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Электронный компонент: IXHQ100PI

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1
Features
Live Insertion and Removal Power Manager
Adjustable Power-on slew rate
Autodetect of Load Open Circuit or -VIN
Disconnection
Controlled Time-Delay
Operates from 9 V to External MOSFET Voltage
Limit
Fault Indication Output (microprocessor reset).
Board Insertion/Removal Detector Input
Protection During Turn-On
Low frequency Power Active Filter
Adjustable Electronic Circuit Breaker
V
in
undervoltage with GSNSin input
Applications
Arcless card insertion and removal
Central Office Switching Hardware
Circuit Boards From -48 V Distributed Power
Supplies
Circuit Board Power Manager and Noise Filter
Circuit Board Hot Swap Protector and Manager
Electronic Circuit Breaker
Wireless Local Loop Antennas
Cable TV Antenna
1:0321
1:0351
Negative Voltage Hot Swap Controller
with Active Power Filter
Typical Application with Auto-Disconnect Detector
CAUTION: These devices are
sensitvie to electrostatic discharge;
take caution when handling and
assembling this component.
Copyright IXYS CORPORATION 2000
Description
The IXHQ100 is a live insertion and removal hot swap
controller with a built-in power noise filter. It incorpo-
rates all the active circuitry necessary to protect circuit
boards during live insertion or removal (insertion or
removal when the system power is active). Additionally,
the IXHQ100 incorporates two unique features: power
active filter for powerline noise suppression and power
auto-disconnect detector which eliminates the need of
additional staggered pins.
The IXHQ100 shunt regulator ensures a wide operating
voltage range (with the external MOSFET breakdown
voltage as limit). The active power filter reduces power
source output impedance, producing "clean" load
power. The IXHQ100 allows continuous load current
rise adjustments, presettable maximum current limits,
and user selectable fault indication turn off times for
resetting
Ps and other synchronous board level sys-
tems. For added flexibility, GSNSin pin is available to
implement either circuit board insertion/removal detec-
tion or ground detection.
US Patents Pending.
www.ixys.com
98716 (08/14/00)
IXYS reserves the right to change limits, test conditions and dimensions.
Figure 1
Figure 1
Figure 1
Figure 1
Figure 1
2


Symbol
Symbol
Symbol
Symbol
Symbol
Definition
Definition
Definition
Definition
Definition
Max. Rating
Max. Rating
Max. Rating
Max. Rating
Max. Rating
V
CC
-V
AGND
Voltage applied V
CCin
to AGND Shunt Off: -0.3 V to 16 V
Shunt On: -0.3 V to 14 V
Shunt On for 10 seconds 14V to 16 V
All other pins except V
DC
-0.3 V to V
CCin
+ 0.3 V
I
VDD
V
DD
Load Current
60 mA
T
JM
Maximum Junction Temperature
125
o
C
T
J0
Operating Temperature Range
-40
o
C to 85
o
C
T
stg
Storage Temperature Range
-40
o
C to 150
o
C
I
DD
Supply Current with Shunt On
25 mA
Symbol
Symbol
Symbol
Symbol
Symbol
Parameter
Parameter
Parameter
Parameter
Parameter
Test Conditions
Test Conditions
Test Conditions
Test Conditions
Test Conditions
Min
Min
Min
Min
Min
Typ
Typ
Typ
Typ
Typ
Max
Max
Max
Max
Max Units
Units
Units
Units
Units
I
CC
Supply current
V
CC
=12 V, V
SHUNToff
= V
CC
,
2
3
mA
all outputs unloaded.
V
CCSHUNT
V
CC
shunt regulation
I
CC
forced to 10 mA
12
13.8
16
V
voltage
when shunt is off
V
THSHUNToff
SHUNToff input
V
CC
= 15 V, monitor RST
OUT
1
1.5
2
V
threshold voltage
I
SHUNToff
SHUNToff input
-1
0
1
A
bias current
V
THINV
INV input
V
CC
= 12 V, monitor RST
OUT
6
8
10
V
threshold voltage
R
INV
INV input
70
130
180
K
resistance
V
THGSNS
GSNS sense input
V
CC
= 12 V, monitor RST
OUT
4.5
5.8
6
V
threshold voltage
I
GSNSin
GSNSin input
-2.6
-2.3
-2
A
bias current
I
CAPin
CAPin input bias current
-1
0
1
A
V
VDROP
Active filter offset voltage
0.7
0.9
1.1
V
R
VDROP
V
DROP
input resistance
50
70
90
K
I
SLOPE
SLOPE capacitor
V
OFFTM
= 5 V, V
GSOURCE
= 0 V
70
85
110
mA
charging current
V
CAPin
= 5 V
R
SLOPEDCHG
SLOPE capacitor
V
DROP
= 5 V, IVT = V
CC
90
200
discharge resistance
V
SOURCE
= 0 V, V
CAPin
= 5 V
I
OFFTM
OFFTM capacitor
V
DROP
= 5 V, V
SOURCE
= 0 V
80
100
120
mA
charging current
V
CAPin
= 5 V
R
OFFTMCHG
OFFTM capacitor
111
200
discharge resistance
V
THOFFTM
OFFTM input threshold
OFFTM input voltage when SLOPE
3.8
4.5
5.5
V
voltage
input voltage starts its ramp
V
CL
Overcurrent threshold bias voltage
90
125
150
mV
Pin Description
Pin Description
Pin Description
Pin Description
Pin Description
Unless otherwise noted, T
A
= 25
o
C; -V
IN
= 48 V, AGND connected to -V
IN
, V
SHUNToff
= 5 V, V
CC
= 12 V, V
GSNSin
= 12 V. All voltage measurements
with respect to AGND. IXHQ100 configured as described in
Test Conditions.
Electrical Characteristics
Electrical Characteristics
Electrical Characteristics
Electrical Characteristics
Electrical Characteristics
Absolute Maximum Ratings
Absolute Maximum Ratings
Absolute Maximum Ratings
Absolute Maximum Ratings
Absolute Maximum Ratings
IXHQ 100PI
IXHQ 100SI
3
Electrical Characteristics
Electrical Characteristics
Electrical Characteristics
Electrical Characteristics
Electrical Characteristics (continued)
Symbol
Symbol
Symbol
Symbol
Symbol
Parameter
Parameter
Parameter
Parameter
Parameter
Test Conditions
Test Conditions
Test Conditions
Test Conditions
Test Conditions
Min
Min
Min
Min
Min
Typ
Typ
Typ
Typ
Typ
Max
Max
Max
Max
Max Units
Units
Units
Units
Units
R
VCL
VCL bias resistance
4
6
10
k
t
OC
Overcurrent detection
V
CAPin
= 0 V; V
OUTsns
= 5 V
20
30
ms
to GATE output delay
V
SOURCE
input is a step at t = 0s
from 0 V to 200 mV
dv
GATE
/dt
GATE output slew rate
C
SLOPE
= 100 nF
0.5
0.8
1.1
V/ms
V
GATE
Maximum GATE
V
CAPin
= 0 V; R
load
= 10 K
13.8
15
V
output voltage
V
OUTsns
= 5 V
I
GATE
GATE pull-up current
Gate drive on, V
GATE
= 0 V
-15
-10
mA
I
GATE
GATE pull-down
Gate drive off
10
20
mA
current
V
GATE
= 10 V
V
DD
V
DD
regulator output
3.3K Resistive load
5
5.75
6.5
V
Voltage
between V
DD
output and AGND
I
RSTout
RSTout drive current
Force V
RSTout
=1 V during fault condition
2.4
3
3.6
mA
t
RST
RST pulse width
200
500
1000
ns
V
ad
Auto-Detect threshold
Gate drive on; ramp V
OUTsns
; monitor
-10
12
20
mV
RST until it pulses.
Note 1: Operating the device beyond parameters with listed "absolute maximum ratings" may cause permanent damage to the
device. Typical values indicate conditions for which the device is intended to be functional, but do not guarantee specific
performance limits. The guaranteed specifications apply only for the test conditions listed. Exposure to absolute maximum
rated conditions for extended periods may affect device reliability.
Note2: All voltages are relative to ground unless otherwise specified.
Typical Performance Characteristics
Typical Performance Characteristics
Typical Performance Characteristics
Typical Performance Characteristics
Typical Performance Characteristics
IXHQ 100PI
IXHQ 100SI
Graph 1: Icc vs. Temperature
Graph 1: Icc vs. Temperature
Graph 1: Icc vs. Temperature
Graph 1: Icc vs. Temperature
Graph 1: Icc vs. Temperature
Temperature (oC)
-60
-40
-20
0
20
40
60
80
100
Icc (mA)
1.96
1.98
2.00
2.02
2.04
2.06
2.08
2.10
2.12
2.14
2.16
2.18
Temperature (oC)
-60 -40 -20
0
20 40
60 80 100
Reg
u
l
a
t
o
r
Ou
t
put
Vol
t
a
ge (
V
)
5.4
5.5
5.6
5.7
5.8
5.9
6.0
Graph 2: Regulator Output Voltage vs. Temperature
Graph 2: Regulator Output Voltage vs. Temperature
Graph 2: Regulator Output Voltage vs. Temperature
Graph 2: Regulator Output Voltage vs. Temperature
Graph 2: Regulator Output Voltage vs. Temperature
4
IXHQ 100PI
IXHQ 100SI
Graph 3: SLOPE Pin current vs. Temperature
Graph 3: SLOPE Pin current vs. Temperature
Graph 3: SLOPE Pin current vs. Temperature
Graph 3: SLOPE Pin current vs. Temperature
Graph 3: SLOPE Pin current vs. Temperature
Graph 4: OFFTM Threshold Voltage vs. Temperature
Graph 4: OFFTM Threshold Voltage vs. Temperature
Graph 4: OFFTM Threshold Voltage vs. Temperature
Graph 4: OFFTM Threshold Voltage vs. Temperature
Graph 4: OFFTM Threshold Voltage vs. Temperature
Graph 5: Vcc Shunt Voltage vs. Temperature
Graph 5: Vcc Shunt Voltage vs. Temperature
Graph 5: Vcc Shunt Voltage vs. Temperature
Graph 5: Vcc Shunt Voltage vs. Temperature
Graph 5: Vcc Shunt Voltage vs. Temperature
Graph 6: Overcurrent Threshold Voltage vs. Temperature
Graph 6: Overcurrent Threshold Voltage vs. Temperature
Graph 6: Overcurrent Threshold Voltage vs. Temperature
Graph 6: Overcurrent Threshold Voltage vs. Temperature
Graph 6: Overcurrent Threshold Voltage vs. Temperature
Graph 8: Vdrop Voltage vs. Temperature
Graph 8: Vdrop Voltage vs. Temperature
Graph 8: Vdrop Voltage vs. Temperature
Graph 8: Vdrop Voltage vs. Temperature
Graph 8: Vdrop Voltage vs. Temperature
Graph 7: Supply Current vs. Shunt Voltage
Graph 7: Supply Current vs. Shunt Voltage
Graph 7: Supply Current vs. Shunt Voltage
Graph 7: Supply Current vs. Shunt Voltage
Graph 7: Supply Current vs. Shunt Voltage
Vshunt (V)
4
6
8
10
12
14
16
18
Supply
Cur
r
e
n
t
(
m
A
)
0
10
20
30
40
50
60
Temperature (oC)
-60 -40 -20
0
20
40
60
80 100
Vdr
op Vol
t
ag
e (
V
)
0.84
0.86
0.88
0.90
0.92
0.94
0.96
0.98
1.00
Temperature (oC)
-60
-40
-20
0
20
40
60
80
100
Vcc

S
hunt Volt
ag
e (
V
)
13.2
13.4
13.6
13.8
14.0
14.2
14.4
Temperature (oC)
-60
-40
-20
0
20
40
60
80
100
Slope Cur
r
ent
(
u
A)
76
78
80
82
84
86
88
90
92
94
Temperature (oC)
-60
-40
-20
0
20
40
60
80
100
Vcl Volt
ag
e (
m
V
)
118
120
122
124
126
128
130
132
134
136
Temperature (oC)
-60
-40
-20
0
20
40
60
80
100
O
FFT
M
T
h
r
e
shold Volt
ag
e (
V
)
3
4
5
6
ICC = 1mA
5
Frequency (Hz)
1e+1 1e+2 1e+3 1e+4 1e+5 1e+6
Att
e
nuati
on (
d
B)
-70
-60
-50
-40
-30
-20
-10
0
10
20
Pin Descriptions
Pin Descriptions
Pin Descriptions
Pin Descriptions
Pin Descriptions
IXHQ 100PI
IXHQ 100SI
Supply Voltage (V)
0
20
40
60
80
100
120
Ga
te
V
o
l
t
a
g
e
(V
)
6
8
10
12
14
16
Graph 9: Gate Voltage vs. Supply Voltage
Graph 9: Gate Voltage vs. Supply Voltage
Graph 9: Gate Voltage vs. Supply Voltage
Graph 9: Gate Voltage vs. Supply Voltage
Graph 9: Gate Voltage vs. Supply Voltage
Graph 10: Typical Noise Attenuation
Graph 10: Typical Noise Attenuation
Graph 10: Typical Noise Attenuation
Graph 10: Typical Noise Attenuation
Graph 10: Typical Noise Attenuation
PIN #
SYMBOL
FUNCTION
DESCRIPTION
1
INV
Invert
Input
The invert input controls GSNSin's polarity. When
invert input is high compared to AGND, then GSNSin
low indicates an insertion/removal event. When invert
input is low, then GSNSin high indicates an
insertion/removal event.
15 GSNSin
Ground Sense
Input
The INV pin controls the polarity sense of this input.
A 3uA internal pull-up current source causes logic
high when there is no connection at this pin. With INV
low or connected to AGND, a GSNSin low (or
connected to AGND) will keep RSTout and GATE
low, and the external power switch, Q1, off. A
disconnected GSNSin pin or when Vcc is applied to it
will allow normal operation
2
VCCin
Supply Voltage Positive power-supply voltage input.
3 SHNToff Shunt
Off
This pin serves to control the enabling of the shunt
circuit. When the pin is high compared to AGND, then
the shunt regulator is in off position. A low level at
this pin activates the shunt regulator.
4 CAPin
Active low-
pass filter
capacitor input
The output of the power active filter tracks this pin.
Adding an external RC network matching the input
noise with respect to the 3db point of the filter could
reduce the noise to a minimum.
5 VDROP
Active filter
offset voltage
This pin sets the drop out MOSFET voltage across the
active filter.
6 SLOPE Slope
input
This input controls the current slope during power up
and controls inrush currents. Adding external
capacitors to this pin allow regulation and adjustment
of the rate of the current slope.
7 OFFTM Off-time
The OFFTM pin sets the delay time between power-
down and restart of IXHQ100. Delay time can be
increased by adding external capacitors to this pin.
8
AGND
Ground
The IXHQ100 system zero reference pin.
6
IXHQ100 Logic Dia
IXHQ100 Logic Dia
IXHQ100 Logic Dia
IXHQ100 Logic Dia
IXHQ100 Logic Diagram
gram
gram
gram
gram
Pin Descriptions
Pin Descriptions
Pin Descriptions
Pin Descriptions
Pin Descriptions (continued)
IXHQ 100PI
IXHQ 100SI
Figure 2
Figure 2
Figure 2
Figure 2
Figure 2
PIN #
SYMBOL
FUNCTION
DESCRIPTION
9 VDDout
Regulator
output voltage
Regulator output voltage provides current to drive the
external circuits with respect to AGND.
10 VCL
Overcurrent
threshold bias
voltage
Sets the overcurrent threshold bias voltage.
11 SOURCE
Current input
sensor
Input for sensing current through power device with
respect to AGND.
12
GATE
Output
Control voltage for driving external MOSFET.
13 OUTsns
Out sensor
signal
This signal senses the output voltage of the circuit.
14 RSTout Output
Reset
A low at this pin indicates detection of an
insert/removal event or overcurrent detection.
16 NC
N/A Not
Connected
7
the external load, V
load
, is zero. As V
SLOPE
rises,
its rate of increase determined by the value of
the external capacitor, C8 (figure1), and the
value of the internal current source, I5. V
GATE
's
rate of increase follows V
SLOPE.
As soon as V
GATE
exceeds V
thQ1
(figure 1) of the external power
MOSFET, drain current I
dQ1
starts to flow. The
rate of increase of I
dQ1
is proportional to the rate
of increase of V
SLOPE
, and is independent of the
size of C5 , the total filter capacitance of the
load. Note that this rate, which is directly
proportional to C7 and inversely proportional to
C8, could be adjusted . Similarly the Toff-delay
can be adjusted and is directly proportional to
the size of C7.
DEVICE OPERA
DEVICE OPERA
DEVICE OPERA
DEVICE OPERA
DEVICE OPERATION*
TION*
TION*
TION*
TION*
A hot swap operation involves removal and
reinsertion of a device while the system using
it remains in operation. Such an operation
could cause external capacitors to draw cur-
rents high enough to disturb system operations
or even cause permanent damage to both the
device and the system.
The IXHQ100 is designed to prevent any distur-
bances or damage during such occurrences,
allowing the circuit board to be safely inserted
and removed from a live backplane. Capable of
operating under three modes, the chip also acts
as a power active noise filter and an auto-detect
circuit.
Once power is applied, the IXHQ100 starts up
but does not immediately apply power to the
output load. The internal Power Up Reset logic
(see in Figure 2) turns on for 10
s prior to any
other logic. This pulse goes through two NOR
gates and resets SRFF1 Flip Flop. Once SRFF1
is reset, the current source, I6, charges the
OFFTM pin at a rate proportional to the size of
the external capacitor, C7 (fig 1). During the time
the OFFTM pin is ramping from 0V to Vrf (~5V),
which is the T
off-delay
off-delay
off-delay
off-delay
off-delay
,
,
,
,
, COMP1 keeps N3 ON so
V
SLOPE
stays at 0V. After T
off-delay
off-delay
off-delay
off-delay
off-delay
,,
,,
,
V
OFFTM
OFFTM
OFFTM
OFFTM
OFFTM
ecomes
greater than Vrf, and COMP1 goes low, driving
N3 to off state. I5 now starts to charge C1,
ramping +ve i/p of OA4. OA4 buffers V
SLOPE
and
sets the GATE output ramp.
It is assumed that when the circuit board is first
inserted into the backplane, the voltage across
Inser
Inser
Inser
Inser
Insertion Pr
tion Pr
tion Pr
tion Pr
tion Process
ocess
ocess
ocess
ocess
As the circuit board is inserted into the
backplane, physical connections should be
made to ground to discharge any electrostatic
voltage. The insertion process begins when
power and ground are supplied to the board
through pins on the blackplane.
IXHQ 100PI
IXHQ 100SI
Normal Operation
Normal Operation
Normal Operation
Normal Operation
Normal Operation
Flip-flop setting and resetting
Flip-flop setting and resetting
Flip-flop setting and resetting
Flip-flop setting and resetting
Flip-flop setting and resetting
*Unless otherwise stated, all symbol and device references are referred to the logic diagram (Fig 2) on page 6
The flip-flop, SRFF1 (fig 2), used in the IXHQ100,
is reset dominant. Hence when both S and R
inputs are driven high, the SRFF1 remains
reset. Under normal operation, S input becomes
high whenever OR1 output is high and R input
is low. In turn, OR1 goes high if any one of the
outputs of EXOR1, or COMP2, or COMP3
goes high.
EXOR1 output goes high if it detects the loss of
either Gnd or -Vin. If INV input is connected to
With continuous V
in
applied, the IXHQ100
acts as an active power filter by modulating the
voltage drop across the external Power
MOSFET V
ds
so that any noise on V
in
is
cancelled by V
ds
.
The direct connection of IXHQ 100's AGND pin
to V
in
allows the V
drop
(internally set to ~750mV)
to set the ~90% of the maximum peak noise
voltage reject by the IXHQ100. The internal
V
drop
setting of ~750 mV allows 1.35 Vpp of
noise rejection. Graph on page 5 illustrates the
level of ripple attenuation during normal
conditions. Notice that the noise rejection is very
high (~60db) between 400Hz to 40KHz, which is
optimal for most hot swap applications.
8
F
F
F
F
Fault Operation
ault Operation
ault Operation
ault Operation
ault Operation
When the output load current is such that the
voltage drop across the current sense resistor
between the SOURCE pin and the AGND
exceeds VCL (internally set to ~120 mv), the
GATE output is driven low to turn off the external
Power MOSFET connected between the load
and -V
in
. An external capacitor connected
between OFFTM pin and AGND pin determines
the off time T
off-delay.
IXHQ100 will restart the turn
on sequence of the external Power MOSFET
with a load voltage slope determined by the
size of the external capacitor that is connected
to the SLOPE pin.
Shor
Shor
Shor
Shor
Short Cir
t Cir
t Cir
t Cir
t Circuit Pre
cuit Pre
cuit Pre
cuit Pre
cuit Prevention
vention
vention
vention
vention
Restar
Restar
Restar
Restar
Restart Operation
t Operation
t Operation
t Operation
t Operation
IXHQ 100PI
IXHQ 100SI
Vcc, then GSNSin pin can be used to detect
the presence or absence of -Vin. If INV is
connected to AGND, then GSNSin pin can be
used to detect the presence or absence of
Gnd.
COMP2 output goes high whenever an
overcurrent or a short circuit condition is
detected. The inverting input to COMP2 is
connected to the VCL output pin which is
internally set at approximately 120mV. As
shown in Figure 1, one side of R4 is in series
with the source of Q1, the drain output of which
drives the load connected to J8. The return
side of R4 is connected to -Vin through J1. For
R4 = 0.02
, Q1 source currents greater than
6A will turn on COMP2 and will be considered
either an overcurrent or short circuit event.
COMP3 goes high whenever the voltage at
OUTsns with respect to AGND becomes less
than 0.1*VCL(approximately 12mV). This can
only occur if either the current drawn by the driven
load is less than 600mA (12mV/.02) or -V
IN
is
disconnected. This Auto-Disconnect technique
automatically detects load disconnections
without needing additional sensors.
Thus the SRFF1 will reset when one of the
following events occur:
1. Loss of AGND or -Vin.
2. Overcurrent or short circuit.
3. Auto-Disconnection
A valid S input into SRFF1 will immediately
drive its output, Q1, to high and will turn on both
N5 and N4. N5, an open drain output, will result
in RSTout being driven low. A current limiting
resistor, R1, in series with a 4N35 LED
connected to V
DD
(fig 1) can be used to
generate an isolated reset pulse. Turning on
N4 will discharge C7 and the internal 10pF
capacitor (fig 2). As soon as V
OFFTM
drops below
V
DROP
=~0.9V, COMP4 in Figure 2 will turn on
through NOR1 and NOR2, and resets SRFF1
with a high applied to its R input. This act will
then turn off both N5 and N4 and allow OFFTM
pin to initiate its positive ramp as a result of I6
charging the capacitors C7 (Figure 1) and C2
(Figure 2) connected to the OFFTM pin.
The IXHQ100 will automatically attempt to
restart once a disconnection and reconnection
is detected. Either PUR or COMP4 going high
will reset SRFF1 during normal operation of
the IXHQ100 (fig 2). Resetting SRFF1 turns off
N4 and N5, and the OFFTM pin ramps up in
response. During this ramp, as long as V
OFFTM
is less than Vrf=~4.5V, COMP1 will keep N3 on
and C1 (Figure 2) and C8 (Figure 1) discharged.
After T
off-delay,
V
OFFTM
is at Vrf, COMP1 output
then goes low, turning off N3. Now the SLOPE
pin is free to ramp up as a result of I5 charging
C1 (Figure 2) and C8 (Figure 1). The two unity-
gain buffers, OA4 and OA5, reflect V
SLOPE
at the
GATE output pin during this positive ramp. As
soon as V
GATE
overcomes the V
Q1th
, normal
operation is resumed.
When the IXHQ100 detects a short in the load,
a restart is automatically initiated. The GOUT
drops to zero and waits one T
off-delay
before
SLOPE ramps up. As before, normal operation
is resumed.
9
IXYS Corporation
3054 Bassett St; Santa Clara, CA 95054
Tel: 408-982-0700; Fax: 408-496-0670
e-mail: sales@ixys.com
IXYS Semiconducotr GmbH
Edisonstrasse15 ; D-68623; Lampertheim
Tel: +49-6206-503-0; Fax: +49-6206-503627
e-mail: marcom@ixys.de
Package Outlines: 16 PIN PDIP
Package Outlines: 16 PIN TSSOP
Part Number
Part Number
Part Number
Part Number
Part Number
Package Type
Package Type
Package Type
Package Type
Package Type
Grade
Grade
Grade
Grade
Grade
IXHQ 100PI
16 PIN PDIP
Industrial
IXHQ 100SI
16 PIN TSSOP
Industrial
Ordering Information
Ordering Information
Ordering Information
Ordering Information
Ordering Information
IXHQ 100PI
IXHQ 100SI