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Электронный компонент: DSEE6-06CC

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HiPerDynFRED
TM
Epitaxial Diode
ISOPLUS220
TM
Electrically Isolated Back Surface
Notes: Data given for T
VJ
= 25
O
C and per diode unless otherwise specified
Diodes connected in series
Pulse test: pulse Width = 5 ms, Duty Cycle < 2.0 %
Pulse test: pulse Width = 300
s, Duty Cycle < 2.0 %
IXYS reserves the right to change limits, test conditions and dimensions.
Features
Silicon chip on Direct-Copper-Bond
substrate
- High power dissipation
- Isolated mounting surface
- 2500V electrical isolation
Low cathode to tab capacitance (<15pF)
Planar passivated chips
Very short recovery time
Extremely low switching losses
Low I
RM
-values
Soft recovery behaviour
Epoxy meets UL 94V-0
Applications
Antiparallel diode for high frequency
switching devices
Antisaturation diode
Snubber diode
Free wheeling diode in converters
and motor control circuits
Rectifiers in switch mode power
supplies (SMPS)
Inductive heating
Uninterruptible power supplies (UPS)
Ultrasonic cleaners and welders
Advantages
Avalanche voltage rated for reliable
operation
Soft reverse recovery for low EMI/RFI
Low I
RM
reduces:
- Power dissipation within the diode
- Turn-on loss in the commutating
switch
I
FAV
= 6 A
V
RRM
= 600 V
t
rr
= 20 ns
V
RRM
V
RRM
Type
V
V
600
300
DSEE 6-06CC
Symbol
Conditions
Maximum Ratings
I
FRMS
20
A
I
FAVM
T
C
= 150C; rectangular, d = 0.5
6
A
E
AS
T
VJ
= 25C; non-repetitive
0.1
mJ
I
AS
= 0.8 A; L = 180 H
I
AR
V
A
= 1.5V
R
typ.; f = 10 kHz; repetitive
0.1
A
T
VJ
-40...+175
C
T
VJM
175
C
T
stg
-40...+150
C
P
tot
T
C
= 25C
50
W
V
ISOL
50/60 Hz RMS; I
ISOL
1 mA
2500
V~
F
C
Mounting force
11...65 / 2.4...11 N / lb
Weight
typical
2
g
Symbol
Conditions
Characteristic Values
typ.
max.
I
R
T
VJ
= 25C V
R
= V
RRM
25
A
T
VJ
= 150C V
R
= V
RRM
0.2
mA
V
F
I
F
= 10 A;
T
VJ
= 125C
1.35
V
T
VJ
= 25C
1.8
V
R
thJC
3.0
K/W
R
thCH
0.6
K/W
t
rr
I
F
= 1 A; -di/dt = 50 A/s;
20
ns
V
R
= 30 V; T
VJ
= 25C
I
RM
V
R
= 100 V; I
F
= 10 A; -di
F
/dt = 100 A/s
2
A
T
VJ
= 100C
DS98915B(07/03)
2003 IXYS All rights reserved
DSEE 6-06CC
ADVANCE TECHNICAL INFORMATION
1 2 3
ISOPLUS 220
Isolated back surface*
E153432
DSEE 6-06CC
ISOPLUS220 Outline
NOTE:
1. Bottom heatsink (Pin 4) is electrically
isolated from Pin 1, 2 or 3.
2. Pin connections:
1 - Cathode
2 - Anode/Cathode
3 - Anode