ChipFind - документация

Электронный компонент: 72401

Скачать:  PDF   ZIP
Integrated Device Technology, Inc.
MILITARY AND COMMERCIAL TEMPERATURE RANGES
MAY 1998
1998 Integrated Device Technology, Inc.
DSC-2747/7
1
FEATURES:
First-ln/First-Out Dual-Port memory
64 x 4 organization (IDT72401/72403)
64 x 5 organization (IDT72402/72404)
RAM-based FIFO with low falI-through time
Low-power consumption
-- Active: 175mW (typ.)
Maximum shift rate -- 45MHz
High data output drive capability
Asynchronous and simultaneous read and write
Fully expandable by bit width
Fully expandable by word depth
IDT72403/72404 have Output Enable pin to enable
output data
High-speed data communications applications
High-performance CMOS technology
Available in CERDIP, plastic DIP and SOIC
Military product compliant to MlL-STD-883, Class B
Standard Military Drawing #5962-86846 and
5962-89523 is listed on this function.
Industrial temperature range (40
C to +85
C) is avail-
able (plastic packages only)
64 words by 5 bits. The IDT72403 and IDT72404 also have an
Output Enable (
OE
) pin. The FlFOs accept 4-bit or 5-bit data
at the data input (D
0-D3, 4
). The stored data stack up on a first-
in/first-out basis.
A Shift Out (SO) signal causes the data at the next to last
word to be shifted to the output while all other data shifts down
one location in the stack. The Input Ready (IR) signal acts like
a flag to indicate when the input is ready for new data
(IR = HIGH) or to signal when the FIFO is full (IR = LOW). The
IR signal can also be used to cascade multiple devices
together. The Output Ready (OR) signal is a flag to indicate
that the output remains valid data (OR = HIGH) or to indicate
that the FIFO is empty (OR = LOW). The OR can also be used
to cascade multiple devices together.
Width expansion is accomplished by logically ANDing the
IR and OR signals to form composite signals.
Depth expansion is accomplished by tying the data inputs
of one device to the data outputs of the previous device. The
IR pin of the receiving device is connected to the SO pin of the
sending device and the OR pin of the sending device is
connected to the Shift In (SI) pin of the receiving device.
Reading and writing operations are completely asynchro-
nous allowing the FIFO to be used as a buffer between two
digital machines of widely varying operating frequencies. The
45MHz speed makes these FlFOs ideal for high-speed com-
munication and controller applications.
Military grade product is manufactured in compliance with
the latest revision of MIL-STD-883, Class B.
IDT72401
IDT72402
IDT72403
IDT72404
CMOS PARALLEL FIFO
64 x 4 and 64 x 5
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
FAST is a trademark of National Semiconductor, Inc.
FUNCTIONAL BLOCK DIAGRAM
D
0-3
2747 drw 01
INPUT
CONTROL
LOGIC
DATA
MASTER
RESET
IN
WRITE POINTER
WRITE MULTIPLEXER
MEMORY
ARRAY
READ MULTIPLEXER
READ POINTER
OUTPUT
ENABLE
DATA
OUTPUT
CONTROL
LOGIC
OUT
SI
IR
D
4
(IDT72402
and IDT72404)
MR
OE (IDT72403 and
IDT72404)
Q
0-3
Q
4
(IDT72402 and
IDT72404)
SO
OR
DESCRIPTION:
The IDT72401 and IDT72403 are asynchronous high-
performance First-ln/First-Out memories organized 64 words
by 4 bits. The IDT72402 and IDT72404 are asynchronous
high-performance First-ln/First-Out memories organized as
For latest information contact IDT's web site at www.idt.com or fax-on-demand at 408-492-8391.
2
IDT72401/72402/72403/72404 CMOS PARALLEL FIFO
64 x 4 and 64 x 5
MILITARY AND COMMERCIAL TEMPERATURE RANGES
PIN CONFIGURATIONS
NOTES:
1. Pin 1: NC - No Connection IDT72401,
OE
- IDT72403
2. Pin 1: NC - No Connection IDT72402,
OE
- IDT72404
IDT72401/IDT72403
PLASTIC DIP (P18-1, order code: P)
CERDIP (D18-1, order code: D)
SOIC (SO18-1, order code: SO)
TOP VIEW
IDT72402/IDT72404
5
6
7
8
NC/OE
IR
1
2
3
4
16
15
14
13
12
11
10
9
Vcc
SI
D
0
D
1
D
2
GND
D
SO
OR
Q
0
Q
1
Q
2
Q
MR
3
3
(1)
2747 drw 02
5
6
7
8
9
1
2
3
4
18
17
16
15
14
13
12
11
10
NC/OE
IR
Vcc
SI
D
0
D
1
D
2
GND
D
SO
OR
Q
0
Q
1
Q
2
Q
MR
3
3
(2)
D
4
Q
4
2747 drw 03
PLASTIC DIP (P16-1, order code: P)
CERDIP (D16-1, order code: D)
SOIC (SO16-1, order code: SO)
TOP VIEW
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol
Rating
Commercial
Military
Unit
V
TERM
Terminal Voltage
0.5 to +7.0
0.5 to +7.0
V
with Respect
to GND
T
STG
Storage Temp.
55 to +125
65 to +150
C
I
OUT
DC Output
50 to +50
50 to +50
mA
Current
NOTE:
2747 tbl 01
1. Stresses greater than those listed under ABSOLUTE MAXIMUM
RATINGS may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or any other
conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min.
Typ. Max. Unit
V
CC
Supply Voltage
4.5
5.0
5.5
V
Commercial/Military
GND
Supply Voltage
0
0
0
V
V
IH
Input High Voltage
2.0
--
--
V
V
IL
(1)
Input High Voltage
--
--
0.8
V
T
A
Operating Temperature
0
--
70
C
Commercial
T
A
Operating Temperature
55
--
125
C
Military
NOTE:
2747 tbl 02
1. 1.5V undershoots are allowed for 10ns once per cycle.
DC ELECTRICAL CHARACTERISTICS
(Commercial: V
CC
= 5.0V
10%, T
A
= 0
C to +70
C; Military: V
CC
= 5.0V
10%, T
A
= 55
C to +125
C)
IDT72401
IDT72401
IDT72402
IDT72402
IDT72403
IDT72403
IDT72404
IDT72404
Commercial
Military
f
IN
= 45,35,25,15,10 MHz
f
IN
= 35,25,15,10 MHz
Symbol
Parameter
Test Conditions
Min.
Max.
Min.
Max.
Unit
I
IL
Low-Level Input Current
V
CC
= Max., GND
V
I
V
CC
10
--
10
--
A
I
IH
High-Level Input Current
V
CC
= Max., GND
V
I
V
CC
--
10
--
10
A
V
OL
Low-Level Output Voltage
V
CC
= Min., I
OL
= 8mA
--
0.4
--
0.4
V
V
OH
High-Level Output Voltage
V
CC
= Min., I
OH
= -4mA
2.4
--
2.4
--
V
I
OS
(1)
Output Short-Circuit Current
V
CC
= Max., V
O
= GND
20
110
20
110
mA
I
HZ
(2)
HIGH Impedance Output Current V
CC
= Max., V
O
= 2.4V
--
20
--
20
A
I
LZ
(2)
LOW Impedance Output Current
V
CC
= Max., V
O
= 0.4V
20
--
20
--
A
I
CC
(3,4)
Active Supply Current
V
CC
= Max., f = 10MHz
--
35
--
45
mA
NOTES:
2747 tbl 04
1. Not more than one output should be shorted at a time and duration of the short-circuit should not exceed one second. Guaranteed but not tested.
2. IDT72403 and IDT72404 only.
3. Tested with outputs open (I
OUT
= 0).
OE
is HIGH for IDT72403/72404.
4. For frequencies greater than 10MHz, I
CC
= 35mA + (1.5mA x [f - 10MHz]) commercial, and I
CC
= 45mA + (1.5mA x [f - 10MHz]) military.
IDT72401/72402/72403/72404 CMOS PARALLEL FIFO
64 x 4 and 64 x 5
MILITARY AND COMMERCIAL TEMPERATURE RANGES
3
OPERATING CONDITIONS
(Commercial: V
CC
= 5.0V
10%, T
A
= 0
C to +70
C; Military: V
CC
= 5.0V
10%, T
A
= 55
C to +125
C)
Commercial
Commercial and Military
IDT72401L45
IDT72401L35
IDT72401L25
IDT72401L15
IDT72401L10
IDT72402L45
IDT72402L35
IDT72402L25
IDT72402L15
IDT72402L10
IDT72403L45
IDT72403L35
IDT72403L25
IDT72403L15
IDT72403L10
IDT72404L45
IDT72404L35
IDT72404L25
IDT72404L15
IDT72404L10
Symbol
Parameter
Figure
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Unit
t
SIH
(1)
Shift in HIGH Time
2
9
--
9
--
11
--
11
--
11
--
ns
t
SIL
Shift in LOW TIme
2
11
--
17
--
24
--
25
--
30
--
ns
t
IDS
Input Data Set-up
2
0
--
0
--
0
--
0
--
0
--
ns
t
IDH
Input Data Hold Time
2
13
--
15
--
20
--
30
--
40
--
ns
t
SOH
(1)
Shift Out HIGH Time
5
9
--
9
--
11
--
11
--
11
--
ns
t
SOL
Shift Out LOW Time
5
11
--
17
--
24
--
25
--
25
--
ns
t
MRW
Master Reset Pulse
8
20
--
25
--
25
--
25
--
30
--
ns
t
MRS
Master Reset Pulse to SI
8
10
--
10
--
10
--
25
--
35
--
ns
t
SIR
Data Set-up to IR
4
3
--
3
--
5
--
5
--
5
--
ns
t
HIR
Data Hold from IR
4
13
--
15
--
20
--
30
--
30
--
ns
t
SOR
(4)
Data Set-up to OR HIGH
7
0
--
0
--
0
--
0
--
0
--
ns
2747 tbl 05
AC ELECTRICAL CHARACTERISTICS
(Commercial: V
CC
= 5.0V
10%, T
A
= 0
C to +70
C; Military: V
CC
= 5.0V
10%, T
A
= 55
C to +125
C)
Commercial
Commercial and Military
IDT72401L45
IDT72401L35
IDT72401L25
IDT72401L15
IDT72401L10
IDT72402L45
IDT72402L35
IDT72402L25
IDT72402L15
IDT72402L10
IDT72403L45
IDT72403L35
IDT72403L25
IDT72403L15
IDT72403L10
IDT72404L45
IDT72404L35
IDT72404L25
IDT72404L15
IDT72404L10
Symbol
Parameter
Figure
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Unit
f
IN
Shift In Rate
2
--
45
--
35
--
25
--
15
--
10
MHz
t
IRL
(1)
Shift In to Input Ready LOW
2
--
18
--
18
--
21
--
35
--
40
ns
t
IRH
(1)
Shift In to Input Ready HIGH
2
--
18
--
20
--
28
--
40
--
45
ns
f
OUT
Shift Out Rate
5
--
45
--
35
--
25
--
15
--
10
MHz
t
ORL
(1)
Shift Out to Output Ready LOW
5
--
18
--
18
--
19
--
35
--
40
ns
t
ORH
(1)
Shift Out to Output Ready HIGH
5
--
19
--
20
--
34
--
40
--
55
ns
t
ODH
Output Data Hold (Previous Word)
5
5
--
5
--
5
--
5
--
5
--
ns
t
ODS
Output Data Shift (Next Word)
5
--
19
--
20
--
34
--
40
--
55
ns
t
PT
Data Throughput or "Fall-Through"
4, 7
--
30
--
34
--
40
--
65
--
65
ns
t
MRORL
Master Reset to OR LOW
8
--
25
--
28
--
35
--
35
--
40
ns
t
MRIRH
Master Reset to IR HIGH
8
--
25
--
28
--
35
--
35
--
40
ns
t
MRQ
Master Reset to Data Output LOW
8
--
20
--
20
--
25
--
35
--
40
ns
t
OOE
(3)
Output Valid from
OE
LOW
9
--
12
--
15
--
20
--
30
--
35
ns
t
HZOE
(3,4)
Output High-Z from
OE
HIGH
9
--
12
--
12
--
15
--
25
--
30
ns
t
IPH
(2,4)
Input Ready Pulse HIGH
4
9
--
9
--
11
--
11
--
11
--
ns
t
OPH
(2,4)
Output Ready Pulse HIGH
7
9
--
9
--
11
--
11
--
11
--
ns
NOTES:
2747 tbl 06
1. Since the FIFO is a very high-speed device, care must be excercised in the design of the hardware and timing utilized within the design. Device grounding
and decoupling are crucial to correct operation as the FIFO will respond to very small glitches due to long reflective lines, high capacitances and/or poor
supply decoupling and grounding. A monolithic ceramic capacitor of 0.1
F directly between V
CC
and GND with very short lead length is recommended.
2. This parameter applies to FIFOs communicating with each other in a cascaded mode. IDT FIFOs are guaranteed to cascade with other IDT FIFOs of
like speed grades.
3. IDT72403 and IDT72404 only.
4. Guaranteed by design but not currently tested.
4
IDT72401/72402/72403/72404 CMOS PARALLEL FIFO
64 x 4 and 64 x 5
MILITARY AND COMMERCIAL TEMPERATURE RANGES
560
30pF*
1.1K
5V
OUTPUT
2747 drw 05
AC TEST CONDITIONS
Input Pulse Levels
GND to 3.0V
Input Rise/Fall Times
3ns
Input Timing Reference Levels
1.5V
Output Reference Levels
1.5V
Output Load
See Figure 1
2747 tbl 07
ALL INPUT PULSES:
SIGNAL DESCRIPTIONS
INPUTS:
DATA INPUT (D
0-3
,
4
)
Data input lines. The IDT72401 and IDT72403 have a 4-bit
data input. The IDT72402 and IDT72404 have a 5-bit data input.
CONTROLS:
SHIFT IN (SI)
Shift In controls the input of the data into the FIFO. When
SI is HIGH, data can be written to the FIFO via the D
0-3, 4
lines.
SHIFT OUT (SO)
Shift Out controls the output of data of the FIFO. When SO
is HIGH, data can be read from the FIFO via the Data Output
(Q
0-3, 4
) lines.
MASTER RESET (
MR
MR
MR
MR
MR
)
Master Reset clears the FIFO of any data stored within.
Upon power up, the FIFO should be cleared with a
MR
.
MR
is active LOW.
INPUT READY (IR)
When Input Ready is HIGH, the FIFO is ready for new input
data to be written to it. When IR is LOW the FIFO is unavailable
for new input data. IR is also used to cascade many FlFOs
together, as shown in Figures 10 and 11.
OUTPUT READY (OR)
When Output Ready is HIGH, the output (Q
0-3, 4
) contains
valid data. When OR is LOW, the FIFO is unavailable for new
output data. OR is also used to cascade many FlFOs together,
as shown in Figures 10 and 11.
OUTPUT ENABLE (
OE
OE
OE
OE
OE
) (IDT72403 AND IDT72404 ONLY)
Output enable is used to read FIFO data onto a bus.
OE
is
active LOW.
OUTPUTS:
DATA OUTPUT (Q
0-3
,
4
)
Data Output lines. The IDT72401 and IDT72403 have a 4-
bit data output. The IDT72402 and IDT72404 have a 5-bit data
output.
or equivalent circuit
Figure 1. AC Test Load
*Including scope and jig
CAPACITANCE
(T
A
= +25
C, f = 1.0MHz)
Symbol
Parameter
Conditions
Max.
Unit
C
IN
Input Capacitance
V
IN
= 0V
5
pF
C
OUT
Output Capacitance
V
OUT
= 0V
7
pF
NOTE:
2747 tbl 03
1. Characterized values, not currently tested.
2747 drw 04
GND
3.0V
90%
10%
90%
10%
<3ns
<3ns
IDT72401/72402/72403/72404 CMOS PARALLEL FIFO
64 x 4 and 64 x 5
MILITARY AND COMMERCIAL TEMPERATURE RANGES
5
FUNCTIONAL DESCRIPTION
These 64 x 4 and 64 x 5 FIFOs are designed using a dual
port RAM architecture as opposed to the traditional shift
register approach. This FIFO architecture has a write pointer,
a read pointer and control logic, which allow simultaneous
read and write operations. The write pointer is incremented by
the falling edge of the Shift In (Sl) control; the read pointer is
incremented by the falling edge of the Shift Out (SO). The
Input Ready (IR) signals when the FIFO has an available
memory location; Output Ready (OR) signals when there is
valid data on the output. Output Enable (
OE
) provides the
capability of three-stating the FIFO outputs.
FIFO RESET
The FIFO must be reset upon power up using the Master
Reset (
MR
) signal. This causes the FlFO to enter an empty state,
signified by Output Ready (OR) being LOW and Input Ready (IR)
being HIGH. In this state, the data outputs (Q
0-3, 4
) will be LOW.
DATA INPUT
Data is shifted in on the LOW-to-HlGH transition of Shift In (Sl).
This loads input data into the first word location of the FIFO and
causes Input Ready (IR) to go LOW. On the HlGH-to-LOW transi-
tion of SI, the write pointer is moved to the next word position and
IR goes HIGH, indicating the readiness to accept new data. If the
FIFO is full, IR will remain LOW until a word of data is shifted out.
DATA OUTPUT
Data is shifted out on the HlGH-to-LOW transition of Shift
Out (SO). This causes the internal read pointer to be
advanced to the next word location. If data is present, valid
data will appear on the outputs and Output Ready (OR) will
go HIGH. If data is not present, OR will stay LOW indicating
the FIFO is empty. The last valid word read from the FIFO will
remain at the FlFOs output when it is empty. When the FIFO
is not empty, OR goes LOW on the LOW-to-HIGH transition of
SO. Previous data remains on the output until the HIGH-to-
LOW transition of SO).
FALL THROUGH MODE
The FIFO operates in a fall-through mode when data gets
shifted into an empty FIFO. After a fall-through delay the data
propagates to the output. When the data reaches the output,
the Output Ready (OR) goes HIGH. Fall-through mode also
occurs when the FIFO is completely full. When data is shifted
out of the full FIFO, a location is available for new data. After
a fall-through delay, the Input Ready (IR) goes HIGH. If Shift
In (SI) is HIGH, the new data can be written to the FIFO.
Since these FlFOs are based on an internal dual-port RAM
architecture with separate read and write pointers, the fall-
through time (t
PT
) is one cycle long. A word may be written into
the FIFO on a clock cycle and can be accessed on the next
clock cycle.
Figure 3. The Mechanism of Shifting Data Into the FIFO
NOTES:
1. IR HIGH indicates space is available and a SI pulse may be applied.
2. Input Data is loaded into the first word.
3. IR goes LOW indicating the first word is full.
4. The write pointer is incremented.
5. The FIFO is ready for the next word.
6. If the FIFO is full then the IR remains LOW.
7. SI pulses applied while IR is LOW will be ignored (see Figure 4).
Figure 2. Input Timing
SI
IR
INPUT DATA
t
IRL
2747 drw 06
1/f
IN
1/f
IN
t
SIH
t
SIL
t
IRH
t
IDH
t
IDS
SI
IR
INPUT DATA
STABLE DATA
(2)
(3)
(5)
2747 drw 07
(6)
(4)
(1)
(7)
6
IDT72401/72402/72403/72404 CMOS PARALLEL FIFO
64 x 4 and 64 x 5
MILITARY AND COMMERCIAL TEMPERATURE RANGES
Figure 6. The Mechanism of Shifting Data Out of the FIFO
NOTES:
1. OR HIGH indicates that data is available and a SO pulse may be applied.
2. SO goes HIGH causing the next step.
3. OR goes LOW.
4. The read pointer is incremented.
5. OR goes HIGH indicating that new data (B) is now available at the FIFO outputs.
6. If the FIFO has only one word loaded (A DATA) then OR stays LOW and the A DATA remains unchanged at the outputs.
7. SO pulses applied when OR is LOW will be ignored.
Figure 5. Output TIming
STABLE DATA
SO
SI
IR
INPUT DATA
(2)
(3)
(1)
t
IPH
t
PT
(4)
(5)
2747 drw 08
t
HIR
t
SIR
NOTES:
1. FIFO is initially full.
2. SO pulse is applied.
3. SI is held HIGH.
4. As soon as IR becomes HIGH the Input Data is loaded into the FIFO.
5. The write pointer is incremented. SI should not go LOW until (t
PT
+ t
IPH
).
Figure 4. Data is Shifted In Whenever Shift In and Input Ready are Both HIGH
SO
OR
OUTPUT DATA
A- DATA
(2)
(3)
(5)
2747 drw 10
(6)
(4)
(1)
(7)
A or B
B- DATA
SO
OR
OUTPUT DATA
t
ORL
2747 drw 09
1/f
OUT
1/f
OUT
t
SOH
t
SOL
t
ODH
t
ORH
C-DATA
B-DATA
A-DATA
t
ODS
(2)
(1)
NOTES:
1. This data is loaded consecutively A, B, C.
2. Data is shifted out when SO makes a HIGH to LOW transition.
IDT72401/72402/72403/72404 CMOS PARALLEL FIFO
64 x 4 and 64 x 5
MILITARY AND COMMERCIAL TEMPERATURE RANGES
7
Figure 7. t
PT
and t
OPH
Specification
Figure 8. Master Reset Timing
Figure 9. Output Enable Timing, IDT72403 and IDT72404 Only
NOTE:
1. High-Z transitions are referenced to the steady-state V
OH
-500mV and V
OL
+500mV levels on the output. t
HZOE
is tested with 5pF load capacitance
instead of 30pF as shown in Figure 1.
2747 drw 14
D
0
D
1
D
2
D
3
IR
SI
Q
0
Q
1
Q
2
Q
3
SO
OR
MR
D
0
D
1
D
2
D
3
IR
SI
Q
0
Q
1
Q
2
Q
3
SO
OR
MR
SHIFT IN
INPUT READY
DATA IN
MR
OUTPUT READY
SHIFT OUT
DATA OUT
NOTE:
1. FIFOs can be easily cascaded to any desired path. The handshaking and associated timing between the FIFOs are handled by the inherent timing of
the devices.
Figure 10. 128 x 4 Depth Expansion
SI
SO
OR
(1)
t
OPH
t
PT
2747 drw 11
DATA OUTPUT
DATA VALID
t
SOR
HZOE
t
2747 drw 13
DATA OUT
OOE
t
NOTE:
1. FIFO initially empty.
IR
OR
t
MRW
2747 drw 12
SI
DATA OUTPUT
t
MRIRH
t
MRQ
(1)
(1)
t
MRORL
t
MRS
NOTE:
1. Worst case, FIFO initially full.
8
IDT72401/72402/72403/72404 CMOS PARALLEL FIFO
64 x 4 and 64 x 5
MILITARY AND COMMERCIAL TEMPERATURE RANGES
NOTES:
1. When the memory is empty, the last word will remain on the outputs until the
MR
is strobed or a new data word falls through to the output. However,
OR will remain LOW, indicating data at the output is not valid.
2. When the output data changes as a result of a pulse on SO, the OR signal always goes LOW before there is any change in output data and stays
LOW until the new data has appeared on the outputs. Anytime OR is HIGH, there is valid stable data on the outputs.
3. If SO is held HIGH while the memory is empty and a word is written into the input, that word will appear at the output after a fall-through time. OR will
go HIGH for one internal cycle (at least t
ORL
) and then go back LOW again. The stored word will remain on the outputs. If more words are written
into the FIFO, they will line up behind the first word and will not appear on the outputs until SO has been brought LOW.
4. When the
MR
is brought LOW, the outputs are cleared to LOW, IR goes HIGH and OR goes LOW. If SI is HIGH when the
MR
goes HIGH, the data
on the inputs will be written into the memory and IR will return to the LOW state until SI is brought LOW. If SI is LOW when the
MR
is ended, IR will
go HIGH, but the data in the inputs will not enter the memory until SI goes HIGH.
5. FIFOs are expandable on depth and width. However, in forming wider words, two external gates are required to generate composite Input and OR
flags. This is due to the variation of delays of the FIFOs.
Figure 11. 192 x 12 Depth and Width Expansion
ORDERING INFORMATION
2747 drw 15
D
0
D
1
D
2
D
3
IR
SI
Q
0
Q
1
Q
2
Q
3
SO
OR
MR
D
0
D
1
D
2
D
3
Q
0
Q
1
Q
2
Q
3
MR
D
0
D
1
D
2
D
3
Q
0
Q
1
Q
2
Q
3
MR
D
0
D
1
D
2
D
3
Q
0
Q
1
Q
2
Q
3
MR
D
0
D
1
D
2
D
3
Q
0
Q
1
Q
2
Q
3
MR
D
0
D
1
D
2
D
3
Q
0
Q
1
Q
2
Q
3
MR
D
0
D
1
D
2
D
3
SI
IR
Q
0
Q
1
Q
2
Q
3
OR
SO
MR
D
0
D
1
D
2
D
3
SI
IR
Q
0
Q
1
Q
2
Q
3
OR
SO
MR
D
0
D
1
D
2
D
3
SI
IR
Q
0
Q
1
Q
2
Q
3
OR
SO
MR
SHIFT OUT
COMPOSITE
OUTPUT
READY
MR
SHIFT IN
COMPOSITE
INPUT
READY
IR
SI
SO
OR
IR
SI
SO
OR
IR
SI
SO
OR
IR
SI
SO
OR
IR
SI
SO
OR
IDT
XXXXX
Device Type
X
Speed
X
Power
X
Package
X
Process/
Temperature
Range
Blank
B
P
D
SO
L
72401
72402
72403
72404
45
35
25
15
10
Commercial (0
C to+70
C)
Military (55
C to+125
C)
Compliant to MIL-STD-883, Class B
Plastic DIP
CERDIP
Small Outline IC
Commercial Only
Commercial and Military
Commercial and Military
Commercial and Military
Commercial and Military
Low Power
64 x 4 FIFO
64 x 5 FIFO
64 x 4 FIFO
64 x 5 FIFO
Shift Frequency (fs)
Speed in MHz
2747 drw 16
300 mil, P16-1
300 mil, D16-1
SOIC, SO16-1
300 mil, P18-1
300 mil, D18-1
SOIC, SO18-1
72401/72403
72402/72404
NOTE:
1. Industrial temperature range is available by special order.