SPEC NO: DSAD0904
REV NO: V.2
DATE: MAY/09/2003 PAGE: 1 OF 4
APPROVED : J. Lu
CHECKED : Allen Liu
DRAWN: D.H.FANG
Package Dimensions
5.0mm x 6.0mm SURFACE MOUNT LED LAMP
Features
l
SINGLE COLOR.
l
SUITABLE FOR ALL SMT ASSEMBLY AND
SOLDER PROCESS.
l
AVAILABLE ON TAPE AND REEL.
l
IDEAL FOR BACKLIGHTING.
l
PACKAGE : 500PCS / REEL.
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
0.25(0.01") unless otherwise noted.
3. Specifications are subject to change without notice.
AA5060PWC/G WHITE
Description
The source color devices are made with InGaN on SiC
Light Emitting Diode.
Static electricity and surge damage the LEDS.
It is recommended to use a wrist band or
anti-electrostatic glove when handling the LEDs.
All devices, equipment and machinery must be
electrically grounded
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
SENSITIVE
DEVICES
SPEC NO: DSAD0904
REV NO: V.2
DATE: MAY/09/2003 PAGE: 2 OF 4
APPROVED : J. Lu
CHECKED : Allen Liu
DRAWN: D.H.FANG
Electrical / Optical Characteristics at T
A
=25
C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Selection Guide
Note:
1
.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Absolute Maximum Ratings at T
A
=25
C
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
ec
iD ec
iD ec
iD ec
iD ec
iD
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
A
m
03
@
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V elg
n
A
.ni
M .ni
M .ni
M .ni
M .ni
M
.p
yT .p
yT .p
yT .p
yT .p
yT
2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2
G/
C
W
P
06
05
A
A
)N
a
G
nI(
E
TI
H
W
R
A
E
L
C
R
E
T
A
W
08
3
00
8
0
01
lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ec
iv
e
D ec
iv
e
D ec
iv
e
D ec
iv
e
D ec
iv
e
D
.p
yT .p
yT .p
yT .p
yT .p
yT
.x
a
M .x
a
M .x
a
M .x
a
M .x
a
M
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
V
F
eg
atl
oV
dr
a
wr
oF
eti
h
W
6.
3
3.
4
V
I
F
A
m
02
=
I
R
tn
err
u
C
es
re
ve
R
eti
h
W
01
Au
V
R
V
5
=
X
se
ta
ni
dr
oo
C
yti
cit
a
m
or
h
C
eti
h
W
33
.0
Y
43
.0
C
ec
na
tic
ap
a
C
eti
h
W
01
1
Fp
V
F
zH
M
1=
f;
V
0=
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
eti
h
W eti
h
W eti
h
W eti
h
W eti
h
W
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
no
ita
pi
ss
id
re
w
o
P
92
1
W
m
tn
err
u
C
dr
a
wr
oF
C
D
03
A
m
]1[
tn
err
u
C
dr
a
wr
oF
ka
e
P
05
1
A
m
eg
atl
oV
es
re
ve
R
5
V
er
ut
ar
ep
m
eT
eg
ar
ot
S/
gn
ita
re
p
O
04
-
58
+
oT
C
C
SPEC NO: DSAD0904
REV NO: V.2
DATE: MAY/09/2003 PAGE: 3 OF 4
APPROVED : J. Lu
CHECKED : Allen Liu
DRAWN: D.H.FANG
White AA5060PWC/G
AA5060PWC/G
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
PDF 
ZIP