ChipFind - документация

Электронный компонент: Z5.067A

Скачать:  PDF   ZIP
1
Plastic Packages for Integrated Circuits
Single-In-Line Plastic Packages (SIP)
E
L2
D
L
D1
E1
-A-
-C-
BACK VIEW
LAND PATTERN
C2
A
0.006
-B-
0.00 - 0.0098
(0.15)
HEATSLUG
PLANE
(0.00 - 0.25)
b
0.010 (0.25)
B A
M
M C M
e
PIN
#1
0.350
0.609
0.450
e
(15.46)
MIN
(11.43) MIN
(8.89)
MIN
0.129
(3.27)
TYP
0.043
(1.09)
TYP
L1
c
0.004
(0.10)
0
o
- 8
o
L3
Z5.067A
5 LEAD PLASTIC SINGLE-IN-LINE PACKAGE SURFACE MOUNT
"GULLWING" LEAD FORM
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.170
0.180
4.32
4.57
-
C2
0.048
0.055
1.22
1.39
5
D
0.350
0.370
8.89
9.39
-
E
0.395
0.405
10.04
10.28
-
D1
0.310
-
7.88
-
-
E1
0.310
-
7.88
-
-
L
0.549
0.569
13.95
14.45
-
L1
0.068
0.088
1.72
2.24
-
L2
0.045
0.055
1.15
1.40
-
L3
0.030 BSC
0.76 BSC
4
b
0.028
0.037
0.71
0.94
5, 6, 7
c
0.018
0.024
0.46
0.60
5
e
0.067 BSC
1.70 BSC
-
Rev. 3 4/03
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-169AB, Issue A.
2. Controlling dimension: Inch.
3. Dimensioning and tolerance per ANSI Y14.5M-1982.
4. Gauge plane L3 is parallel to heatslug plane.
5. Dimensions include lead finish.
6. Leads are not allowed above the datum
.
7. Dimension "b" does not include dambar protrusion. Allowable
dambar protrusion shall not cause the lead width to exceed the
maximum "b" by more than 0.003'' (0.08mm).
-B-