SPEC NO: DSAB0889
REV NO: V.3
DATE:FEB/15/2003
PAGE: 1 OF 4
APPROVED : J. Lu
CHECKED : Allen Liu
DRAWN:Y.H.LI
AM23YD-F YELLOW
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
0.25(0.01") unless otherwise noted.
3. Lead spacing is measured where the lead emerge package.
4. Specifications are subject to change without notice.
Package Dimensions
Description
The Yellow source color devices are made with
Gallium Arsenide Phosphide on Gallium Phosphide
Yellow Light Emitting Diode.
SOT-23 SURFACE MOUNT LED LAMP
Features
!
SOT-23 PACKAGE SURFACE MOUNT LED LAMP.
!
LOW POWER CONSUMPTION.
!
LONG LIFE - SOLID STATE RELIABILITY.
!
PACKAGE: 2000PCS / REEL.
SPEC NO: DSAB0889
REV NO: V.3
DATE:FEB/15/2003
PAGE: 2 OF 4
APPROVED : J. Lu
CHECKED : Allen Liu
DRAWN:Y.H.LI
Electrical / Optical Characteristics at T
A
=25
C
Absolute Maximum Ratings at T
A
=25
C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Selection Guide
Note:
1.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
.
o
N
t
r
a
P
.
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N
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r
a
P
.
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N
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r
a
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)
d
c
m
(
v
I
)
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c
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(
v
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)
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c
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(
v
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)
d
c
m
(
v
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)
d
c
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(
v
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m
0
2
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p
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2
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1
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2 2
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1
2 2
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1
2
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3
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6
.
1
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.
p
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.
p
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.
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.
p
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.
x
a
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a
M .
x
a
M .
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a
M
s
ti
n
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s
ti
n
U
s
ti
n
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ti
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w
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0
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5
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n
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=
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t
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a
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e
t
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m
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D
w
o
ll
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Y
8
8
5
m
n
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F
A
m
0
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=
2
/
1
h
t
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w
-
fl
a
H
e
n
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l
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r
t
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e
p
S
w
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ll
e
Y
5
3
m
n
I
F
A
m
0
2
=
C
e
c
n
a
ti
c
a
p
a
C
w
o
ll
e
Y
0
2
F
p
V
F
z
H
M
1
=
f
;
V
0
=
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F
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g
a
tl
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d
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F
w
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ll
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1
.
2
5
.
2
V
I
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m
0
2
=
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R
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r
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C
e
s
r
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w
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ll
e
Y
0
1
A
u
V
R
V
5
=
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t
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a
P
r
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w
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ll
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w
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ll
e
Y
w
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ll
e
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w
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ll
e
Y
w
o
ll
e
Y
s
ti
n
U
s
ti
n
U
s
ti
n
U
s
ti
n
U
s
ti
n
U
n
o
it
a
p
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s
s
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d
r
e
w
o
P
5
0
1
W
m
t
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e
r
r
u
C
d
r
a
w
r
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C
D
0
3
A
m
]
1
[
t
n
e
r
r
u
C
d
r
a
w
r
o
F
k
a
e
P
0
4
1
A
m
e
g
a
tl
o
V
e
s
r
e
v
e
R
5
V
e
r
u
t
a
r
e
p
m
e
T
e
g
a
r
o
t
S
/
g
n
it
a
r
e
p
O
0
4
-
5
8
+
o
T
C
C
SPEC NO: DSAB0889
REV NO: V.3
DATE:FEB/15/2003
PAGE: 4 OF 4
APPROVED : J. Lu
CHECKED : Allen Liu
DRAWN:Y.H.LI
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
AM23YD-F
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
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