Buffer
LsBIASMON
LsTEMPMON
LsPOWMON
LsENABLE
TxLOCKERR
TxRATESEL
TxMCLK
TxPCLK
TxREFSEL
TxLINESEL
TxREFCLK
RxMCLKP
RxPOCLK
RxDOUT 015
RxREFCLK
RxLOCKERR
RxLCKREF
RxPOWMON
RxPOWALM
TxDIN 015
TxPICLK
PLL
/4
Prescaler
Buffer
TEC/LD
Controller
Laser
Transmitter
Driver
Amp
PIN/TIA
Receiver
Tx Fiber
Connector
Rx Fiber
Connector
MUX
16-Bit
Register
10GHz
CLK
/16 CLK
CDR
DeMUX
PLL
PLL
Clock
Select
Figure 1: Serializer/Deserializer Transceiver Block Diagram
Intel
TXN13300/13301/13303
Serializer/Deserializer Transceivers
Product Description
The Intel
TXN13300 Multi-Rate line of 10Gbps
Serializer/Deserializer (SerDes) transceivers is
designed to provide a SONET/SDH, Forward
Error Correction (FEC), and Ethernet-compliant
interface between the photonic physical layer
and the electrical section layer. The module
comprises an optical transmitter and receiver
pair integrated with electrical Multiplex (MUX)
and Demultiplex (DeMUX) functions.
The transmitter section multiplexes 16 channels
at one of 622Mbps, 645Mbps, 669Mbps from a
differential Low-Voltage Differential Signal (LVDS)
parallel data bus into one of 9.95328Gbps,
10.3123Gbps, or 10.709Gbps optical signals
launched into a single-mode optical fiber pigtail.
The receiver section demultiplexes a single optical
signal at one of 9.95328Gbps, 10.3123Gbps or
10.709Gbps back to 16 parallel channels at one
of 622Mbps, 645Mbps, or 669Mbps differential
LVDS electrical signals. The receiver includes a
PIN photodiode, transimpedance amplifier, Clock
Recovery Device (CDR), decision circuit, and
DeMUX. The receiver operates over both the
1.3m and 1.5m bands. The rate at which the
transponder operates is digitally selectable.
A block diagram of the module is shown in
Figure 1 below.
product brief
The transceiver is assembled in a Multi-Source
Agreement (MSA) compatible 4.0" L 3.5" W
0.53" H package. The heat sink was desig-
ned for 55C ambient temperature/200 linear
feet per minute airflow. Alternative heat sink
options are also available. The LVDS interface
connection is made using an MSA-compliant
300-pin Berg* MEG-Array connector with stan-
dard pinout. Optical connections are made with
standard SC-UPC or LC-UPC optical connectors.
Other connector types are available upon
customer request.
Both short- and intermediate-reach versions are
compliant with Telcordia GR-253 requirements
for OC-192 SONET interfaces and the draft 3.1
of IEEE 802.3ae specification. The short reach
versions are intended for link spans of 7km or
12km (SONET) or 10km (Ethernet), and uses a
1.3m Distributed Feedback (DFB) laser source.
The intermediate reach versions are both SONET
and Ethernet compatible and are intended for
link spans up to 40km and use a 1.5m Externally
Modulated Laser (EML) as the transmitter. The
Intel
TXN13300/01/03 transceivers have three
on board jitter filters and feature industry leading
jitter and temperature performance.
Order Number: 250046-001 Printed in USA/0901/5K/ASI/DC
Copyright 2001 Intel Corporation
For more information, visit the Intel Web site at:
developer.intel.com
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Santa Clara, CA 95052-8119
USA
EUROPE
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UK
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JAPAN
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Japan
SOUTH AMERICA
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04583-904 So Paulo, SP
Brazil
Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is
granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any
express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or
infringement of any patent, copyright, or other intellectual property right. Intel products are not intended for use in medical, life-saving or life-sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and
shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
Intel is a trademark or registered trademark of Intel Corporation or its subsidiaries in the United States and other countries.
*Other names and brands may be claimed as the property of others.
Intel Access
Developer Web Site
http://developer.intel.com
Intel
Internet Exchange Architecture Home Page
http://intel.com/IXA
Networking Components Home Page
http://developer.intel.com/design/network
Intel Literature Center
http://developer.intel.com/design/litcentr
(800) 548-4725 7 a.m. to 7 p.m. CST (U.S. and Canada)
International locations please contact your local sales office.
General Information Hotline
(800) 628-8686 or (916) 356-3104 5 a.m. to 5 p.m. PST
Features
s
Multi-rate 10Gbps optical transmitter and receiver pair with
16-channel LVDS SFI-4 and XSBI Electrical Interface--meets
Telcordia GR-253 OC-192 SONET specification and draft IEEE
802.3ae 10GBASE-LR and -ER standards for 10 Gigabit Ethernet
(GbE) applications
Available in:
s
7, 10, and 40km SONET compliant versions
s
10 and 40km Ethernet compatible versions
s
10km Multi-Rate SONET/FEC/Ethernet compatible version
s
12km Multi-rate SONET and Ethernet compatible version
s
40km Multi-rate SONET and Ethernet compatible version
s
MSA-compliant form factor and pin configuration
s
Recessed mounting surface for Tranceiver
s
Three on board jitter filters
s
Integrated heat sinking designed for 200 linear feet per minute,
55C ambient airflow; optional heat sinks for higher temperature
and/or lower airflow conditions
s
Laser bias, laser temperature, laser power, and receiver
power monitors
s
Rx loss of signal, Receiver (Rx) and Transmitter (Tx) loss of lock,
laser bias and laser temperature alarms
s
No integrated power supply sequencing needed
Benefits
s
Allows single line card for SONET, 10GbE, and Optical
Transport Networking (OTN) thereby reducing inventory
s
Meets both Telcordia and IEEE Ethernet specification for
multiple rates making design-in of product easier and
shortening time-to-market
s
Allows maximum flexibility when designing in
SerDesTransceiver
s
Allows traces to run under transceiver without shorting
s
Industry leading jitter and temperature performance
s
Good heat dissipation with added flexibility of
alternative designs
s
Allows easy troubleshooting of link status
s
Allows for monitoring of receiver and transmitter signal loss
s
Simplifies implementation
Intel Advantage
The Intel
TXN 13300/01/03 Multi-Rate SerDes Transceiver
provides a turnkey solution that improves time-to-market,
reduces engineering time and reduces inventory. Intel's
integrated optics deliver a competitive advantage in both
cost and capacity. Industry leading jitter and temperature
performance, loss of alarm signal and the ability to operate
in line timing mode make the TXN 13300/01/03 an optimal
solution for a wide array of applications.
Key Applications
10GbE line cards in high-speed optical networking
equipment, including:
s
Optical switches and routers
s
Cross connects
s
Add/Drop multiplexers
s
Dense Wavelength Division Multiplexing (DWDM) terminals
s
Other Wavelength Division Multiplexing (WDM) and
non-WDM metro system equipment
s
Optical test equipment
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