PACKAGING INFORMATION
ISSI
Rev. D
02/25/03
Copyright
2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
300-mil Plastic SOJ
Package Code: J
Notes:
1. Controlling dimension: inches, unless otherwise
specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash
protrusions and
should be measured from the bottom of
the package
.
4. Formed leads shall be planar with respect to one
another within 0.004 inches at the seating plane.
MILLIMETERS
INCHES
Sym. Min. Typ. Max.
Min. Typ. Max.
SEATING PLANE
1
N
E1
D
E2
E
b
e
A1
A
B
C
A2
ISSI
PACKAGING INFORMATION
D
SEATING PLANE
B
e
C
1
E
A1
A
S
H
L
N
Plastic TSOP - 28-pins
Package Code: T (Type I)
Plastic TSOP (T
--
Type I)
Millimeters
Inches
Symbol
Min
Max
Min
Max
Ref. Std.
No. Leads
28
A
1.00
1.20
0.037
0.047
A1
0.05
0.20
0.002
0.008
B
0.16
0.27
0.006
0.011
C
0.10
0.20
0.004
0.008
D
7.90
8.10
0.308
0.316
E
11.70
11.90
0.456
0.465
H
13.20
13.60
0.515
0.531
e
0.55 BSC
0.022 BSC
L
0.30
0.70
0.011
0.027
0
5
0
5
Notes:
1. Controlling dimension: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and
should be measured from the bottom of the package
.
4. Formed leads shall be planar with respect to one another within
0.004 inches at the seating plane.
PK13197T28 Rev. B 01/31/97
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