ChipFind - документация

Электронный компонент: 820CHIPSETFamily

Скачать:  PDF   ZIP

Document Outline

Intel
820 Chipset Family: 82820 Memory
Controller Hub (MCH)

Datasheet
July 2000


Order Number:
290630-002
R
Intel
82820 MCH
R
2
Datasheet
Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual
property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability
whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness
for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in
medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future
definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel 82820 Memory Controller Hub (MCH) may contain design defects or errors known as errata which may cause the product to deviate from published
specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
I
2
C is a 2-wire communications bus/protocol developed by Philips. SMBus is a subset of the I
2
C bus/protocol and was developed by Intel. Implementations
of the I
2
C bus/protocol may require licenses from various entities, including Philips Electronics N.V. and North American Philips Corporation.
Alert on LAN is a result of the Intel-IBM Advanced Manageability Alliance and a trademark of IBM
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from:
Intel Corporation
www.intel.com
or call 1-800-548-4725
*Third-party brands and names are the property of their respective owners.
Copyright Intel Corporation 2000
Intel
82820 MCH
R
Datasheet
3
Contents
1. Overview.....................................................................................................................................13
1.1. Related
Documents .......................................................................................................13
1.2. The
Intel
820 Chipset System......................................................................................14
1.3. Intel
82820 MCH Overview ..........................................................................................16
2. Signal
Description.......................................................................................................................19
2.1.
Host Interface Signals ....................................................................................................20
2.2.
Direct RDRAM Interface Signals....................................................................................22
2.3.
The Hub Interface Signals .............................................................................................22
2.4.
AGP Interface Signals....................................................................................................23
2.4.1.
AGP Addressing Signals..............................................................................23
2.4.2.
AGP Flow Control Signals............................................................................24
2.4.3.
AGP Status Signals .....................................................................................24
2.4.4.
AGP Clocking Signals (Strobes) ..................................................................25
2.4.5.
AGP FRAME# Signals .................................................................................26
2.5.
Clock and Reset Signals ................................................................................................28
2.6.
Voltage References, Power, Ground, and Test Signals ................................................29
2.7. Strap
Signals..................................................................................................................29
2.8.
Pin States During Reset.................................................................................................30
3. Register
Description ...................................................................................................................31
3.1.
Register Nomenclature and Access Attributes ..............................................................31
3.2.
PCI Configuration Space Access...................................................................................32
3.3.
I/O Mapped Registers ....................................................................................................34
3.3.1. CONF_ADDR
Configuration Address Register.........................................34
3.3.2. CONF_DATA
Configuration Data Register ...............................................35
3.4.
Host-Hub Interface Bridge/DRAM Controller Device Registers (Device 0)....................36
3.4.1.
VID--Vendor Identification Register (Device 0)...........................................38
3.4.2.
DID--Device Identification Register (Device 0) ...........................................38
3.4.3.
PCICMD--PCI Command Register (Device 0)............................................39
3.4.4.
PCISTS--PCI Status Register (Device 0) ...................................................40
3.4.5.
RID--Revision Identification Register (Device 0) ........................................41
3.4.6.
SUBC--Sub-Class Code Register (Device 0) .............................................41
3.4.7.
BCC--Base Class Code Register (Device 0) ..............................................41
3.4.8.
MLT--Master Latency Timer Register (Device 0) .......................................42
3.4.9.
HDR--Header Type Register (Device 0) .....................................................42
3.4.10.
APBASE--Aperture Base Configuration Register (Device 0)......................42
3.4.11.
SVID--Subsystem Vendor ID Register (Device 0) ......................................44
3.4.12.
SID--Subsystem ID Register (Device 0) .....................................................44
3.4.13.
CAPPTR--Capabilities Pointer Register (Device 0) ....................................44
3.4.14.
GAR0GAR7--RDRAM Group Architecture Register (Device 0) ..............45
3.4.15.
RDTR--RDRAM Timing Register (Device 0) ..............................................46
3.4.16.
RDCR--RDRAM Control Register (Device 0) .............................................47
3.4.17.
RDRR--RDRAM Refresh Register (Device 0) ............................................47
3.4.18.
RPMR--RDRAM Power Management Register (Device 0).........................48
3.4.19.
FDHC--Fixed DRAM Hole Control Register (Device 0) ..............................49
3.4.20.
PAM0PAM6--Programmable Attribute Map Registers (Device 0) ...........49
3.4.21.
GBA0GBA7--RDRAM Group Boundary Address Register (Device 0).....53
3.4.22.
DTC--DRAM Throttle Control Register (Device 0)......................................55
Intel
82820 MCH
R
4
Datasheet
3.4.23.
DRD--RDRAM Device Register Data Register (Device 0) ......................... 56
3.4.24.
RICM--RDRAM Initialization Control Management Register (Device 0) .... 57
3.4.25. 59
3.4.25.
SMRAM--System Management RAM Control Register (Device 0) ........... 59
3.4.26.
ESMRAMC--Extended System Management RAM Control Register (Device
0) 60
3.4.27. ACAPID
AGP Capability Identifier Register (Device 0)............................ 61
3.4.28.
AGPSTAT--AGP Status Register (Device 0) ............................................. 62
3.4.29.
AGPCMD--AGP Command Register (Device 0) ........................................ 63
3.4.30. AGPCTRL
AGP Control Register (Device 0)........................................... 64
3.4.31. APSIZE
Aperture Size Register (Device 0).............................................. 65
3.4.32.
ATTBASE--Aperture Translation Table Base Register (Device 0)............ 66
3.4.33.
AMTT--AGP Interface Multi-Transaction Timer Register (Device 0) ........ 66
3.4.34.
LPTT--Low Priority Transaction Timer Register (Device 0) ....................... 67
3.4.35.
MCHCFG--MCH Configuration Register (Device 0)................................... 67
3.4.36.
EAP--Error Address Pointer Register (Device 0) ....................................... 69
3.4.37.
ERRSTS--Error Status Register (Device 0) ............................................... 70
3.4.38. ERRCMD
Error Command Register (Device 0) ....................................... 72
3.4.39. SMICMD
SMI Command Register (Device 0) .......................................... 74
3.4.40.
SCICMD--SCI Command Register (Device 0) ........................................... 75
3.4.41.
SKPD--Scratchpad Data Register (Device 0) ............................................ 75
3.4.42.
AGPBCTRL--AGP Buffer Control B Register (Device 0) ........................... 76
3.4.43.
RTCE--RDRAM Temperature Calibration Enable Register (Device 0) ...... 76
3.4.44.
AGPAPPEND--AGP Append Disable Register (Device 0)......................... 76
3.5.
AGP Bridge Registers (Device 1) .................................................................................. 77
3.5.1.
VID1--Vendor Identification Register (Device 1) ........................................ 78
3.5.2.
DID1--Device Identification Register (Device 1)......................................... 78
3.5.3.
PCICMD1--PCI-PCI Command Register (Device 1) .................................. 79
3.5.4.
PCISTS1--PCI-PCI Status Register (Device 1).......................................... 80
3.5.5.
RID1--Revision Identification Register (Device 1) ...................................... 81
3.5.6.
SUBC1--Sub-Class Code Register (Device 1)........................................... 81
3.5.7.
BCC1--Base Class Code Register (Device 1)............................................ 81
3.5.8.
MLT1--Master Latency Timer Register (Device 1) ..................................... 82
3.5.9.
HDR1--Header Type Register (Device 1)................................................... 82
3.5.10.
PBUSN--Primary Bus Number Register (Device 1) ................................... 82
3.5.11.
SBUSN--Secondary Bus Number Register (Device 1) .............................. 83
3.5.12.
SUBUSN--Subordinate Bus Number Register (Device 1).......................... 83
3.5.13.
SMLT--Secondary Master Latency Timer Register (Device 1) .................. 84
3.5.14.
IOBASE--I/O Base Address Register (Device 1) ....................................... 85
3.5.15.
IOLIMIT--I/O Limit Address Register (Device 1) ........................................ 85
3.5.16.
SSTS--Secondary PCI-PCI Status Register (Device 1) ............................. 86
3.5.17.
MBASE--Memory Base Address Register (Device 1) ................................ 87
3.5.18.
MLIMIT--Memory Limit Address Register (Device 1) ................................. 87
3.5.19.
PMBASE--Prefetchable Memory Base Address Register (Device 1) ........ 88
3.5.20.
PMLIMIT--Prefetchable Memory Limit Address Register (Device 1) ......... 88
3.5.21.
BCTRL--PCI-PCI Bridge Control Register (Device 1) ................................ 89
3.5.22.
ERRCMD1--Error Command Register (Device 1) ..................................... 90
Intel
82820 MCH
R
Datasheet
5
4.
System Address Map..................................................................................................................91
4.1.
Memory Address Ranges...............................................................................................91
4.1.1. Compatibility
Area ........................................................................................92
4.1.2.
Extended Memory Area ...............................................................................95
4.1.3.
AGP Memory Address Ranges....................................................................97
4.1.4.
AGP DRAM Graphics Aperture....................................................................97
4.1.5.
System Management Mode (SMM) Memory Range....................................98
4.1.6. Memory
Shadowing ...................................................................................100
4.2.
I/O Address Space.......................................................................................................100
4.3.
MCH Decode Rules and Cross-Bridge Address Mapping ...........................................102
4.3.1.
The Hub Interface Decode Rules ..............................................................102
4.3.2.
AGP Interface Decode Rules.....................................................................102
4.3.3.
Legacy VGA Ranges..................................................................................103
5. Functional
Description ..............................................................................................................105
5.1. Host
Interface...............................................................................................................105
5.1.1.
Host Addresses Above 4 GB .....................................................................107
5.1.2.
Host Bus Cycles.........................................................................................107
5.1.3.
Symmetric Multiprocessor (SMP) Protocol Support ..................................111
5.1.4.
Frame Buffer Memory Support ..................................................................111
5.2. AGP
Interface...............................................................................................................112
5.2.1.
AGP Target Operations .............................................................................112
5.2.2.
AGP Transaction Ordering.........................................................................113
5.2.3.
AGP Signal Levels .....................................................................................113
5.2.4.
4x AGP Protocol ........................................................................................114
5.2.5. Fast
Writes.................................................................................................114
5.2.6.
AGP Universal Connector..........................................................................115
5.2.7.
AGP FRAME# Transactions on AGP.........................................................115
5.3. DRAM
Interface............................................................................................................117
5.3.1. RDRAM......................................................................................................117
5.3.1.1.
DRAM Organization, Configuration, and Speed............................118
5.3.1.1.1.
Rules for Populating RDRAM Devices........................119
5.3.1.1.2.
RDRAM CMOS Signals Description and Usage .........120
5.3.1.1.3.
Direct RDRAM Core Refresh ......................................121
5.3.1.1.4.
Direct RDRAM Current Calibration .............................122
5.3.1.2.
Direct RDRAM Command Encoding .............................................123
5.3.1.2.1.
Row Packet (ROWA/ROWR)......................................123
5.3.1.2.2.
Column Packet (COLC/COLX/COLM) ........................124
5.3.1.2.3. Data
Packet.................................................................126
5.3.1.3.
Direct RDRAM Register Programming..........................................127
5.3.1.4.
Direct RDRAM Operating States...................................................127
5.3.1.5.
RDRAM Operating Pools ..............................................................128
5.3.1.6.
RDRAM Power Management........................................................128
5.3.1.7. Data
Integrity .................................................................................129
5.3.1.8.
RDRAM Array Power Management ..............................................129
5.3.1.8.1.
RDRAM On-die Internal Thermal Sensor Mechanism
(Method 1)...................................................................130
5.3.1.8.2.
RDRAM Reads and Writes Counters/Timers Mechanism
(Method 2)...................................................................130
5.4. Power
Management .....................................................................................................132
5.4.1.
Processor Power State Control..................................................................132
5.4.2.
Sleep State Control....................................................................................132
5.5. MCH
Clocking ..............................................................................................................133