LS M776, LA M776, LO M776, LY M776
Hyper Mini TOPLED RG
Hyper-Bright LED
2001-02-12
1
Besondere Merkmale
Gehusetyp: weies SMT-Gehuse
Besonderheit des Bauteils: kleine Bauform
fr Anwendungen mit wenig Platzbedarf;
Bauteil wird top-down montiert und strahlt
durch das PCB
Wellenlnge: 633 nm (super-rot),
615 nm (amber), 606 nm (orange),
587 nm (gelb)
Abstrahlwinkel: Lambertscher Strahler (120)
Technologie: InGaAlP
optischer Wirkungsgrad: 11 lm/W (gelb,
orange, amber), 7 lm/W (super-rot)
Gruppierungsparameter: Lichtstrke
Verarbeitungsmethode: fr alle
SMT-Bestcktechniken geeignet
Ltmethode: IR Reflow Lten
Vorbehandlung: nach JEDEC Level 2
Gurtung: 12 mm Gurt mit 3000/Rolle,
180 mm oder 11800/Rolle, 330 mm
Anwendungen
optischer Indikator
Einkopplung in Lichtleiter
Hinterleuchtung (LCD, Handy, Schalter,
Tasten, Displays, Werbebeleuchtung,
Allgemeinbeleuchtung)
Innenbeleuchtung im Automobilbereich
(z.B. Instrumentenbeleuchtung, u..)
Features
package: white SMT package
feature of the device: small package for
applications where small space is required;
LED is mounted top down and emits through
the PCB
wavelength: 633 nm (super-red), 615 (amber),
606 nm (orange), 587 nm (yellow)
viewing angle: Lambertian Emitter (120)
technology: InGaAlP
optical efficiency: 11 lm/W (yellow,
orange, amber), 7 lm/W (super-red)
grouping parameter: luminous intensity
assembly methods: suitable for all
SMT assembly methods
soldering methods: IR reflow soldering
preconditioning: acc. to JEDEC Level 2
taping: 12 mm tape with 3000/reel, 180 mm
or 11800/reel, 330 mm
Applications
optical indicators
coupling into light guides
backlighting (LCD, cellular phones, switches,
keys, displays, illuminated advertising, general
lighting)
interior automotive lighting. (e.g. dashboard
backlighting, etc.)
2001-02-12
2
LS M776, LA M776, LO M776, LY M776
Anm.: -1 gesamter Farbbereich, Lieferung in Einzelgruppen (siehe Seite 5)
Die Standardlieferform von Serientypen beinhaltet eine untere bzw. eine obere Familiengruppe,
die aus nur 3 bzw. 4 Halbgruppen besteht. Einzelne Halbgruppen sind nicht erhltlich.
In einer Verpackungseinheit / Gurt ist immer nur eine Halbgruppe enthalten.
Note: -1 Total color tolerance range, delivery in single groups (please see page 5)
The standard shipping format for serial types includes a lower or upper family group of 3 or 4
individual groups. Individual half groups are not available.
No packing unit / tape ever contains more than one luminous intensity half group.
Typ
Type
Emissions-
farbe
Color of
Emission
Farbe der
Lichtaustritts-
flche
Color of the
Light Emitting
Area
Lichtstrke
Luminous
Intensity
I
F
= 20 mA
I
V
(mcd)
Lichtstrom
Luminous
Flux
I
F
= 20 mA
V
(mlm)
Bestellnummer
Ordering Code
LS M776-N2P2-1
LS M776-P2R1-1
super-red
colorless clear
35.5 ... 71.0
56.0 ... 140.0
150 (typ.)
280 (typ.)
Q62703-Q5089
Q62703-Q5090
LA M776-P2Q2-1
LA M776-Q2S1-1
amber
colorless clear
56.0 ... 112.0
90.0 ... 224.0
240 (typ.)
440 (typ.)
Q62703-Q4980
Q62703-Q4981
LO M776-Q1R1-1
LO M776-R1S2-1
orange
colorless clear
71.0 ... 140.0
112.0 ... 280.0
310 (typ.)
560 (typ.)
Q62703-Q5044
Q62703-Q5045
LY M776-P2Q2-1
LY M776-Q2S1-1
yellow
colorless clear
56.0 ... 112.0
90.0 ... 224.0
240 (typ.)
440 (typ.)
Q62703-Q5127
Q62703-Q5128
LS M776, LA M776, LO M776, LY M776
2001-02-12
3
Bezeichnung
Parameter
Symbol
Symbol
Werte
Values
Einheit
Unit
LS, LO, LA LY
Betriebstemperatur
Operating temperature range
T
op
40 ... + 100
C
Lagertemperatur
Storage temperature range
T
stg
40 ... + 100
C
Sperrschichttemperatur
Junction temperature
T
j
+ 125
C
Durchlassstrom
Forward current
I
F
30
mA
Stostrom
Surge current
t
10
s,
D
= 0.005
I
FM
0.8
0.2
A
Sperrspannung
Reverse voltage
V
R
3
V
Leistungsaufnahme
Power consumption
P
tot
80
mW
Wrmewiderstand
Thermal resistance
Sperrschicht/Umgebung
Junction/ambient
Sperrschicht/Ltpad
Junction/solder point
Montage auf PC-Board FR 4 (Padgre
16 mm
2
)
mounted on PC board FR 4 (pad size
16 mm
2
)
R
th JA
R
th JS
580
330
K/W
K/W
2001-02-12
4
LS M776, LA M776, LO M776, LY M776
Bezeichnung
Parameter
Symbol
Symbol
Werte
Values
Einheit
Unit
LS
LA
LO
LY
Wellenlnge des emittierten Lichtes
(typ.)
Wavelength at peak emission
I
F
= 20 mA
peak
645
622
610
591
nm
Dominantwellenlnge
1)
(typ.)
Dominant wavelength
I
F
= 20 mA
dom
633
6
615
6
606
6
587
+8/7
nm
Spektrale Bandbreite bei 50 %
I
rel max
(typ.)
Spectral bandwidth at 50 %
I
rel max
I
F
= 20 mA
16
16
16
15
nm
Abstrahlwinkel bei 50 %
I
V
(Vollwinkel)
(typ.)
Viewing angle at 50 %
I
V
2
120
120
120
120
Grad
deg.
Durchlassspannung
2)
(typ.)
Forward voltage
2)
(max.)
I
F
= 20 mA
V
F
V
F
2.0
2.4
2.0
2.4
2.0
2.4
2.0
2.4
V
V
Sperrstrom
(typ.)
Reverse current
(max.)
V
R
= 3 V
I
R
I
R
0.01
10
0.01
10
0.01
10
0.01
10
A
A
Temperaturkoeffizient von
peak
(typ.)
Temperature coefficient of
peak
I
F
= 20 mA; 10C
T
100C
TC
peak
0.14 0.13 0.13 0.13 nm/K
Temperaturkoeffizient von
dom
(typ.)
Temperature coefficient of
dom
I
F
= 20 mA; 10C
T
100C
TC
dom
0.01 0.06 0.07 0.10 nm/K
Temperaturkoeffizient von
V
F
(typ.)
Temperature coefficient of
V
F
I
F
= 20 mA; 10C
T
100C
TC
V
2.0 1.8 1.7 2.5 mV/K
Optischer Wirkungsgrad
(typ.)
Optical efficiency
I
F
= 20 mA
opt
7
11
11
11
lm/W
1)
Wellenlngen werden mit einer Stromeinprgedauer von 25 ms und einer Genauigkeit von 1 nm ermittelt.
Wavelengths are tested at a current pulse duration of 25 ms and a tolerance of 1 nm.
2)
Spannungswerte werden mit einer Stromeinprgedauer von 1 ms und einer Genauigkeit von 0.1 V ermittelt.
Voltages are tested at a current pulse duration of 1 ms and a tolerance of 0.1 V.
LS M776, LA M776, LO M776, LY M776
2001-02-12
5
Helligkeitswerte werden mit einer Stromeinprgedauer von 25 ms und einer Genauigkeit von
11% ermittelt.
Luminous intensity is tested at a current pulse duration of 25 ms and a tolerance of
11%.
1)
Wellenlngengruppen / Wavelength groups
Gruppe
Group
yellow
orange
Einheit
Unit
min.
max. min.
max.
2
580
583
600
603
nm
3
583
586
603
606
nm
4
586
589
606
609
nm
5
589
592
609
612
nm
6
592
595
nm
Helligkeits-Gruppierungsschema
Luminous Intensity Groups
Lichtgruppe
Luminous Intensity Group
Lichtstrke
Luminous Intensity
I
V
(mcd)
Lichtstrom
Luminous Flux
V
(mlm)
N2
P1
P2
Q1
Q2
R1
R2
S1
S2
35.5 ... 45.0
45.0 ... 56.0
56.0 ... 71.0
71.0 ... 90.0
90.0 ...112.0
112.0 ...140.0
140.0 ...180.0
180.0 ...224.0
224.0 ...280.0
120 (typ.)
150 (typ.)
190 (typ.)
240 (typ.)
300 (typ.)
380 (typ.)
480 (typ.)
600 (typ.)
760 (typ.)
Gruppenbezeichnung auf Etikett
Group Name on Label
Beispiel: S2-3
Example: S2-3
Lichtgruppe
Luminous Intensity Group
Halbgruppe
Half Group
Wellenlnge
Wavelength
S
2
3
2001-02-12
6
LS M776, LA M776, LO M776, LY M776
Relative spektrale Emission
I
rel
=
f
(
),
T
A
= 25 C,
I
F
= 20 mA
Relative Spectral Emission
V(
) = spektrale Augenempfindlichkeit
Standard eye response curve
Abstrahlcharakteristik
I
rel
=
f
(
)
Radiation Characteristic
OHL00235
400
0
20
40
60
80
100
450
500
550
600
650
700
nm
%
I
rel
V
yellow
orange
amber
super-red
0
0.2
0.4
1.0
0.8
0.6
1.0
0.8
0.6
0.4
0
10
20
40
30
OHL01660
50
60
70
80
90
100
0
20
40
60
80
100
120
LS M776, LA M776, LO M776, LY M776
2001-02-12
7
Durchlassstrom
I
F
=
f
(
V
F
)
Forward Current
T
A
= 25 C
Maximal zulssiger Durchlassstrom
I
F
=
f
(
T
)
Max. Permissible Forward Current
Relative Lichtstrke
I
V
/
I
V(20 mA)
=
f
(
I
F
)
Relative Luminous Intensity
T
A
= 25 C
Relative Lichtstrke
I
V
/
I
V(25 C)
=
f
(
T
A
)
Relative Luminous Intensity
I
F
= 20 mA
OHL00232
10
-1
1.4
1.8
2.2
2.6
3 V 3.4
0
10
1
10
10
2
5
5
mA
5
1
F
V
F
I
OHL01033
0
0
20
40
60
80 C 100
T
I
F
temp. ambient
temp. solder point
A
S
T
T
5
10
15
20
25
30
35
mA
A
T
S
T
I
OHL00233
F
-1
10
V
I
10
-3
-2
-1
0
1
10
10
10
10
10
0
10
1
10
2
5
5
5
5
5
mA
(20 mA)
I
V
super-red
yellow
orange/amber
T
OHL00238
0
V
I
-20
0
20
40
60
C 100
orange
A
0.4
0.8
1.2
1.6
2.0
I
V
(25 C)
yellow
amber
super-red
super-red
amber
yellow
orange
LS M776, LA M776, LO M776, LY M776
2001-02-12
8
Zulssige Impulsbelastbarkeit
I
F
=
f
(
t
p
)
Permissible Pulse Handling Capability
Duty cycle
D
= parameter,
T
A
= 25 C
LS, LA, LO
Zulssige Impulsbelastbarkeit
I
F
=
f
(
t
p
)
Permissible Pulse Handling Capability
Duty cycle
D
= parameter,
T
A
= 85 C
LS, LA, LO
OHL00318
F
I
10
10
-5
-4
-3
10
10
-2
10
-1
10
0
s
10
1
10
2
p
t
0.05
0.5
0.2
0.1
D
0.02
0.01
0.005
=
-2
10
-1
10
0
10
5
5
A
D
T
t
=
P
t
T
P
I
F
OHL01416
F
I
10
10
-5
-4
-3
10
10
-2
10
-1
10
0
s
10
1
10
2
p
t
0.05
0.5
0.2
0.1
D
0.02
0.01
0.005
=
D
T
t
=
P
t
T
P
I
F
10
-1
10
-2
5
10
5
A
0
LS M776, LA M776, LO M776, LY M776
2001-02-12
9
Zulssige Impulsbelastbarkeit
I
F
=
f
(
t
p
)
Permissible Pulse Handling Capability
Duty cycle
D
= parameter,
T
A
= 25 C
LY
Zulssige Impulsbelastbarkeit
I
F
=
f
(
t
p
)
Permissible Pulse Handling Capability
Duty cycle
D
= parameter,
T
A
= 85 C
LY
OHL00316
F
I
10
10
-5
-4
-3
10
10
-2
10
-1
10
0
s
10
1
10
2
p
t
0.05
0.5
0.2
0.1
D
0.02
0.01
0.005
=
-2
10
-1
10
0
10
5
5
A
D
T
t
=
P
t
T
P
I
F
OHL01417
F
I
10
10
-5
-4
-3
10
10
-2
10
-1
10
0
s
10
1
10
2
p
t
0.05
0.5
0.2
0.1
D
0.02
0.01
0.005
=
D
T
t
=
P
t
T
P
I
F
10
-1
10
-2
5
10
5
A
0
2001-02-12
10
LS M776, LA M776, LO M776, LY M776
Mazeichnung
Package Outlines
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
Kathodenkennung:
abgeschrgte Ecke
Cathode mark:
bevelled edge
Gewicht / Approx. weight: 10 mg
+0.05 (0.002)
1.1 (0.043)
1.3 (0.051)
0.6 (0.024)
Cathode marking
2.0 (0.079)
1.5 (0.059)
5.0 (0.197)
5.4 (0.213)
Cathode marking
1.4 (0.055)
0.8 (0.031)
1.0 (0.039)
1.2 (0.047)
0.8 (0.031)
1.0 (0.039)
1.35 (0.053)
1.25 (0.049)
typ. 1.5 (0.059) x 1.0 (0.039)
GPLY6926
Light emitting window
Cathode
0...0.1 (0.004)
0.18 (0.007)
0.12 (0.005)
0.5 (0.020)
0.7 (0.028) min.
LS M776, LA M776, LO M776, LY M776
2001-02-12
11
Ltbedingungen
Vorbehandlung nach JEDEC Level 2
Soldering Conditions Preconditioning acc. to JEDEC Level 2
IR-Reflow Ltprofil
(nach IPC 9501)
IR Reflow Soldering Profile
(acc. to IPC 9501)
OHLY0597
0
0
50
100
150
200
250
50
100
150
200
250
300
T
t
C
s
240-245 C
10-40 s
183 C
120 to 180 s
Defined for Preconditioning: up to 6 K/s
Ramp-down rate up to 6 K/s
Ramp-up rate up to 6 K/s
Defined for Preconditioning: 2-3 K/s
2001-02-12
12
LS M776, LA M776, LO M776, LY M776
Empfohlenes Ltpaddesign
IR Reflow Lten
Recommended Solder Pad
IR Reflow Soldering
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch)
OHLPY963
6 (0.236)
2.6 (0.102)
1.5 (0.059)
1.2 (0.047)
Ltstopplack
Solder resist
Hole on the PCB,
dimension: 2.5 (0.098) +0.3 (0.012)
6 (0.236)
2.6 (0.102)
1.5 (0.059)
LS M776, LA M776, LO M776, LY M776
2001-02-12
13
Gurtung / Polaritt und Lage
Verpackungseinheit 3000/Rolle, 180 mm
oder 11800/Rolle, 330 mm
Method of Taping / Polarity and Orientation Packing unit 3000/reel, 180 mm
or 11800/reel, 330 mm
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch)
OHAY0224
A
C
1.5 (0.059)
2 (0.079)
4 (0.157)
4 (0.157)
1.55 (0.061)
5.5 (0.217)
12 (0.472)
1.75 (0.069)
5.4 (0.213)
2001-02-12
14
LS M776, LA M776, LO M776, LY M776
Published by OSRAM Opto Semiconductors GmbH & Co. OHG
Wernerwerkstrasse 2, D-93049 Regensburg
All Rights Reserved.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version in the Internet.
Packing
Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components
1
may only be used in life-support devices or systems
2
with the express written approval of OSRAM OS.
1
A critical component is a component used in a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or
system.
2
Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
Revision History: 2001-02-12
Previous Version:
2001-02-12
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