ChipFind - документация

Электронный компонент: 80960J

Скачать:  PDF   ZIP

Document Outline

Information in this document is provided solely to enable use of Intel products. Intel assumes no liability whatsoever, including infringement of any
patent or copyright, for sale and use of Intel products except as provided in Intel's Terms and Conditions of Sale for such products. Information
contained herein supersedes previously published specifications on these devices from Intel.
INTEL CORPORATION, 1995
September 1995
Order Number: 272504-004
PRELIMINARY
80960JA/JF
EMBEDDED 32-BIT MICROPROCESSOR
Figure 1. 80960JA/JF Microprocessors
s
Pin/Code Compatible with all 80960Jx
Processors
s
High-Performance Embedded Architecture
-- One Instruction/Clock Execution
-- Load/Store Programming Model
-- Sixteen 32-Bit Global Registers
-- Sixteen 32-Bit Local Registers (8 sets)
-- Nine Addressing Modes
-- User/Supervisor Protection Model
s
Two-Way Set Associative Instruction Cache
-- 80960JA - 2 Kbyte
-- 80960JF - 4 Kbyte
-- Programmable Cache Locking
Mechanism
s
Direct Mapped Data Cache
-- 80960JA - 1 Kbyte
-- 80960JF - 2 Kbyte
-- Write Through Operation
s
On-Chip Stack Frame Cache
-- Seven Register Sets Can Be Saved
-- Automatic Allocation on Call/Return
-- 0-7 Frames Reserved for High-Priority
Interrupts
s
On-Chip Data RAM
-- 1 Kbyte Critical Variable Storage
-- Single-Cycle Access
s
High Bandwidth Burst Bus
-- 32-Bit Multiplexed Address/Data
-- Programmable Memory Configuration
-- Selectable 8-, 16-, 32-Bit Bus Widths
-- Supports Unaligned Accesses
-- Big or Little Endian Byte Ordering
s
New Instructions
-- Conditional Add, Subtract and Select
-- Processor Management
s
High-Speed Interrupt Controller
-- 31 Programmable Priorities
-- Eight Maskable Pins plus NMI
-- Up to 240 Vectors in Expanded Mode
s
Two On-Chip Timers
-- Independent 32-Bit Counting
-- Clock Prescaling by 1, 2, 4 or 8
-- lnternal Interrupt Sources
s
Halt Mode for Low Power
s
IEEE 1149.1 (JTAG) Boundary Scan
Compatibility
s
Packages
-- 132-Lead Pin Grid Array (PGA)
-- 132-Lead Plastic Quad Flat Pack (PQFP)
PIN 1
132
99
66
33
i960
i
M
i
19xx
M
19xx
A80960Jx
NG80960Jx
XXXXXXXXA2
XXXXXXXXA2
PRELIMINARY
ii
80960JA/JF
80960JA/JF
EMBEDDED 32-BIT MICROPROCESSOR
1.0 PURPOSE ..................................................................................................................................................1
2.0 80960JA/JF OVERVIEW ............................................................................................................................1
2.1 80960 Processor Core ........................................................................................................................2
2.2 Burst Bus ............................................................................................................................................2
2.3 Timer Unit ...........................................................................................................................................3
2.4 Priority Interrupt Controller .................................................................................................................3
2.5 Instruction Set Summary ....................................................................................................................3
2.6 Faults and Debugging .........................................................................................................................3
2.7 Low Power Operation .........................................................................................................................4
2.8 Test Features ......................................................................................................................................4
2.9 Memory-Mapped Control Registers ....................................................................................................4
2.10 Data Types and Memory Addressing Modes ....................................................................................4
3.0 PACKAGE INFORMATION ........................................................................................................................6
3.1 Pin Descriptions .................................................................................................................................. 6
3.1.1 Functional Pin Definitions ........................................................................................................6
3.1.2 80960Jx 132-Lead PGA Pinout .............................................................................................13
3.1.3 80960Jx PQFP Pinout ...........................................................................................................17
3.2 Package Thermal Specifications ......................................................................................................20
4.0 ELECTRICAL SPECIFICATIONS ............................................................................................................22
4.1 Absolute Maximum Ratings ..............................................................................................................22
4.2 Operating Conditions ........................................................................................................................22
4.3 Connection Recommendations .........................................................................................................22
4.4 DC Specifications .............................................................................................................................23
4.5 AC Specifications ..............................................................................................................................25
4.5.1 AC Test Conditions and Derating Curves ...............................................................................32
4.5.2 AC Timing Waveforms ............................................................................................................33
5.0 BUS FUNCTIONAL WAVEFORMS .........................................................................................................41
6.0 DEVICE IDENTIFICATION .......................................................................................................................55
7.0 REVISION HISTORY ...............................................................................................................................55
iii
PRELIMINARY
80960JA/JF
FIGURES
Figure 1.
80960JA/JF Microprocessors ....................................................................................................0
Figure 2.
80960JA/JF Block Diagram ........................................................................................................2
Figure 3.
132-Lead Pin Grid Array Bottom View - Pins Facing Up .......................................................... 13
Figure 4.
132-Lead Pin Grid Array Top View - Pins Facing Down ........................................................... 14
Figure 5.
132-Lead PQFP - Top View ..................................................................................................... 17
Figure 6.
AC Test Load ............................................................................................................................ 32
Figure 7.
Output Delay or Hold vs. Load Capacitance ............................................................................ 32
Figure 8.
Rise and Fall Time Derating ..................................................................................................... 33
Figure 9.
CLKIN Waveform ..................................................................................................................... 33
Figure 10.
Output Delay Waveform for T
OV1
............................................................................................. 34
Figure 11.
Output Float Waveform for T
OF
................................................................................................ 34
Figure 12.
Input Setup and Hold Waveform for T
IS1
and T
IH1
................................................................... 35
Figure 13.
Input Setup and Hold Waveform for T
IS2
and T
IH2
................................................................... 35
Figure 14.
Input Setup and Hold Waveform for T
IS3
and T
IH3
................................................................... 36
Figure 15.
Input Setup and Hold Waveform for T
IS4
and T
IH4
................................................................... 36
Figure 16.
Relative Timings Waveform for T
LXL
and T
LXA
........................................................................ 37
Figure 17.
DT/R and DEN Timings Waveform .......................................................................................... 37
Figure 18.
TCK Waveform ......................................................................................................................... 38
Figure 19.
Input Setup and Hold Waveforms for T
BSIS1
and T
BSIH1
.......................................................... 38
Figure 20.
Output Delay and Output Float Waveform for T
BSOV1
and T
BSOF1
.......................................... 39
Figure 21.
Output Delay and Output Float Waveform for T
BSOV2
and T
BSOF2
.......................................... 39
Figure 22.
Input Setup and Hold Waveform for T
BSIS2
and T
BSIH2
........................................................... 40
Figure 23.
Non-Burst Read and Write Transactions Without Wait States, 32-Bit Bus ............................... 41
Figure 24.
Burst Read and Write Transactions Without Wait States, 32-Bit Bus ...................................... 42
Figure 25.
Burst Write Transactions With 2,1,1,1 Wait States, 32-Bit Bus ................................................ 43
Figure 26.
Burst Read and Write Transactions Without Wait States, 8-Bit Bus ........................................ 44
Figure 27.
Burst Read and Write Transactions With 1, 0 Wait States
and Extra Tr State on Read, 16-Bit Bus ................................................................................... 45
Figure 28.
Bus Transactions Generated by Double Word Read Bus Request,
Misaligned One Byte From Quad Word Boundary, 32-Bit Bus, Little Endian
46
Figure 29.
HOLD/HOLDA Waveform For Bus Arbitration .......................................................................... 47
Figure 30.
Cold Reset Waveform .............................................................................................................. 48
Figure 31.
Warm Reset Waveform ............................................................................................................ 49
Figure 32.
Entering the ONCE State ......................................................................................................... 50
Figure 33.
Summary of Aligned and Unaligned Accesses (32-Bit Bus) .................................................... 53
Figure 34.
Summary of Aligned and Unaligned Accesses (32-Bit Bus) (Continued) ................................ 54
PRELIMINARY
iv
80960JA/JF
TABLES
Table 1.
80960Jx Instruction Set .............................................................................................................5
Table 2.
Pin Description Nomenclature ...................................................................................................6
Table 3.
Pin Description -- External Bus Signals ...................................................................................7
Table 4.
Pin Description -- Processor Control Signals, Test Signals and Power .................................. 10
Table 5.
Pin Description -- Interrupt Unit Signals ................................................................................. 12
Table 6.
132-Lead PGA Pinout -- In Signal Order ................................................................................ 15
Table 7.
132-Lead PGA Pinout -- In Pin Order .................................................................................... 16
Table 8.
132-Lead PQFP Pinout -- In Signal Order ............................................................................. 18
Table 9.
132-Lead PQFP Pinout -- In Pin Order .................................................................................. 19
Table 10.
132-Lead PGA Package Thermal Characteristics ................................................................... 20
Table 11.
132-Lead PQFP Package Thermal Characteristics ................................................................ 21
Table 12.
80960JA/JF Operating Conditions .......................................................................................... 22
Table 13.
80960JA/JF DC Characteristics .............................................................................................. 23
Table 14.
80960JA/JF I
CC
Characteristics .............................................................................................. 23
Table 15.
80960JA/JF AC Characteristics (33 MHz) ............................................................................... 25
Table 16.
Note Definitions for Table 15, 80960JA/JF AC Characteristics (33 MHz) ............................... 27
Table 17.
80960JA/JF AC Characteristics (25 MHz) ............................................................................... 27
Table 18.
80960JA/JF AC Characteristics (16 MHz) ............................................................................... 29
Table 19.
Natural Boundaries for Load and Store Accesses .................................................................. 51
Table 20.
Summary of Byte Load and Store Accesses ........................................................................... 51
Table 21.
Summary of Short Word Load and Store Accesses ................................................................ 51
Table 22.
Summary of n-Word Load and Store Accesses (n = 1, 2, 3, 4) ............................................... 52
Table 23.
80960JA/JF Die and Stepping Reference ............................................................................... 55
Table 24.
Data Sheet Version -003 to -004 Revision History .................................................................. 55
Table 25.
Data Sheet Version -002 to -003 Revision History .................................................................. 56
Table 26.
Data Sheet Version -001 to -002 Revision History .................................................................. 57
Table 27.
Data Sheet Version -002 to -003 Revision History .................................................................. 58
80960JA/JF
PRELIMINARY
1
1.0
PURPOSE
This document contains preliminary information for
the 80960JA/JF microprocessor, including electrical
characteristics and package pinout information.
Detailed functional descriptions -- other than
parametric performance -- are published in the
i960
Jx Microprocessor User's Guide (272483).
Throughout this data sheet, references to "80960Jx"
indicate features which apply to all of the following:
80960JA -- 5V, 2 Kbyte instruction cache, 1 Kbyte
data cache
80960JF -- 5V, 4 Kbyte instruction cache, 2 Kbyte
data cache
80960JD -- 5V, 4 Kbyte instruction cache, 2 Kbyte
data cache and clock doubling
80L960JA -- 3.3 V version of the 80960JA
80L960JF -- 3.3 V version of the 80960JF
2.0
80960JA/JF OVERVIEW
The 80960JA/JF offers high performance to cost-
sensitive 32-bit embedded applications. The
80960JA/JF is object code compatible with the
80960 Core Architecture and is capable of sustained
execution at the rate of one instruction per clock.
This processor's features include generous
instruction cache, data cache and data RAM. It also
boasts a fast interrupt mechanism, dual program-
mable timer units and new instructions.
Memory subsystems for cost-sensitive embedded
applications often impose substantial wait state
penalties. The 80960JA/JF integrates considerable
storage resources on-chip to decouple CPU
execution from the external bus.
The 80960JA/JF rapidly allocates and deallocates
local register sets during context switches. The
processor needs to flush a register set to the stack
only when it saves more than seven sets to its local
register cache.
A 32-bit multiplexed burst bus provides a high-speed
interface to system memory and I/O. A full
complement of control signals simplifies the
connection of the 80960JA/JF to external compo-
nents. The user programs physical and logical
memory attributes through memory-mapped control
registers (MMRs) -- an extension not found on the
i960 Kx, Sx or Cx processors. Physical and logical
configuration registers enable the processor to
operate with all combinations of bus width and data
object alignment. The processor supports a homoge-
neous byte ordering model.
This processor integrates two important peripherals:
a timer unit and an interrupt controller. These and
other hardware resources are programmed through
memory-mapped control registers, an extension to
the familiar 80960 architecture.
The timer unit (TU) offers two independent 32-bit
timers for use as real-time system clocks and
general-purpose system timing. These operate in
either single-shot or auto-reload mode and can
generate interrupts.
The interrupt controller unit (ICU) provides a flexible,
low-latency means for requesting interrupts.The ICU
provides full programmability of up to 240 interrupt
sources into 31 priority levels. The ICU takes
advantage of a cached priority table and optional
routine caching to minimize interrupt latency. Local
registers may be dedicated to high-priority interrupts
to further reduce latency. Acting independently from
the core, the ICU compares the priorities of posted
interrupts with the current process priority, off-
loading this task from the core. The ICU also
supports the integrated timer interrupts.
The 80960JA/JF features a Halt mode designed to
support applications where low power consumption
is critical. The halt instruction shuts down instruction
execution, resulting in a power savings of up to 90
percent.
The 80960JA/JF's testability features, including
ONCE (On-Circuit Emulation) mode and Boundary
Scan (JTAG), provide a powerful environment for
design debug and fault diagnosis.
The Solutions960 program features a wide variety
of development tools which support the i960
processor family. Many of these tools are developed
by partner companies; some are developed by Intel,
such as profile-driven optimizing compilers. For
more information on these products, contact your
local Intel representative.