SPEC NO: DSAD1282
REV NO: V.1
DATE: MAR/27/2003
PAGE: 1 OF 4
APPROVED: J. Lu
CHECKED: Allen Liu
DRAWN: Z.Y.YANG
SUBMINIATURE SOLID STATE LAMP
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
0
.25(0.01") unless otherwise noted.
3. Lead spacing is measured where the lead emerge package.
4. Specifications are subject to change without notice.
Features
l
SUBMINIATURE PACKAGE.
l
WIDE VIEWING ANGLE.
l
Z-BEND LEAD.
l
LONG LIFE - SOLID STATE RELIABILITY.
l
LOW PACKAGE PROFILE.
l
PACKAGE : 1000PCS / REEL.
AM2520SURC09 HYPER RED
Description
The Hyper Red source color devices are made
with DH InGaAlP on GaAs substrate Light
Emitting Diode.
SPEC NO: DSAD1282
REV NO: V.1
DATE: MAR/27/2003
PAGE: 2 OF 4
APPROVED: J. Lu
CHECKED: Allen Liu
DRAWN: Z.Y.YANG
Electrical / Optical Characteristics at T
A
=25
C
Absolute Maximum Ratings at T
A
=25
C
Selection Guide
Note:
1.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
ec
iD ec
iD ec
iD ec
iD ec
iD
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
A
m
02
@
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V elg
n
A
.ni
M .ni
M .ni
M .ni
M .ni
M
.p
yT .p
yT .p
yT .p
yT .p
yT
2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2
90
C
R
U
S0
25
2
M
A
)
Pl
Aa
G
nI
(
D
E
R
R
E
PY
H
R
A
EL
C
R
ET
A
W
08
2
06
6
0
2
lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ec
iv
e
D ec
iv
e
D ec
iv
e
D ec
iv
e
D ec
iv
e
D
.p
yT .p
yT .p
yT .p
yT .p
yT
.x
a
M .x
a
M .x
a
M .x
a
M .x
a
M
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
ka
ep
ht
gn
el
ev
a
W
ka
e
P
de
R
re
py
H
04
6
m
n
I
F
A
m
02
=
D
ht
gn
el
ev
a
W
et
an
im
o
D
de
R
re
py
H
82
6
m
n
I
F
A
m
02
=
2/
1
ht
di
w-
fla
H
en
iL
lar
tc
ep
S
de
R
re
py
H
72
m
n
I
F
A
m
02
=
C
ec
na
tic
ap
a
C
de
R
re
py
H
54
Fp
V
F
zH
M
1=
f;V
0=
V
F
eg
atl
oV
dr
a
wr
oF
de
R
re
py
H
9.
1
5.
2
V
I
F
A
m
02
=
I
R
tn
err
u
C
es
re
ve
R
de
R
re
py
H
01
Au
V
R
V5
=
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
de
R
re
py
H
de
R
re
py
H
de
R
re
py
H
de
R
re
py
H
de
R
re
py
H
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
no
ita
pi
ss
id
re
w
o
P
07
1
W
m
tn
err
u
C
dr
a
wr
oF
C
D
03
A
m
]1[
tn
err
u
C
dr
a
wr
oF
ka
e
P
58
1
A
m
eg
atl
oV
es
re
ve
R
5
V
er
ut
ar
ep
m
eT
eg
ar
ot
S/
gn
ita
re
p
O
04
-
58
+
oT
C
C
SPEC NO: DSAD1282
REV NO: V.1
DATE: MAR/27/2003
PAGE: 4 OF 4
APPROVED: J. Lu
CHECKED: Allen Liu
DRAWN: Z.Y.YANG
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
AM2520SURC09
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
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