2004-01-27
Page 1
BSP 772 T
Smart Power High-Side-Switch
Product Summary
Overvoltage protection
V
bb(AZ)
41
V
Operating voltage
V
bb(on)
5...34 V
On-state resistance
R
ON
60
m
Nominal load current
I
L(nom)
2.6
A
Features
Overload protection
Current limitation
Short circuit protection
Thermal shutdown with restart
Overvoltage protection (including load dump)
Fast demagnetization of inductive loads
Reverse battery protection with external resistor
CMOS compatible input
Loss of GND and loss of V
bb
protection
ESD - Protection
Very low standby current
Application
All types of resistive, inductive and capacitive loads
C compatible power switch for 12 V and 24 V DC applications
Replaces electromechanical relays and discrete circuits
General Description
N channel vertical power FET with charge pump, ground referenced CMOS compatible input,
monolithically integrated in Smart SIPMOS
technology.
Providing embedded protective functions.
2004-01-27
Page 2
BSP 772 T
Block Diagram
+ Vbb
IN
Signal GND
ESD
miniPROFET
OUT
GND
Logic
Voltage
source
Charge pump
Level shifter
Temperature
sensor
Rectifier
Limit for
unclamped
ind. loads
Gate
protection
Current
limit
Load GND
Load
V
Logic
Overvoltage
protection
Pin
Symbol
Function
1
GND
Logic ground
2
IN
Input, activates the power switch in case of logic high signal
3
OUT
Output to the load
4
NC
not connected
5
Vbb
Positive power supply voltage
6
Vbb
Positive power supply voltage
7
Vbb
Positive power supply voltage
8
Vbb
Positive power supply voltage
Pin configuration
GND
1
8
Vbb
IN
2
7
Vbb
OUT
3
6
Vbb
NC
4
5
Vbb
Top view
2004-01-27
Page 3
BSP 772 T
Maximum Ratings at T
j
= 25C, unless otherwise specified
Parameter
Symbol
Value
Unit
Supply voltage
V
bb
40
V
Supply voltage for full short circuit protection
T
j
= -40...+150 C
V
bb(SC)
36
Continuous input voltage
V
IN
-10 ... +16
Load current (Short - circuit current, see page 5) I
L
self limited
A
Current through input pin (DC)
I
IN
5
mA
Operating temperature
T
j
-40 ...+150
C
Storage temperature
T
stg
-55 ... +150
Power dissipation
1)
P
tot
1.5
W
Inductive load switch-off energy dissipation
1)2)
single pulse, (see page 8)
Tj =150 C, V
bb
= 13.5 V, I
L
= 1.5 A
E
AS
900
mJ
Load dump protection
2)
V
LoadDump
3)
= V
A
+ V
S
R
I
=2
, t
d
=400ms, V
IN
= low or high, V
A
=13,5V
R
L
= 9
V
Loaddump
63
V
Electrostatic discharge voltage
(Human Body Model)
according to ANSI EOS/ESD - S5.1 - 1993
ESD STM5.1 - 1998
Input pin
all other pins
V
ESD
1
5
kV
Thermal Characteristics
Thermal resistance @ min. footprint
R
th(JA)
-
95
-
K/W
Thermal resistance @ 6 cm
2
cooling area
1)
R
th(JA)
-
70
83
1Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer, 70m thick) copper area for drain
connection. PCB is vertical without blown air. (see page 16)
2not subject to production test, specified by design
3VLoaddump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839 .
Supply voltages higher than Vbb(AZ) require an external current limit for the GND pin, e.g. with a
150
resistor in GND connection. A resistor for the protection of the input is integrated.
2004-01-27
Page 4
BSP 772 T
Electrical Characteristics
Parameter and Conditions
Symbol
Values
Unit
at T
j
= -40...+150C, V
bb
= 13,5V,
unless otherwise specified
min.
typ.
max.
Load Switching Capabilities and Characteristics
On-state resistance
T
j
= 25 C, I
L
= 2 A, V
bb
= 9...40 V
T
j
= 150 C
R
ON
-
-
50
95
60
120
m
Nominal load current; Device on PCB
1)
T
C
= 85 C, T
j
150 C
I
L(nom)
2.6
3.1
-
A
Turn-on time to 90%
V
OUT
R
L
= 47
t
on
-
90
180
s
Turn-off time to 10%
V
OUT
R
L
= 47
t
off
-
110
230
Slew rate on 10 to 30% V
OUT
,
R
L
= 47
dV/dt
on
-
0.7
1.5
V/s
Slew rate off 70 to 40% V
OUT
,
R
L
= 47
-dV/dt
off
-
0.7
1.5
Operating Parameters
Operating voltage
V
bb(on)
5
-
34
V
Undervoltage shutdown of charge pump
T
j
= -40...+85 C
T
j
= 150 C
V
bb(under)
-
-
-
-
4
5.5
Undervoltage restart of charge pump
V
bb(u cp)
-
4
5.5
Standby current
T
j
= -40...+85 C, V
IN
= 0 V
T
j
= 150 C
2)
, V
IN
= 0 V
I
bb(off)
-
-
-
-
10
15
A
Leakage output current (included in
I
bb(off)
)
V
IN
= 0 V
I
L(off)
-
-
5
Operating current
V
IN
= 5 V
I
GND
-
0.8
1.5
mA
1Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer, 70m thick) copper area for drain
connection. PCB is vertical without blown air. (see page 16)
2higher current due temperature sensor
2004-01-27
Page 5
BSP 772 T
Electrical Characteristics
Parameter and Conditions
Symbol
Values
Unit
at T
j
= -40...+150C, V
bb
= 13,5V,
unless otherwise specified
min.
typ.
max.
Protection Functions
1)
Initial peak short circuit current limit (pin 5 to 3)
T
j
= -40 C, V
bb
= 20 V, t
m
= 150 s
T
j
= 25 C
T
j
= 150 C
I
L(SCp)
-
-
9
-
17
-
28
-
-
A
Repetitive short circuit current limit
T
j
= T
jt
(see timing diagrams)
I
L(SCr)
-
12
-
Output clamp (inductive load switch off)
at V
OUT
= V
bb
- V
ON(CL)
,
I
bb
= 4 mA
V
ON(CL)
41
47
-
V
Overvoltage protection
2)
I
bb
= 4 mA
V
bb(AZ)
41
-
-
Thermal overload trip temperature
T
jt
150
-
-
C
Thermal hysteresis
T
jt
-
10
-
K
Reverse Battery
Reverse battery
3)
-V
bb
-
-
32
V
Drain-source diode voltage (V
OUT
> V
bb
)
T
j
= 150 C
-V
ON
-
600
-
mV
1Integrated protection functions are designed to prevent IC destruction under fault conditions
described in the data sheet. Fault conditions are considered as "outside" normal operating range.
Protection functions are not designed for continuous repetitive operation .
2 see also VON(CL) in circuit diagram on page 7
3Requires a 150
resistor in GND connection. The reverse load current through the intrinsic drain-source diode has
to be limited by the connected load. Power dissipation is higher compared to normal operating conditions due to the
voltage drop across the drain-source diode. The temperature protection is not active during reverse current operation!
Input current has to be limited (see max. ratings page 3).
2004-01-27
Page 6
BSP 772 T
Electrical Characteristics
Parameter and Conditions
Symbol
Values
Unit
at T
j
= -40...+150C, V
bb
= 13,5V,
unless otherwise specified
min.
typ.
max.
Input
Input turn-on threshold voltage
(see page 12)
V
IN(T+)
-
-
2.2
V
Input turn-off threshold voltage
(see page 12)
V
IN(T-)
0.8
-
-
Input threshold hysteresis
V
IN(T)
-
0.3
-
Off state input current (see page 12)
V
IN
= 0.7 V
I
IN(off)
1
-
25
A
On state input current (see page 12)
V
IN
= 5 V
I
IN(on)
3
-
25
Input resistance (see page 7)
R
I
1.5
3.5
5
k
2004-01-27
Page 7
BSP 772 T
Terms
Inductive and overvoltage output clamp
PROFET
V
IN
OUT
GND
bb
V IN
IIN
V
bb
Ibb
IL
VOUT
IGND
VON
RGND
+ Vbb
OUT
GND
VZ
VON
VON clamped to 47V typ.
Overvoltage protection of logic part
Input circuit (ESD protection)
+ Vbb
IN
GND
GND
R
Signal GND
Logic
V
Z2
I
R
V Z1
IN
GND
I
R
ZD
I
I
I
ESD-
The use of ESD zener diodes as voltage clamp
at DC conditions is not recommended
V
Z1
=6.1V typ., V
Z2
=V
bb(AZ)
=47V typ.,
R
I
=3.5 k
typ., R
GND
=150
Reverse battery protection
GND
Logic
IN
OUT
L
R
Power GND
GND
R
Signal GND
Power
Inverse
I
R
Vbb
-
Diode
R
GND
=150
, R
I
=3.5k
typ.,
Temperature protection is not active during
inverse current
2004-01-27
Page 8
BSP 772 T
Vbb disconnect with charged inductive
load
PROFET
V
IN
OUT
GND
bb
V
bb
high
GND disconnect
PROFET
V
IN
OUT
GND
bb
V
bb
V
IN
V
GND
Inductive Load switch-off energy
dissipation
PROFET
V
IN
OUT
GND
bb
=
E
E
E
EAS
bb
L
R
ELoad
RL
L
{
L
Z
GND disconnect with GND pull up
PROFET
V
IN
OUT
GND
bb
V
bb
V
GND
V
IN
Energy stored in load inductance: E
L
= * L * I
L
2
While demagnetizing load inductance,
the enrgy dissipated in PROFET is
E
AS
= E
bb
+ E
L
- E
R
=
V
ON(CL)
* i
L
(t) dt,
with an approximate solution for R
L
> 0
:
E
I
L
R
V
V
I
R
V
A S
L
L
b b
O U T C L
L
L
O U T C L
=
+
+
*
*
* (
|
) * ln (
*
|
|
)
(
)|
(
)
2
1
2004-01-27
Page 9
BSP 772 T
Typ. transient thermal impedance
Z
thJA
=f(t
p
) @ 6cm
2
heatsink area
Parameter: D=t
p
/T
10
-7
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
10
4
s
t
p
-2
10
-1
10
0
10
1
10
2
10
K/W
Z
thJA
D=0
D=0.01
D=0.02
D=0.05
D=0.1
D=0.2
D=0.5
Typ. transient thermal impedance
Z
thJA
=f(t
p
) @ min. footprint
Parameter: D=t
p
/T
10
-7
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
10
4
s
t
p
-2
10
-1
10
0
10
1
10
2
10
K/W
Z
thJA
D=0
D=0.01
D=0.02
D=0.05
D=0.1
D=0.2
D=0.5
Typ. on-state resistance
R
ON
= f(T
j
) ; V
bb
= 13,5V ; V
in
= high
-40 -20
0
20
40
60
80 100 120
C
160
T
j
0
20
40
60
m
100
R
ON
Typ. on-state resistance
R
ON
= f(V
bb
); I
L
= 0.5A ; V
in
= high
0
5
10
15
20
25
30
V
40
V
bb
0
20
40
60
80
m
120
R
ON
-40C
25C
150C
2004-01-27
Page 10
BSP 772 T
Typ. turn off time
t
off
= f(T
j
); R
L
= 47
-40 -20
0
20
40
60
80 100 120
C
160
T
j
0
20
40
60
80
100
120
140
s
180
t
off
9V
32V
Typ. turn on time
t
on
= f(T
j
); R
L
= 47
-40 -20
0
20
40
60
80 100 120
C
160
T
j
0
20
40
60
80
100
s
140
t
on
9V
13.5V
32V
Typ. slew rate on
dV/dt
on
= f(T
j
) ; R
L
= 47
-40 -20
0
20
40
60
80 100 120
C
160
T
j
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
V/s
2
d
V
d
t
on
9V
13.5V
32V
Typ. slew rate off
dV/dt
off
= f(T
j
); R
L
= 47
-40 -20
0
20
40
60
80 100 120
C
160
T
j
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
V/s
2
-d
V
d
t
off
9V
13.5V
32V
2004-01-27
Page 11
BSP 772 T
Typ. leakage current
I
L(off)
= f(T
j
) ; V
bb
= 32V ; V
IN
= low
-40 -20
0
20
40
60
80 100 120
C
160
T
j
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
A
2.2
I
L(off)
Typ. standby current
I
bb(off)
= f(T
j
) ; V
bb
= 32V ; V
IN
= low
-40 -20
0
20
40
60
80 100 120
C
160
T
j
0
1
2
3
4
A
6
I
bb(off)
Typ. initial short circuit shutdown time
t
off(SC)
= f(T
j,start
) ; V
bb
= 20V
-40 -20
0
20
40
60
80 100 120
C
160
T
j
0
0.5
1
1.5
2
ms
3
t
off(SC)
Typ. initial peak short circuit current limit
I
L(SCp)
= f(T
j
) ; V
bb
= 20V
-40 -20
0
20
40
60
80 100 120
C
160
T
j
0
5
10
15
A
25
I
L(SCp)
2004-01-27
Page 12
BSP 772 T
Typ. input current
I
IN(on/off)
= f(T
j
); V
bb
= 13,5V; V
IN
= low/high
V
IN
low
0,7V;
V
IN
high
= 5V
-40 -20
0
20
40
60
80 100 120
C
160
T
j
0
2
4
6
8
A
12
I
IN
on
off
Typ. input current
I
IN
= f(V
IN
); V
bb
= 13.5V
0
2
4
V
8
V
IN
0
20
40
60
80
100
120
140
160
A
200
I
IN
-40...25C
150C
Typ. input threshold voltage
V
IN(th)
= f(T
j
) ; V
bb
= 13,5V
-40 -20
0
20
40
60
80 100 120
C
160
T
j
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
V
2
V
IN(th)
on
off
Typ. input threshold voltage
V
IN(th)
= f(V
bb
) ; T
j
= 25C
5
10
15
20
25
V
35
V
bb
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
V
2
V
IN(th)
on
off
2004-01-27
Page 13
BSP 772 T
Maximum allowable load inductance
for a single switch off
L = f(I
L
); T
jstart
=150C, V
bb
=13.5V, R
L
=0
0
0.5
1
1.5
2
2.5
A
3.5
I
L
0
250
500
750
1000
1250
1500
mH
2000
L
Maximum allowable inductive switch-off
energy, single pulse
E
AS
= f(I
L
); T
jstart
= 150C, V
bb
= 13,5V
0
0.5
1
1.5
2
2.5
A
3.5
I
L
0
200
400
600
800
1000
mJ
1400
E
AS
2004-01-27
Page 14
BSP 772 T
Timing diagrams
Figure 2b: Switching a lamp,
Figure 1a: Vbb turn on:
IN
OUT
L
t
I
IN
V
OUT
V
bb
t
Figure 2a: Switching a resistive load,
turn-on/off time and slew rate definition
Figure 2c: Switching an inductive load
IN
t
V
O U T
I
L
t
t
o n
o f f
9 0 %
d V /d t o n
d V /d to f f
1 0 %
IN
L
t
V
I
OUT
2004-01-27
Page 15
BSP 772 T
Figure 3a: Turn on into short circuit,
shut down by overtemperature, restart by cooling
t
I
IN
L
L(SCr)
I
I
L(SCp)
t
off(SC)
t
m
t
Figure 5: Undervoltage restart of charge pump
Heating up of the chip may require several milliseconds, depending
on external conditions.
V
o n
V
b b ( u n d e r )
V
b b ( u c p )
V
b b
Figure 4: Overtemperature:
Reset if Tj < Tjt
IN
OUT
J
t
V
T
2004-01-27
Page 16
BSP 772 T
Package and ordering code
all dimensions in mm
Package:
Ordering code:
P-DSO-8-6
Q67060-S7302-A2
Printed circuit board (FR4, 1.5mm thick, one
layer 70m, 6cm2 active heatsink area ) as
a reference for max. power dissipation P
tot
nominal load current I
L(nom)
and thermal
resistance R
thja
Published by
Infineon Technologies AG,
St.-Martin-Strasse 53,
D-81669 Mnchen
Infineon Technologies AG 2001
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as a guarantee
of characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,
regarding circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your
nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide
(see address list).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the
types in question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device
or system. Life support devices or systems are intended to be implanted in the human body, or to support
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health
of the user or other persons may be endangered.
PDF 
ZIP