ILA2003
1
10W AUDIO AMPLIFIER
DESCRIPTION
The main features of ILA 2003, are very low
number of external components, easy of assembly,
space and cost saving.
The device provides a high output current capability
(up to 3.5A), very low harmonic and cross-over
distortion.
Completely safe operation is guaranteed due to
protection against DC and AC short circuit between
all pins and ground, thermal over-range, load dump
voltage up to 40V and open ground.
ORDERING NUMBERS : ILA2003
PENTAWATT
TO 220 AB/5
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
Vs
Peak supply voltage (50 ms)
40
V
Vs
DC supply voltage
28
V
Vs
Operating supply voltage
18
V
Io
Output peak current (repetitive)
3.5
A
Io
Output peak current (non repetitive)
4.5
A
Ptot
Power dissipation at Tcase =90
C
20 W
Tstg,Tj
Storage and junction temperature
-40 to 150
C
PIN CONNECTION
THERMAL DATA
Symbol
Parameter
Value
Unit
Rth-j-case
Thermal resistance junction-case max
3
C/W
ILA2003
2
ELECTRICAL CHARACTERISTICS (V
s
= 14.4V, T
amb
=25
C unless otherwise specified)
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
DC CHARACTERISTICS
Vs Supply
voltage
8 18 V
Vo
Quiescent output voltage (pin 4)
6.1
6.9
7.7
V
Id
Quiescent drain current (pin 5)
44
50
mA
AC CHARACTERISTICS
Po
Output power
d = 10%
f = 1 kHz RL =4
RL =2
RL = 3.2
RL = 1.6
5.5
9
6
10
7.5
12
W
W
W
W
Vi(rms)
Input saturation voltage
300
mV
Vi Input
sensitivity
f = 1 kHz
Po = 0.5W RL =4
Po =6W RL =4
Po = 0.5W RL =2
Po 10W RL =2
14
55
10
50
mV
mV
mV
mV
B
Frequency response ( -3 dB)
Po =1W
RL =4
40 to 15000
Hz
d
Distortion
f = 1 kHz
Po = 0.05 to4.5W RL =4
Po = 0.05 to7.5W RL =2
0,15
0,15
%
%
Ri
Input resistance (pin1)
f = 1 kHz
70
150
k
Gv
Voltage gain (open loop)
f = 1 kHz
f = 10 kHz
80
60
dB
dB
Gv
Voltage gain (closed loop)
f = 1 kHz
RL =4
39,3
40
40,3
dB
eN
Input noise voltage
1
5
V
iN
Input noise current
60
200
pA
h
Efficiency
f = 1 kHz
Po =6W RL =4
Po 10W RL =2
69
65
%
%
SVR
Supply voltage rejection
f = 100 Hz
Vripple = 0.5V
Rg =10 k RL =4
30
36
dB
(0) Filter with noise bandwidth: 22 Hz to 22 kHz
ILA2003
3
CHIP DIAGRAM
Chip marking (X=0,540, Y=0,530)
YH14
PAD LOCATION
Pin No
Pad No
Symbol
X Y
Pad size (mm)
01
01
IN
0.224
0.890
0.230 x 0.219
02
02
IN
0.113
0.291
0.230 x 0.209
03
03
GND
1.367
0.195
0.437 x 0.266
04
04
OUT
1.985
1.078
0.500 x 0.238
05
05
Ud
1.812
1.942
0.673 x 0.230
03
06
GND
0.132
1.957
0.258 x 0.230
Pad size is given as per metallization layer
IZ2003
2.6 + 0.03
2
3 +
0.
03
.
06
01
05
04
03
(0,0)
02
Chip marking
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