby
power mode.
Fabricated using IDT's CMOS high-performance technology,
these devices typically operate on only 440mW of power.
The IDT70V09 is packaged in a 100-pin Thin Quad Flatpack
(TQFP).
NOTES:
1. All Vcc pins must be connected to power supply.
2. All GND pins must be connected to ground.
3. Package body is approximately 14mm x 14mm x 1.4mm.
4. This package code is used to reference the package diagram.
5. This text does not indicate orientation of the actual part-marking.
Pin Configurations
(1,2,3)
Index
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
IDT70V09PF
PN100-1
(4)
100-Pin TQFP
Top View
(5)
NC
GND
GND
OE
R
R/
W
R
SEM
R
CE
1R
CE
0R
NC
NC
GND
A
15R
A
12R
A
13R
A
11R
A
10R
A
9R
A
8R
A
7R
NC
NC
A
14R
NC
NC
A
16R
4852 drw 02
NC
NC
GND
OE
L
R/
W
L
SEM
L
CE
1L
CE
0L
NC
NC
NC
Vcc
A
16L
A
15L
A
14L
A
13L
A
8L
A
7L
NC
NC
NC
A
12L
A
11L
A
10L
A
9L
N
C
N
C
I
/
O
6
R
I
/
O
5
R
I
/
O
4
R
I
/
O
3
R
V
c
c
I
/
O
2
R
I
/
O
0
R
G
N
D
V
c
c
I
/
O
0
L
I
/
O
1
L
G
N
D
I
/
O
2
L
I
/
O
4
L
I
/
O
5
L
I
/
O
6
L
I
/
O
7
L
I
/
O
3
L
I
/
O
1
R
I
/
O
7
R
G
N
D
N
C
N
C
N
C
N
C
A
6
R
A
5
R
A
4
R
A
3
R
A
2
R
A
1
R
A
0
R
I
N
T
R
B
U
S
Y
R
M
/
S
B
U
S
Y
L
I
N
T
L
N
C
A
0
L
G
N
D
A
2
L
A
3
L
A
5
L
A
6
L
N
C
N
C
A
1
L
A
4
L
3
IDT70V09L Preliminary
High-Speed 128K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges
Absolute Maximum Ratings
(1)
Recommended DC Operating
Conditions
Maximum Operating Temperature
and Supply Voltage
Pin Names
Capacitance
(1)
(T
A
= +25C, f = 1.0MHz)
NOTES:
1. This parameter is determined by device characterization but is not produc-
tion tested.
2. 3dV represents the interpolated capacitance when the input and output signals
switch from 0V to 3V or from 3V to 0V.
N
OTES:
1.
Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may
cause permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in
the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect reliability.
2.
V
TERM
must not exceed Vcc + 0.3V for more than 25% of the cycle time or 10ns
maximum, and is limited to < 20mA for the period of V
TERM
> Vcc + 0.3V.
NOTES:
1.
V
IL
> -1.5V for pulse width less than 10ns.
2.
V
TERM
must not exceed Vcc + 0.3V.
NOTES:
1. This is the parameter T
A
. This is the "instant on" case temperature.
Symbol
Rating
Commercial
& Industrial
Unit
V
TERM
(2)
Terminal Voltage
with Respect
to GND
-0.5 to +4.6
V
T
BIAS
Temperature
Under Bias
-55 to +125
o
C
T
STG
Storage
Temperature
-65 to +150
o
C
I
OUT
DC Output
Current
50
mA
4852 tbl 02
Grade
Ambient
Temperature
(1)
GND
Vcc
Commercial
0
O
C to +70
O
C
0V
3.3V
+
0.3V
Industrial
-40
O
C to +85
O
C
0V
3.3V
+
0.3V
4852 tbl 03
Symbol
Parameter
Conditions
(2)
Max.
Unit
C
IN
Input Capacitance
V
IN
= 3dV
9
pF
C
OUT
Output Capacitance
V
OUT
= 3dV
10
pF
4852 tbl 05
Left Port
Right Port
Names
CE
0L
, CE
1L
CE
0R
, CE
1R
Chip Enables
R/W
L
R/W
R
Read/Write Enable
OE
L
OE
R
Output Enable
A
0L
- A
16L
A
0R
- A
16R
Address
I/O
0L
- I/O
7L
I/O
0R
- I/O
7R
Data Input/Output
SEM
L
SEM
R
Semaphore Enable
INT
L
INT
R
Interrupt Flag
BUSY
L
BUSY
R
Busy Flag
M/S
Master or Slave Select
V
CC
Power
GND
Ground
4852 tbl 01
Symbol
Parameter
Min.
Typ.
Max.
Unit
V
CC
Supply Voltage
3.0
3.3
3.6
V
GND
Ground
0
0
0
V
V
IH
Input High Voltage
2.0
____
V
CC
+0.3
(2)
V
V
IL
Input Low Voltage
-0.3
(1)
____
0.8
V
4852 tbl 04
IDT70V09L Preliminary
High-Speed 128K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges
4
Truth Table III Semaphore Read/Write Control
(1)
Truth Table I Chip Enable
(1,2)
NOTES:
1.
Chip Enable references are shown above with the actual
CE
0
and CE
1
levels;
CE is a reference only.
2.
'H' = V
IH
and 'L' = V
IL
.
3.
CMOS standby requires 'X' to be either < 0.2V or >V
CC
-0.2V.
Truth Table II Non-Contention Read/Write Control
NOTES:
1.
A
0L
-- A
16L
A
0R
-- A
16R
2. Refer to Truth Table I - Chip Enable.
NOTES:
1. There are eight semaphore flags written to I/O
0
and read from all the I/Os (I/O
0
-I/O
7
). These eight semaphore flags are addressed by A
0
-A
2
.
2. Refer toTruth Table I -
Chip Enable
.
CE
CE
0
CE
1
Mode
L
V
IL
V
IH
Port Selected (TTL Active)
< 0.2V
>V
CC
-0.2V
Port Selected (CMOS Active)
H
V
IH
X
Port Deselected (TTL Inactive)
X
V
IL
Port Deselected (TTL Inactive)
>V
CC
-0.2V
X
(3)
Port Deselected (CMOS Inactive)
X
(3)
<0.2V
Port Deselected (CMOS Inactive)
4852 tbl 06
Inputs
(1)
Outputs
Mode
CE
(2)
R/
W
OE
SEM
I/O
0-7
H
X
X
H
High-Z
Deselected: Power-Down
L
L
X
H
DATA
IN
Write to Memory
L
H
L
H
DATA
OUT
Read Memory
X
X
H
X
High-Z
Outputs Disabled
4852 tbl 07
Inputs
Outputs
Mode
CE
(2)
R/
W
OE
SEM
I/O
0-7
H
H
L
L
DATA
OUT
Read Semaphore Flag Data Out
H
X
L
DATA
IN
Write I/O
0
into Semaphore Flag
L
X
X
L
______
Not Allowed
4852 tbl 08
5
IDT70V09L Preliminary
High-Speed 128K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges
DC Electrical Characteristics Over the Operating
Temperature and Supply Voltage Range
(5)
(V
CC
= 3.3V 0.3V)
NOTES:
1. V
CC
= 3.3V, T
A
= +25C, and are not production tested. I
CCDC
= 90mA (Typ.)
2. At f = f
MAX
,
address and control lines (except Output Enable) are cycling at the maximum frequency read cycle of 1/t
RC,
and using "AC Test Conditions" of input levels of GND
to 3V.
3. f = 0 means no address or control lines change.
4. Port "A" may be either left or right port. Port "B" is the opposite from port "A".
5. Refer to Truth Table I - Chip Enable.
DC Electrical Characteristics Over the Operating
Temperature and Supply Voltage Range
(V
CC
= 3.3V 0.3V)
NOTES:
1. At Vcc
<
2.0V, input leakages are undefined.
2. Refer to Truth Table I -
Chip Enable
.
Symbol
Parameter
Test Conditions
70V09L
Unit
Min.
Max.
|I
LI
|
Input Leakage Current
(1)
V
CC
= 3.6V, V
IN
= 0V to V
CC
___
5
A
|I
LO
|
Output Leakage Current
CE
(2)
= V
IH
, V
OUT
= 0V to V
CC
___
5
A
V
OL
Output Low Voltage
I
OL
= +4mA
___
0.4
V
V
OH
Output High Voltage
I
OH
= -4mA
2.4
___
V
4852 tbl 09
70V09L15
Com'l Only
70V09L20
Com'l
& Ind
Symbol
Parameter
Test Condition
Version
Typ.
(1)
Max.
Typ.
(1)
Max.
Unit
I
CC
Dynamic Operating
Current
(Both Ports Active)
CE = V
IL
, Outputs Disabled
SEM = V
IH
f = f
MAX
(2)
COM'L
L
145
235
135
205
mA
IND
L
____
____
135
220
I
SB1
Standby Current
(Both Ports - TTL Level
Inputs)
CE
L
=
CE
R
= V
IH
SEM
R
=
SEM
L
= V
IH
f = f
MAX
(2)
COM'L
L
40
70
35
55
mA
IND
L
____
____
35
65
I
SB2
Standby Current
(One Port - TTL Level
Inputs)
CE
"A"
= V
IL
and
CE
"B"
= V
IH
(4)
Active Port Outputs Disabled,
f=f
MAX
(2)
,
SEM
R
=
SEM
L
= V
IH
COM'L
L
100
155
90
140
mA
IND
L
____
____
90
150
I
SB3
Full Standby Current
(Both Ports - All CMOS
Level Inputs)
Both Ports
CE
L
and
CE
R
> V
CC
- 0.2V,
V
IN
> V
CC
- 0.2V or V
IN
< 0.2V, f = 0
(3)
SEM
R
=
SEM
L
> V
CC
- 0.2V
COM'L
L
0.2
3.0
0.2
3.0
mA
IND
L
____
____
0.2
3.0
I
SB4
Full Standby Current
(One Port - All CMOS
Level Inputs)
CE
"A"
< 0.2V and
CE
"B"
> V
CC
- 0.2V
(4)
,
SEM
R
=
SEM
L
> V
CC
- 0.2V,
V
IN
> V
CC
- 0.2V or V
IN
< 0.2V,
Active Port Outp uts Disabled , f = f
MAX
(2)
COM'L
L
95
150
90
135
mA
IND
L
____
____
90
145
4852 tbl 10
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