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Электронный компонент: BAR80

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BAR80
Aug-17-2001
1
Silicon RF Switching Diode
Design for use in shunt configuration
High shunt signal isolation
Low shunt insertion loss
4
3
1
2
VSO05553
Type
Marking
Pin Configuration
Package
BAR80
AAs
1 = C
2 = A
3 = C
4 = A
MW-4
Maximum Ratings
Symbol
Value
Unit
Parameter
Diode reverse voltage
V
V
R
35
I
F
100
mA
Forward current
Junction temperature
150
C
T
j
Operating temperature range
T
op
-55 ... 125
Storage temperature
T
stg
-55 ... 150
BAR80
Aug-17-2001
2
Electrical Characteristics at T
A
= 25C, unless otherwise specified.
Parameter
Symbol
Values
Unit
min.
typ.
max.
DC characteristics
Reverse current
V
R
= 20 V
I
R
-
-
20
nA
Forward voltage
I
F
= 100 mA
V
F
0.8
-
1
V
AC characteristics
Diode capacitance
V
R
= 1 V, f = 1 MHz
V
R
= 3 V, f = 1 MHz
C
T
-
0.6
1
0.92
1.6
1.3
pF
Forward resistance
I
F
= 5 mA, f = 100 MHz
r
f
-
0.5
0.7
Series inductance chip to ground
L
s
-
0.14
-
nH
Application information
Shunt signal isolation
I
F
= 10 mA, f = 2 GHz, R
G
=R
L
=50
S
I
-
23
-
dB
Shunt insertion loss
V
R
= 5 V, f = 2 GHz, R
G
=R
L
=50
I
L
-
0.15
-
Configuration of the shunt-diode
- A perfect ground is essential for optimum isolation
- The anode pins should be used as passage for RF
BAR80
Aug-17-2001
3
Forward current I
F
= f (T
S
)
0
20
40
60
80
100
120 C
150
T
S
0
20
40
60
80
100
120
mA
160
I
F
Permissible Pulse Load R
thJS
= f(t
p
)
10
-6
10
-5
10
-4
10
-3
10
-2
10
0
s
t
p
0
10
1
10
2
10
3
10
K/W
R
thJS
0.5
0.2
0.1
0.05
0.02
0.01
0.005
D = 0
Permissible Pulse Load
I
Fmax
/ I
FDC
= f(t
p
)
10
-7
10
-6
10
-5
10
-4
10
-3
10
-2
10
0
s
t
p
0
10
1
10
2
10
-
I
Fmax
/
I
FDC
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
BAR80
Aug-17-2001
4
Forward resistance
r
f
= f (I
F
)
f
= 100MHz
10
EHD07010
r
f
F
-1
0
10
1
10
2
10
mA
-1
10
10
1
10
0
Diode capacitance
C
T
= f (V
R
)
f
= 1MHz
0
0.0
EHD07009
C
T
R
V
10
20
V
30
0.4
0.8
1.2
1.6
pF
2.0