Wireless Components
Dual LNA
PMB 2362 Version 1.1
Specification January 2000
preliminary
Edition 03.99
Published by Infineon Technologies AG i. Gr.,
SC,
Balanstrae 73,
81541 Mnchen
Infineon Technologies AG i. Gr. 26.01.00.
All Rights Reserved.
Attention please!
As far as patents or other rights of third parties are concerned, liability is only assumed for components, not for applications, processes and circuits im-
plemented within components or assemblies.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved.
Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest
Infineon Technologies Office.
Infineon Technologies AG is an approved CECC manufacturer.
Packing
Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office. By agreement we will take packing
material back, if it is sorted. You must bear the costs of transport.
For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose!
Critical components
1
of the Infineon Technologies AG, may only be used in life-support devices or systems
2
with the express written approval of the
Infineon Technologies AG.
1 A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-
support device or system, or to affect its safety or effectiveness of that device or system.
2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they
fail, it is reasonable to assume that the health of the user may be endangered.
ABM
, AOP
, ARCOFI
, ARCOFI
-BA, ARCOFI
-SP, DigiTape
, EPIC
-1, EPIC
-S, ELIC
, FALC
54, FALC
56, FALC
-E1, FALC
-LH, IDEC
, IOM
,
IOM
-1, IOM
-2, IPAT
-2, ISAC
-P, ISAC
-S, ISAC
-S TE, ISAC
-P TE, ITAC
, IWE
, MUSAC
-A, OCTAT
-P, QUAT
-S, SICAT
, SICOFI
, SICOFI
-
2, SICOFI
-4, SICOFI
-4C, SLICOFI
are registered trademarks of Infineon Technologies AG.
ACE
TM
, ASM
TM
, ASP
TM
, POTSWIRE
TM
, QuadFALC
TM
, SCOUT
TM
are trademarks of Infineon Technologies AG.
CONFIDENTIAL
Revision History: Current Version: January 2000
Previous Version:Data Sheet
Page
(in previous
Version)
Page
(in current
Version)
Subjects (major changes since last revision)
Product Info
Product Info
Wireless Components
Confidential
Specification, January 2000
P TSSOP 10
Package
PMB 2362
preliminary
Product Info
General Description
The PMB2362 is a dual band LNA
circuit with excellent performance and
minimum component count for
GSM900 and GSM1800.
Features
s
Worldclass B6HF technology,
f
T
= 25GHz
s
Lowest external component count
s
Extreme small outline
P-TSSOP-10-2 package with heat
sink for grounding
s
Both LNAs with prematched input,
only 2 external matching compo-
nents required
s
GSM900 LNA output matched to
50 Ohm
s
Both LNAs with switchable gain,
20dB gain step
s
LNA1: 17dB gain,
1.5dB noise figure @ 0.95GHz
s
LNA2: 19dB gain,
2.0dB noise figure @ 1.85GHz
s
Supply voltage range from 2.7V to
3.6V
s
Power down function
s
Temperature range -40 to 85C
Application
s
Dual band wireless frontends
GSM900/1800
s
Excellent combination with Infineon
GSM single chip SMARTi
PMB 6250
Ordering Information
Type
Ordering Code
Package
PMB 2362 V1.1
T2362-XV11-P1-7600
P-TSSOP-10-2
1
Table of Contents
1
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
2
Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2.1
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
2.2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
2.3
Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
2.4
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
3
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3.1
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
3.2
Pin Definition and Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
3.3
Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
3.4
Circuit Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
4
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
4.1
Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2
5
Reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
5.1
Absolute Maximum Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2
5.2
Operating Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3
5.3
AC/DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4
5.4
Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-6
5.5
Test Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-8
5.6
S-Parameters / Noise Parameters / Diagramms . . . . . . . . . . . . . . . 5-10
2
Product Description
2.1
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
2.2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
2.3
Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
2.4
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
Contents of this Chapter
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