SPEC NO: DSAB8380
REV NO: V.3
DATE:MAY/11/2003
PAGE: 1 OF 4
APPROVED : J. Lu
CHECKED :Allen Liu
DRAWN:S.J.HOU
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
0.25(0.01") unless otherwise noted.
3. Specifications are subject to change without notice.
Package Dimensions
5.0mm x 6.0mm SURFACE MOUNT LED LAMP
Features
lSINGLE COLOR.
lSUITABLE FOR ALL SMT ASSEMBLY AND
SOLDER PROCESS.
lAVAILABLE ON TAPE AND REEL.
lIDEAL FOR BACKLIGHTING.
lPACKAGE : 500PCS / REEL.
AA5060SEC/H HYPER ORANGE
Description
This devices are made with TS InGaAlP.
SPEC NO: DSAB8380
REV NO: V.3
DATE:MAY/11/2003
PAGE: 2 OF 4
APPROVED : J. Lu
CHECKED :Allen Liu
DRAWN:S.J.HOU
Electrical / Optical Characteristics at T
A
=25
C
Absolute Maximum Ratings at T
A
=25
C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Selection Guide
Note:
1
.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
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N
tra
P
.o
N
tra
P
ec
iD ec
iD ec
iD ec
iD ec
iD
ep
yT
sn
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ep
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sn
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ep
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ep
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c
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vI
)d
c
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c
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m(
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c
m(
vI Am
05
@
gn
iw
ei
V
gn
iw
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V
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V
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iw
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V
gn
iw
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n
A
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M .ni
M .ni
M .ni
M .ni
M
.p
yT .p
yT .p
yT .p
yT .p
yT
2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2
H/
C
E
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60
5
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E
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R
O
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PY
H
R
A
EL
C
R
ET
A
W
00
51
00
32
00
1
lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
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iv
e
D ec
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D ec
iv
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D ec
iv
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yT .p
yT .p
yT .p
yT .p
yT
.x
a
M .x
a
M .x
a
M .x
a
M .x
a
M
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
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sn
oit
id
no
C
ts
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sn
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id
no
C
ts
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oit
id
no
C
ts
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ka
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ht
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el
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a
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ka
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P
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na
rO
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py
H
04
6
m
n
I
F
A
m
02
=
D
ht
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el
ev
a
W
et
an
im
o
D
eg
na
rO
re
py
H
03
6
m
n
I
F
A
m
02
=
2/
1
ht
di
w-
fla
H
en
iL
lar
tc
ep
S
eg
na
rO
re
py
H
52
m
n
I
F
A
m
02
=
C
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na
tic
ap
a
C
eg
na
rO
re
py
H
72
F
p
V
F
z
H
M
1=
f;
V
0=
V
F
eg
atl
oV
dr
a
wr
oF
eg
na
rO
re
py
H
2.
2
8.
2
V
I
F
A
m
02
=
I
R
tn
err
u
C
es
re
ve
R
eg
na
rO
re
py
H
01
A
u
V
R
V
5
=
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
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na
rO
re
py
H
eg
na
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re
py
H
eg
na
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re
py
H
eg
na
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re
py
H
eg
na
rO
re
py
H
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
no
ita
pi
ss
id
re
w
o
P
04
1
W
m
tn
err
u
C
dr
a
wr
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C
D
05
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m
]1[
tn
err
u
C
dr
a
wr
oF
ka
e
P
05
1
A
m
eg
atl
oV
es
re
ve
R
5
V
er
ut
ar
ep
m
eT
eg
ar
ot
S/
gn
ita
re
p
O
04
-
58
+
oT
C
C
SPEC NO: DSAB8380
REV NO: V.3
DATE:MAY/11/2003
PAGE: 4 OF 4
APPROVED : J. Lu
CHECKED :Allen Liu
DRAWN:S.J.HOU
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
AA5060SEC/H
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
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