SPEC NO: DSAD1215
REV NO: V.1
DATE: MAR/24/2003
PAGE: 1 OF 4
APPROVED: J. Lu
CHECKED: Allen Liu
DRAWN: Z.Y.YANG
Package Dimensions
Features
l
3.0mm X 2.0mm, 1.4mm HIGH, ONLY MINIMUM
SPACE REQUIRED.
l
SUITABLE FOR COMPACT OPTOELECTRONIC
APPLICATIONS.
l
LOW POWER CONSUMPTION.
l
PACKAGE : 2000PCS / REEL.
Notes:
1. All dimensions are in millimeters (inches),
2. Tolerance is
0.25(0.01") unless otherwise noted.
3. Specifications are subject to change without notice.
3.0x2.0mm SURFACE MOUNT LED LAMP
AA3020SEC SUPER BRIGHT ORANGE
Description
The Super Bright Orange source color devices are
made with DH InGaAlP on GaAs substrate Light
Emitting Diode.
SPEC NO: DSAD1215
REV NO: V.1
DATE: MAR/24/2003
PAGE: 2 OF 4
APPROVED: J. Lu
CHECKED: Allen Liu
DRAWN: Z.Y.YANG
Selection Guide
Note:
1.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Absolute Maximum Ratings at T
A
=25
C
Electrical / Optical Characteristics at T
A
=25
C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
ec
iD ec
iD ec
iD ec
iD ec
iD
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
A
m
02
@
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V elg
n
A
.ni
M .ni
M .ni
M .ni
M .ni
M
.p
yT .p
yT .p
yT .p
yT .p
yT
2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2
C
E
S
02
03
A
A
)PI
A
a
G
nI(
E
G
N
A
R
O
T
H
GI
R
B
R
E
P
U
S
R
A
E
L
C
R
E
T
A
W
00
1
00
3
0
9
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
eg
na
rO
th
gir
B
re
pu
S
eg
na
rO
th
gir
B
re
pu
S
eg
na
rO
th
gir
B
re
pu
S
eg
na
rO
th
gir
B
re
pu
S
eg
na
rO
th
gir
B
re
pu
S
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
no
ita
pi
ss
id
re
w
o
P
57
W
m
tn
err
u
C
dr
a
wr
oF
C
D
03
A
m
]1[
tn
err
u
C
dr
a
wr
oF
ka
e
P
59
1
A
m
eg
atl
oV
es
re
ve
R
5
V
er
ut
ar
ep
m
eT
eg
ar
ot
S/
gn
ita
re
p
O
04
-
58
+
oT
C
C
lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ec
iv
e
D ec
iv
e
D ec
iv
e
D ec
iv
e
D ec
iv
e
D
.p
yT .p
yT .p
yT .p
yT .p
yT
.x
a
M .x
a
M .x
a
M .x
a
M .x
a
M
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
ka
ep
ht
gn
el
ev
a
W
ka
e
P
eg
na
rO
th
gir
B
re
pu
S
01
6
m
n
I
F
A
m
02
=
D
ht
gn
el
ev
a
W
et
an
im
o
D
eg
na
rO
th
gir
B
re
pu
S
10
6
m
n
I
F
A
m
02
=
2/
1
ht
di
w-
fla
H
en
iL
lar
tc
ep
S
eg
na
rO
th
gir
B
re
pu
S
92
m
n
I
F
A
m
02
=
C
ec
na
tic
ap
a
C
eg
na
rO
th
gir
B
re
pu
S
03
Fp
V
F
zH
M
1=
f;V
0=
V
F
eg
atl
oV
dr
a
wr
oF
eg
na
rO
th
gir
B
re
pu
S
0.
2
5.
2
V
I
F
A
m
02
=
I
R
tn
err
u
C
es
re
ve
R
eg
na
rO
th
gir
B
re
pu
S
01
Au
V
R
V5
=
SPEC NO: DSAD1215
REV NO: V.1
DATE: MAR/24/2003
PAGE: 4 OF 4
APPROVED: J. Lu
CHECKED: Allen Liu
DRAWN: Z.Y.YANG
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
AA3020SEC
SMT Reflow Soldering Instruction
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
PDF 
ZIP