SPEC NO:DSAD1317
REV NO: V.1
DATE:MAR/29/2003 PAGE: 1 OF 4
APPROVED:J.LU
CHECKED:Allen Liu DRAWN:Y.H.LI
SUBMINIATURE SOLID STATE LAMP
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
0.25(0.01") unless otherwise noted.
3. Lead spacing is measured where the lead emerge package.
4. Specifications are subject to change without notice.
Features
l
SUBMINIATURE PACKAGE.
l
WIDE VIEWING ANGLE.
l
YOKE LEAD.
l
LONG LIFE - SOLID STATE RELIABILITY.
l
LOW PACKAGE PROFILE.
l
PACKAGE :1000PCS / REEL.
Package Dimensions
AM27YC08 YELLOW
Description
The Yellow source color devices are made with Gallium
Arsenide Phosphide on Gallium Phosphide Yellow Light
Emitting Diode.
SPEC NO:DSAD1317
REV NO: V.1
DATE:MAR/29/2003 PAGE: 2 OF 4
APPROVED:J.LU
CHECKED:Allen Liu DRAWN:Y.H.LI
Selection Guide
Absolute Maximum Ratings at T
A
=25
C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Electrical / Optical Characteristics at T
A
=25
C
Note:
1.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
w
oll
eY w
oll
eY w
oll
eY w
oll
eY w
oll
eY
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
no
ita
pi
ss
id
re
w
o
P
50
1
W
m
tn
err
u
C
dr
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03
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m
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tn
err
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dr
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04
-
58
+
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C
C
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b
m
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b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
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m
ar
a
P
ret
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m
ar
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e
m
ar
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ec
iv
e
D ec
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D ec
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D ec
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D ec
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yT .p
yT .p
yT .p
yT .p
yT
.x
a
M .x
a
M .x
a
M .x
a
M .x
a
M
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
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sn
oit
id
no
C
ts
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sn
oit
id
no
C
ts
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ka
ep
ht
gn
el
ev
a
W
ka
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P
w
oll
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09
5
m
n
I
F
A
m
02
=
D
ht
gn
el
ev
a
W
et
an
im
o
D
w
oll
eY
88
5
m
n
I
F
A
m
02
=
2/
1
ht
di
w-
fla
H
en
iL
lar
tc
ep
S
w
oll
eY
53
m
n
I
F
A
m
02
=
C
ec
na
tic
ap
a
C
w
oll
eY
02
Fp
V
F
z
H
M
1=
f;
V
0=
V
F
eg
atl
oV
dr
a
wr
oF
w
oll
eY
1.
2
5.
2
V
I
F
A
m
02
=
I
R
tn
err
u
C
es
re
ve
R
w
oll
eY
01
Au
V
R
V
5
=
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
ec
iD ec
iD ec
iD ec
iD ec
iD
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
A
m
02
@
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V elg
n
A
.ni
M .ni
M .ni
M .ni
M .ni
M
.p
yT .p
yT .p
yT .p
yT .p
yT
2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2
80
C
Y
72
M
A
)P
a
G/
Ps
A
a
G(
W
O
LL
EY
R
A
E
L
C
R
ET
A
W
01
03
0
2
SPEC NO:DSAD1317
REV NO: V.1
DATE:MAR/29/2003 PAGE: 3 OF 4
APPROVED:J.LU
CHECKED:Allen Liu DRAWN:Y.H.LI
Yellow AM27YC08
SPEC NO:DSAD1317
REV NO: V.1
DATE:MAR/29/2003 PAGE: 4 OF 4
APPROVED:J.LU
CHECKED:Allen Liu DRAWN:Y.H.LI
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
AM27YC08
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
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