File Number

4772

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

HCA10008

80V/2.5A Peak, High Frequency Full
Bridge FET Driver

The HCA10008 is a high frequency, medium voltage Full
Bridge N-Channel FET driver IC, available in 20 lead plastic
SOIC package. The HCA10008 can drive every possible
switch combination except those which would cause a shoot
through condition. The HCA10008 can switch at frequencies
up to 1MHz and is well suited to driving Voice Coil Motors,
high-frequency Class D audio amplifiers, and power
supplies.

For example, the HCA10008 can drive medium voltage
brush motors, and two HCA10008s can be used to drive
high performance stepper motors, since the short minimum
"on-time" can provide fine micro-stepping capability.

Short propagation delays of approximately 55ns maximizes
control loop crossover frequencies and dead-times which
can be adjusted to near zero to minimize distortion, resulting
in rapid, precise control of the driven load.

Pinout

HCA10008

(SOIC)

TOP VIEW

Features

· Independently Drives 4 N-Channel FET in Half Bridge or

Full Bridge Configurations

· Bootstrap Supply Max Voltage to 95V

· Drives 1000pF Load at 1MHz in Free Air at 50

C with Rise

and Fall Times of Typically 10ns

· User Programmable Dead Time

· On-Chip Charge Pump and Bootstrap Upper Bias

Supplies

· DIS (Disable) Overrides Input Control

· Input Logic Thresholds Compatible with 5V to 15V Logic

Levels

· Very Low Power Consumption

· Undervoltage Protection

Applications

· Medium/Large Voice Coil Motors

· Full Bridge Power Supplies

· Class D Audio Power Amplifiers

· High Performance Motor Controls

· Noise Cancellation Systems

· Battery Powered Vehicles

· Peripherals

· U.P.S.

· Related Literature

- AN9405 Application Note for the HIP4081A and the

HCA10008

Ordering Information

PART

NUMBER

TEMP RANGE

(

PACKAGE

PKG. NO.

HCA10008

-40 to 85

20 Ld SOIC (W)

M20.3

BHB

BHI

DIS

BLI

ALI

HDEL

AHI

LDEL

AHB

BHO

BLO

BLS

BHS

ALS

ALO

AHS

AHO

Data Sheet

August 1999

Pin Descriptions

PIN

NUMBER

SYMBOL

DESCRIPTION

BHB

B High-side Bootstrap supply. External bootstrap diode and capacitor are required. Connect cathode of bootstrap
diode and positive side of bootstrap capacitor to this pin. Internal charge pump supplies 30

A out of this pin to

maintain bootstrap supply. Internal circuitry clamps the bootstrap supply to approximately 12.8V.

BHI

B High-side Input. Logic level input that controls BHO driver (Pin 20). BLI (Pin 5) high level input overrides BHI high
level input to prevent half-bridge shoot-through, see Truth Table. DIS (Pin 3) high level input overrides BHI high level
input. The pin can be driven by signal levels of 0V to 15V (no greater than V

). An internal 100

A pull-up to V

will

hold BHI high, so no connection is required if high-side and low-side outputs are to be controlled by the low-side input.

DIS

DISable input. Logic level input that when taken high sets all four outputs low. DIS high overrides all other inputs.
When DIS is taken low the outputs are controlled by the other inputs. The pin can be driven by signal levels of 0V to
15V (no greater than V

). An internal 100

A pull-up to V

will hold DIS high if this pin is not driven.

Chip negative supply, generally will be ground.

BLI

B Low-side Input. Logic level input that controls BLO driver (Pin 18). If BHI (Pin 2) is driven high or not connected
externally then BLI controls both BLO and BHO drivers, with dead time set by delay currents at HDEL and LDEL (Pin
8 and 9). DIS (Pin 3) high level input overrides BLI high level input. The pin can be driven by signal levels of 0V to 15V
(no greater than V

). An internal 100

A pull-up to V

will hold BLI high if this pin is not driven.

ALI

A Low-side Input. Logic level input that controls ALO driver (Pin 13). If AHI (Pin 7) is driven high or not connected
externally then ALI controls both ALO and AHO drivers, with dead time set by delay currents at HDEL and LDEL (Pin
8 and 9). DIS (Pin 3) high level input overrides ALI high level input. The pin can be driven by signal levels of 0V to 15V
(no greater than V

). An internal 100

A pull-up to V

will hold ALI high if this pin is not driven.

AHI

A High-side Input. Logic level input that controls AHO driver (Pin 11). ALI (Pin 6) high level input overrides AHI high
level input to prevent half-bridge shoot-through, see Truth Table. DIS (Pin 3) high level input overrides AHI high level
input. The pin can be driven by signal levels of 0V to 15V (no greater than V

). An internal 100

A pull-up to V

will

hold AHI high, so no connection is required if high-side and low-side outputs are to be controlled by the low-side input.

HDEL

High-side turn-on DELay. Connect resistor from this pin to V

to set timing current that defines the turn-on delay of

both high-side drivers. The low-side drivers turn-off with no adjustable delay, so the HDEL resistor guarantees no
shoot-through by delaying the turn-on of the high-side drivers. HDEL reference voltage is approximately 5.1V.

LDEL

Low-side turn-on DELay. Connect resistor from this pin to V

to set timing current that defines the turn-on delay of

both low-side drivers. The high-side drivers turn-off with no adjustable delay, so the LDEL resistor guarantees no
shoot-through by delaying the turn-on of the low-side drivers. LDEL reference voltage is approximately 5.1V.

AHB

A High-side Bootstrap supply. External bootstrap diode and capacitor are required. Connect cathode of bootstrap
diode and positive side of bootstrap capacitor to this pin. Internal charge pump supplies 30

A out of this pin to

maintain bootstrap supply. Internal circuitry clamps the bootstrap supply to approximately 12.8V.

AHO

A High-side Output. Connect to gate of A High-side power MOSFET.

AHS

A High-side Source connection. Connect to source of A High-side power MOSFET. Connect negative side of
bootstrap capacitor to this pin.

ALO

A Low-side Output. Connect to gate of A Low-side power MOSFET.

ALS

A Low-side Source connection. Connect to source of A Low-side power MOSFET.

Positive supply to gate drivers. Must be same potential as V

(Pin 16). Connect to anodes of two bootstrap diodes.

Positive supply to lower gate drivers. Must be same potential as V

(Pin 15). Decouple this pin to V

(Pin 4).

BLS

B Low-side Source connection. Connect to source of B Low-side power MOSFET.

BLO

B Low-side Output. Connect to gate of B Low-side power MOSFET.

BHS

B High-side Source connection. Connect to source of B High-side power MOSFET. Connect negative side of
bootstrap capacitor to this pin.

BHO

B High-side Output. Connect to gate of B High-side power MOSFET.

HCA10008

Absolute Maximum Ratings

Thermal Information

Supply Voltage, V

and V

. . . . . . . . . . . . . . . . . . . . -0.3V to 16V

Logic I/O Voltages . . . . . . . . . . . . . . . . . . . . . . . -0.3V to V

+0.3V

Voltage on AHS, BHS . . . -6.0V (Transient) to 80V (25

C to 125

Voltage on AHS, BHS . . .-6.0V (Transient) to 70V (-55

C to 125

Voltage on ALS, BLS . . . . . . . -2.0V (Transient) to +2.0V (Transient)
Voltage on AHB, BHB . . . . . . V

AHS, BHS

-0.3V to V

AHS, BHS

Voltage on ALO, BLO. . . . . . . . . . . . .V

ALS, BLS

-0.3V to V

+0.3V

Voltage on AHO, BHO . . . . . . V

AHS, BHS

-0.3V to V

AHB, BHB

+0.3V

Input Current, HDEL and LDEL . . . . . . . . . . . . . . . . . . -5mA to 0mA
Phase Slew Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20V/ns
NOTE: All Voltages relative to V

, unless otherwise specified.

Operating Conditions

Supply Voltage, V

and V

. . . . . . . . . . . . . . . . . . +9.5V to +15V

Voltage on ALS, BLS . . . . . . . . . . . . . . . . . . . . . . . . . -1.0V to +1.0V
Voltage on AHB, BHB . . . . . . . .V

AHS, BHS

+5V to V

AHS, BHS

+15V

Input Current, HDEL and LDEL . . . . . . . . . . . . . . . .-500

A to -50

Ambient Temperature Range . . . . . . . . . . . . . . . . . . . -40

C to 85

Thermal Resistance (Typical, Note 1)

(

C/W)

SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Maximum Storage Temperature Range . . . . . . . . . . -65

C to 150

Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . .125

Maximum Lead Temperature (Soldering 10s)). . . . . . . . . . . . .300

(SOIC - Lead Tips Only)

CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTE:

is measured with the component mounted on an evaluation PC board in free air.

Electrical Specifications

= V

AHB

= V

BHB

= 12V, V

= V

ALS

= V

BLS

= V

AHS

= V

BHS

= 0V, R

HDEL

= R

LDEL

= 100K and

= 25

C, Unless Otherwise Specified

PARAMETER

SYMBOL

TEST CONDITIONS

= 25

= -40

C TO

125

UNITS

MIN

TYP

MAX

MIN

MAX

SUPPLY CURRENTS AND CHARGE PUMPS

Quiescent Current

All inputs = 0V

8.5

10.5

14.5

7.5

14.5

Operating Current

DDO

Outputs switching f = 500kHz

9.5

12.5

15.5

8.5

15.5

Quiescent Current

All Inputs = 0V, I

ALO

= I

BLO

= 0

0.1

Operating Current

CCO

f = 500kHz, No Load

1.25

2.0

0.8

AHB, BHB Quiescent Current
Qpump Output Current

AHB

, I

BHB

All Inputs = 0V, I

AHO

= I

BHO

= 0

= V

AHB

= V

BHB

= 10V

-50

-30

-11

-60

-10

AHB, BHB Operating Current

AHBO

, I

BHBO

f = 500kHz, No Load

0.6

1.2

1.5

0.5

1.9

AHS, BHS, AHB, BHB Leakage
Current

HLK

BHS

= V

AHS

= 80V,

AHB

= V

BHB

= 93V

0.02

1.0

AHB-AHS, BHB-BHS Qpump
Output Voltage

AHB

-V

AHS

BHB

-V

BHS

AHB

= I

AHB

= 0, No Load

11.5

12.6

14.0

10.5

14.5

INPUT PINS: ALI, BLI, AHI, BHI, AND DIS

Low Level Input Voltage

Full Operating Conditions

1.0

0.8

High Level Input Voltage

Full Operating Conditions

2.5

2.7

Input Voltage Hysteresis

Low Level Input Current

= 0V, Full Operating Conditions

-130

-100

-75

-135

-65

High Level Input Current

= 5V, Full Operating Conditions

-1

-10

+10

TURN-ON DELAY PINS: LDEL AND HDEL

LDEL, HDEL Voltage

HDEL

LDEL

HDEL

= I

LDEL

= -100

4.9

5.1

5.3

4.8

5.4

HCA10008

GATE DRIVER OUTPUT PINS: ALO, BLO, AHO, AND BHO

Low Level Output Voltage

OUT

= 100mA

0.7

0.85

1.0

0.5

1.1

High Level Output Voltage

-V

OUT

= -100mA

0.8

0.95

1.1

0.5

1.2

Peak Pullup Current

OUT

= 0V

1.7

2.6

3.8

1.4

4.1

Peak Pulldown Current

OUT

= 12V

1.7

2.4

3.3

1.3

3.6

Undervoltage, Rising Threshold

UV+

8.1

8.8

9.4

8.0

9.5

Undervoltage, Falling Threshold

UV-

7.6

8.3

8.9

7.5

9.0

Undervoltage, Hysteresis

HYS

0.25

0.4

0.65

0.2

0.7

Electrical Specifications

= V

AHB

= V

BHB

= 12V, V

= V

ALS

= V

BLS

= V

AHS

= V

BHS

= 0V, R

HDEL

= R

LDEL

= 100K and

= 25

C, Unless Otherwise Specified (Continued)

PARAMETER

SYMBOL

TEST CONDITIONS

= 25

= -40

C TO

125

UNITS

MIN

TYP

MAX

MIN

MAX

Switching Specifications

= V

AHB

= V

BHB

= 12V, V

= V

ALS

= V

BLS

= V

AHS

= V

BHS

= 0V, R

HDEL

= R

LDEL

= 10K,

= 1000pF

PARAMETER

SYMBOL

TEST CONDITIONS

= 25

= -40

TO 125

UNITS

MIN

TYP

MAX

MIN

MAX

Lower Turn-Off Propagation Delay
(ALI-ALO, BLI-BLO)

LPHL

Upper Turn-Off Propagation Delay
(AHI-AHO, BHI-BHO)

HPHL

Lower Turn-On Propagation Delay
(ALI-ALO, BLI-BLO)

LPLH

HDEL

= R

LDEL

= 10K

Upper Turn-On Propagation Delay
(AHI-AHO, BHI-BHO)

HPLH

HDEL

= R

LDEL

= 10K

110

Rise Time

Fall Time

Turn-On Input Pulse Width

PWIN-ON

HDEL

= R

LDEL

= 10K

Turn-Off Input Pulse Width

PWIN-OFF

HDEL

= R

LDEL

= 10K

Turn-On Output Pulse Width

PWOUT-ON

HDEL

= R

LDEL

= 10K

Turn-Off Output Pulse Width

PWOUT-OFF

HDEL

= R

LDEL

= 10K

Disable Turn-Off Propagation Delay
(DIS - Lower Outputs)

DISLOW

Disable Turn-Off Propagation Delay
(DIS - Upper Outputs)

DISHIGH

105

Disable to Lower Turn-On Propagation Delay
(DIS - ALO and BLO)

DLPLH

Refresh Pulse Width (ALO and BLO)

REF-PW

240

410

550

200

600

Disable to Upper Enable (DIS - AHO and BHO)

UEN

450

620

690

HCA10008

Typical Performance Curves

= V

AHB

= V

BHB

= 12V, V

= V

ALS

= V

BLS

= V

AHS

= V

BHS

= 0V, R

HDEL

= R

LDEL

100K and T

= 25

C, Unless Otherwise Specified

FIGURE 4. QUIESCENT I

SUPPLY CURRENT vs V

SUPPLY VOLTAGE

FIGURE 5. I

DDO

, NO-LOAD I

SUPPLY CURRENT vs

FREQUENCY (kHz)

FIGURE 6. SIDE A, B FLOATING SUPPLY BIAS CURRENT vs

FREQUENCY (LOAD = 1000pF)

FIGURE 7. I

CCO

, NO-LOAD I

SUPPLY CURRENT vs

FREQUENCY (kHz) TEMPERATURE

FIGURE 8. I

AHB

, I

BHB

, NO-LOAD FLOATING SUPPLY BIAS

CURRENT vs FREQUENCY

FIGURE 9. ALI, BLI, AHI, BHI LOW LEVEL INPUT CURRENT

vs TEMPERATURE

2.0

4.0

6.0

8.0

10.0

12.0

14.0

SUPPL

Y CURRENT (mA)

SUPPLY VOLTAGE (V)

100

200

300

400

500

600

700

800

900 1000

8.0

8.5

9.0

9.5

10.0

10.5

11.0

SUPPL

Y CURRENT (mA)

SWITCHING FREQUENCY (kHz)

100

200

300

400

500

600

700

800

900 1000

0.0

5.0

10.0

15.0

20.0

25.0

30.0

FLO

TING SUPPL

Y BIAS CURRENT (mA)

SWITCHING FREQUENCY (kHz)

100

200

300

400

500

600

700

800

900 1000

0.0

1.0

2.0

3.0

4.0

5.0

SUPPL

Y CURRENT (mA)

SWITCHING FREQUENCY (kHz)

125

-40

0.5

1.5

2.5

200

600

800

1000

400

FLO

TING SUPPL

Y BIAS CURRENT (mA)

SWITCHING FREQUENCY (kHz)

-50

-25

100

125

-120

-110

-100

-90

W LEVEL INPUT CURRENT (

JUNCTION TEMPERATURE (

HCA10008

Typical Performance Curves

= V

AHB

= V

BHB

= 12V, V

= V

ALS

= V

BLS

= V

AHS

= V

BHS

= 0V, R

HDEL

= R

LDEL

10K and T

= 25

C, Unless Otherwise Specified

FIGURE 10. AHB - AHS, BHB - BHS NO-LOAD CHARGE PUMP

VOLTAGE vs TEMPERATURE

FIGURE 11. UPPER DISABLE TURN-OFF PROPAGATION

DELAY T

DISHIGH

vs TEMPERATURE

FIGURE 12. DISABLE TO UPPER ENABLE, T

UEN

PROPAGATION DELAY vs TEMPERATURE

FIGURE 13. LOWER DISABLE TURN-OFF PROPAGATION

DELAY T

DISLOW

vs TEMPERATURE

FIGURE 14. T

REF-PW

REFRESH PULSE WIDTH vs

TEMPERATURE

FIGURE 15. DISABLE TO LOWER ENABLE T

DLPLH

PROPAGATION DELAY vs TEMPERATURE

-40

-20

100

120

10.0

11.0

12.0

13.0

14.0

15.0

NO-LO

AD FLO

TING CHARGE PUMP

JUNCTION TEMPERATURE (

GE (V)

-40

-20

100

120

TION DELA

Y (ns)

JUNCTION TEMPERATURE (

425

450

475

500

525

-50

-25

100

125

150

JUNCTION TEMPERATURE (

TION DELA

Y (ns)

-40

-20

100

120

TION DELA

Y (ns)

JUNCTION TEMPERATURE (

350

375

400

425

450

-50

-25

100

125 150

REFRESH PULSE WIDTH (ns)

JUNCTION TEMPERATURE (

-40

-20

100

120

TION DELA

Y (ns)

JUNCTION TEMPERATURE (

HCA10008

FIGURE 16. UPPER TURN-OFF PROPAGATION DELAY T

HPHL

vs TEMPERATURE

FIGURE 17. UPPER TURN-ON PROPAGATION DELAY T

HPLH

vs TEMPERATURE

FIGURE 18. LOWER TURN-OFF PROPAGATION DELAY T

LPHL

vs TEMPERATURE

FIGURE 19. LOWER TURN-ON PROPAGATION DELAY T

LPLH

vs TEMPERATURE

FIGURE 20. GATE DRIVE FALL TIME T

vs TEMPERATURE

FIGURE 21. GATE DRIVE RISE TIME T

vs TEMPERATURE

Typical Performance Curves

= V

AHB

= V

BHB

= 12V, V

= V

ALS

= V

BLS

= V

AHS

= V

BHS

= 0V, R

HDEL

= R

LDEL

10K and T

= 25

C, Unless Otherwise Specified (Continued)

-40

-20

100

120

TION DELA

Y (ns)

JUNCTION TEMPERATURE (

-40

-20

100

120

TION DELA

Y (ns)

JUNCTION TEMPERATURE (

-40

-20

100

120

TION DELA

Y (ns)

JUNCTION TEMPERATURE (

-40

-20

100

120

TION DELA

Y (ns)

JUNCTION TEMPERATURE (

-40

-20

100

120

8.5

9.5

10.5

11.5

12.5

13.5

TE DRIVE F

ALL TIME (ns)

JUNCTION TEMPERATURE (

-40

-20

100

120

8.5

9.5

10.5

11.5

12.5

13.5

TURN-ON RISE TIME (ns)

JUNCTION TEMPERATURE (

HCA10008

Typical Performance Curves

= V

AHB

= V

BHB

= 12V, V

= V

ALS

= V

BLS

= V

AHS

= V

BHS

= 0V, R

HDEL

= R

LDEL

100K and T

= 25

C, Unless Otherwise Specified

FIGURE 22. V

LDEL

, V

HDEL

VOLTAGE vs TEMPERATURE

FIGURE 23. HIGH LEVEL OUTPUT VOLTAGE V

- V

BIAS SUPPLY AND TEMPERATURE AT 100mA

FIGURE 24. LOW LEVEL OUTPUT VOLTAGE V

vs BIAS

SUPPLY AND TEMPERATURE AT 100mA

FIGURE 25. PEAK PULLDOWN CURRENT I

vs BIAS SUPPLY

VOLTAGE

FIGURE 26. PEAK PULLUP CURRENT I

O+

vs BIAS SUPPLY

VOLTAGE

FIGURE 27. LOW VOLTAGE BIAS CURRENT I

(LESS

QUIESCENT COMPONENT) vs FREQUENCY AND
GATE LOAD CAPACITANCE

-40

-20

100

120

4.0

4.5

5.0

5.5

6.0

HDEL, LDEL INPUT V

GE (V)

JUNCTION TEMPERATURE (

250

500

750

1000

1250

1500

- V

(mV)

BIAS SUPPLY VOLTAGE (V)

125

-40

250

500

750

1000

1250

1500

(mV)

BIAS SUPPLY VOLTAGE (V)

125

-40

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

TE DRIVE SINK CURRENT (A)

, V

AHB

, V

BHB

(V)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

TE DRIVE SINK CURRENT (A)

, V

AHB

, V

BHB

(V)

100

1000

500

200

0.1

100

500

0.5

200

0.2

W V

GE BIAS CURRENT (mA)

SWITCHING FREQUENCY (kHz)

100pF

1,000pF

10,000pF

3,000pF

HCA10008

All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.

Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see web site http://www.intersil.com

Sales Office Headquarters

NORTH AMERICA
Intersil Corporation
P. O. Box 883, Mail Stop 53-204
Melbourne, FL 32902
TEL: (407) 724-7000
FAX: (407) 724-7240

EUROPE
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Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
TEL: (32) 2.724.2111
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7F-6, No. 101 Fu Hsing North Road
Taipei, Taiwan
Republic of China
TEL: (886) 2 2716 9310
FAX: (886) 2 2715 3029

HCA10008

Small Outline Plastic Packages (SOIC)

NOTES:

1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of

Publication Number 95.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension "D" does not include mold flash, protrusions or gate burrs.

Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.

4. Dimension "E" does not include interlead flash or protrusions. Interlead

flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.

5. The chamfer on the body is optional. If it is not present, a visual index

feature must be located within the crosshatched area.

6. "L" is the length of terminal for soldering to a substrate.

7. "N" is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. The lead width "B", as measured 0.36mm (0.014 inch) or greater

above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)

10. Controlling dimension: MILLIMETER. Converted inch dimensions

are not necessarily exact.

INDEX
AREA

-B-

0.25(0.010)

C A

B S

-A-

-C-

SEATING PLANE

0.10(0.004)

h x 45

0.25(0.010)

M20.3

(JEDEC MS-013-AC ISSUE C)

20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE

SYMBOL

INCHES

MILLIMETERS

NOTES

MIN

MAX

MIN

MAX

0.0926

0.1043

2.35

2.65

0.0040

0.0118

0.10

0.30

0.013

0.0200

0.33

0.51

0.0091

0.0125

0.23

0.32

0.4961

0.5118

12.60

13.00

0.2914

0.2992

7.40

7.60

0.050 BSC

1.27 BSC

0.394

0.419

10.00

10.65

0.010

0.029

0.25

0.75

0.016

0.050

0.40

1.27

Rev. 0 12/93

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