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Электронный компонент: 5962F9671401VEC

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CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
http://www.intersil.com or 407-727-9207
|
Copyright
Intersil Corporation 1999
ACTS112MS
Radiation Hardened
Dual J-K Flip-Flop
Pinouts
16 PIN CERAMIC DUAL-IN-LINE
MIL-STD-1835, DESIGNATOR CDIP2-T16,
LEAD FINISH C
TOP VIEW
16 PIN CERAMIC FLATPACK
MIL-STD-1835, DESIGNATOR CDFP4-F16,
LEAD FINISH C
TOP VIEW
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
CP1
K1
J1
S1
Q1
Q1
GND
Q2
VCC
R2
CP2
K2
J2
S2
Q2
R1
CP1
K1
J1
S1
Q1
Q1
Q2
GND
2
3
4
5
6
7
8
1
16
15
14
13
12
11
10
9
VCC
R1
R2
CP2
K2
J2
S2
Q2
Features
Devices QML Qualified in Accordance with MIL-PRF-38535
Detailed Electrical and Screening Requirements are Contained in
SMD# 5962-96714 and Intersil's QM Plan
1.25 Micron Radiation Hardened SOS CMOS
Total Dose . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >300K RAD (Si)
Single Event Upset (SEU) Immunity: <1 x 10
-10
Errors/Bit/Day
(Typ)
SEU LET Threshold . . . . . . . . . . . . . . . . . . . . . . . >100 MEV-cm
2
/mg
Dose Rate Upset . . . . . . . . . . . . . . . . >10
11
RAD (Si)/s, 20ns Pulse
Dose Rate Survivability . . . . . . . . . . . >10
12
RAD (Si)/s, 20ns Pulse
Latch-Up Free Under Any Conditions
Military Temperature Range . . . . . . . . . . . . . . . . . . -55
o
C to +125
o
C
Significant Power Reduction Compared to ALSTTL Logic
DC Operating Voltage Range . . . . . . . . . . . . . . . . . . . . 4.5V to 5.5V
Input Logic Levels
- VIL = 0.8V Max
- VIH = VCC/2 Min
Input Current
1
A at VOL, VOH
Fast Propagation Delay . . . . . . . . . . . . . . . . 26ns (Max), 16ns (Typ)
Description
The Intersil ACTS112MS is a Radiation Hardened Dual J-K Flip-Flop
with Set and Reset. The output change states on the negative transition
of the clock (CP1N or CP2N).
The ACTS112MS utilizes advanced CMOS/SOS technology to achieve
high-speed operation. This device is a member of radiation hardened,
high-speed, CMOS/SOS Logic Family.
The ACTS112MS is supplied in a 16 lead Ceramic Flatpack (K suffix) or
a Ceramic Dual-In-Line Package (D suffix).
January 1996
Ordering Information
PART NUMBER
TEMPERATURE RANGE
SCREENING LEVEL
PACKAGE
5962F9671401VEC
-55
o
C to +125
o
C
MIL-PRF-38535 Class V
16 Lead SBDIP
5962F9671401VXC
-55
o
C to +125
o
C
MIL-PRF-38535 Class V
16 Lead Ceramic Flatpack
ACTS112D/Sample
25
o
C
Sample
16 Lead SBDIP
ACTS112K/Sample
25
o
C
Sample
16 Lead Ceramic Flatpack
ACTS112HMSR
25
o
C
Die
Die
Spec Number
518825
File Number
3570.1
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ACTS112MS
Functional Diagram
TRUTH TABLE
INPUTS
OUTPUTS
S
R
CP
J
K
Q
Q
L
H
X
X
X
H
L
H
L
X
X
X
L
H
L
L
X
X
X
H (Note 2)
H (Note 2)
H
H
L
L
No Change
H
H
H
L
H
L
H
H
L
H
L
H
H
H
H
H
Toggle
H
H
H
X
X
No Change
NOTE:
1. H = High Steady State, L = Low Steady State, X = Immaterial,
= High-to-Low Transition
2. Output States Unpredictable if S and R Go High Simultaneously after Both being Low at the
Same Time
15(14)
CP
1(13)
4(10)
R
S
2(12)
K
3(11)
J
P
N
CL
CL
5 (9)
Q
6 (7)
Q
CL
CL
P
N
CL
CL
P
N
CL
CL
P
N
CL
CL
Spec Number
518825
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
3
ACTS112MS
Die Characteristics
DIE DIMENSIONS:
88 mils x 88 mils
2.24mm x 2.24mm
METALLIZATION:
Type: AlSi
Metal 1 Thickness: 7.125k
1.125k
Metal 2 Thickness: 9k
1k
GLASSIVATION:
Type: SiO
2
Thickness: 8k
1k
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
110
m x 110
m
4.3 mils x 4.3 mils
Metallization Mask Layout
ACTS112MS
CP1
VCC
R1
(1)
(16)
(15)
K1
(2)
J1 (3)
S1 (4)
Q1 (5)
Q1 (6)
(8)
(7)
(9)
Q2
GND
Q2
(10)
S2
(14) R2
(13) CP2
(12) K2
(11) J2
Spec Number
518825