SPEC NO:DSAD1308
REV NO: V.1
DATE:MAR/29/2003 PAGE: 1 OF 4
APPROVED:J.LU
CHECKED:Allen Liu DRAWN:Y.H.LI
SUBMINIATURE SOLID STATE LAMP
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
0.25(0.01") unless otherwise noted.
3. Lead spacing is measured where the lead emerge package.
4. Specifications are subject to change without notice.
Features
l
SUBMINIATURE PACKAGE.
l
WIDE VIEWING ANGLE.
l
YOKE LEAD.
l
LONG LIFE - SOLID STATE RELIABILITY.
l
LOW PACKAGE PROFILE.
l
PACKAGE :1000PCS / REEL.
Package Dimensions
AM27ID08 HIGH EFFICIENCY RED
Description
The High Efficiency Red source color devices are made
with Gallium Arsenide Phosphide on Gallium Phosphide
Orange Light Emitting Diode.
SPEC NO:DSAD1308
REV NO: V.1
DATE:MAR/29/2003 PAGE: 2 OF 4
APPROVED:J.LU
CHECKED:Allen Liu DRAWN:Y.H.LI
Selection Guide
Electrical / Optical Characteristics at T
A
=25
C
Absolute Maximum Ratings at T
A
=25
C
Note:
1.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
ec
iD ec
iD ec
iD ec
iD ec
iD
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
A
m
02
@
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V elg
n
A
.ni
M .ni
M .ni
M .ni
M .ni
M
.p
yT .p
yT .p
yT .p
yT .p
yT
2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2
80
DI
72
M
A
)P
a
G/
Ps
Aa
G(
D
E
R
Y
C
N
EI
CI
F
F
E
H
GI
H
D
E
S
U
F
FI
D
D
E
R
7
03
0
4
lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ec
iv
e
D ec
iv
e
D ec
iv
e
D ec
iv
e
D ec
iv
e
D
.p
yT .p
yT .p
yT .p
yT .p
yT
.x
a
M .x
a
M .x
a
M .x
a
M .x
a
M
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
ka
ep
ht
gn
el
ev
a
W
ka
e
P
de
R
yc
ne
icif
fE
hg
iH
72
6
m
n
I
F
A
m
02
=
D
ht
gn
el
ev
a
W
et
an
im
o
D
de
R
yc
ne
icif
fE
hg
iH
52
6
m
n
I
F
A
m
02
=
2/
1
ht
di
w-
fla
H
en
iL
lar
tc
ep
S
de
R
yc
ne
icif
fE
hg
iH
54
m
n
I
F
A
m
02
=
C
ec
na
tic
ap
a
C
de
R
yc
ne
icif
fE
hg
iH
51
F
p
V
F
z
H
M
1=
f;
V
0=
V
F
eg
atl
oV
dr
a
wr
oF
de
R
yc
ne
icif
fE
hg
iH
0.
2
5.
2
V
I
F
A
m
02
=
I
R
tn
err
u
C
es
re
ve
R
de
R
yc
ne
icif
fE
hg
iH
01
A
u
V
R
V
5
=
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
de
R
yc
ne
ici
ff
E
hg
iH
de
R
yc
ne
ici
ff
E
hg
iH
de
R
yc
ne
ici
ff
E
hg
iH
de
R
yc
ne
ici
ff
E
hg
iH
de
R
yc
ne
ici
ff
E
hg
iH
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
no
ita
pi
ss
id
re
w
o
P
50
1
W
m
tn
err
u
C
dr
a
wr
oF
C
D
03
A
m
]1[
tn
err
u
C
dr
a
wr
oF
ka
e
P
06
1
A
m
eg
atl
oV
es
re
ve
R
5
V
er
ut
ar
ep
m
eT
eg
ar
ot
S/
gn
ita
re
p
O
04
-
58
+
oT
C
C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
SPEC NO:DSAD1308
REV NO: V.1
DATE:MAR/29/2003 PAGE: 3 OF 4
APPROVED:J.LU
CHECKED:Allen Liu DRAWN:Y.H.LI
High Efficiency Red AM27ID08
SPEC NO:DSAD1308
REV NO: V.1
DATE:MAR/29/2003 PAGE: 4 OF 4
APPROVED:J.LU
CHECKED:Allen Liu DRAWN:Y.H.LI
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
AM27ID08
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
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