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Электронный компонент: AP2012SEC

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SPEC NO:DSAD0937
REV NO: V.1
DATE:MAR/17/2003
PAGE: 1 OF 4
APPROVED : J. Lu
CHECKED : Allen Liu
DRAWN:D.L.HUANG
2.0x1.25mm SMD CHIP LED LAMP
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
0.1(0.004") unless otherwise noted.
3. Specifications are subject to change without notice.
Package Dimensions
AP2012SEC SUPER BRIGHT ORANGE
Description
The Super Bright Orange source color devices are
made with DH InGaAlP on GaAs substrate Light
Emitting Diode.
Features
!
2.0mmx1.25mm SMT LED, 1.1mm THICKNESS.
!
LOW POWER CONSUMPTION.
!
WIDE VIEWING ANGLE.
!
IDEAL FOR BACKLIGHT AND INDICATOR.
!
VARIOUS COLORS AND LENS TYPES AVAILABLE.
!
PACKAGE : 2000PCS / REEL.
SPEC NO:DSAD0937
REV NO: V.1
DATE:MAR/17/2003
PAGE: 2 OF 4
APPROVED : J. Lu
CHECKED : Allen Liu
DRAWN:D.L.HUANG
Selection Guide
Note:
1.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Absolute Maximum Ratings at T
)
=25


C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Electrical / Optical Characteristics at T
)
=25


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SPEC NO:DSAD0937
REV NO: V.1
DATE:MAR/17/2003
PAGE: 3 OF 4
APPROVED : J. Lu
CHECKED : Allen Liu
DRAWN:D.L.HUANG
Super Bright Orange AP2012SEC
SPEC NO:DSAD0937
REV NO: V.1
DATE:MAR/17/2003
PAGE: 4 OF 4
APPROVED : J. Lu
CHECKED : Allen Liu
DRAWN:D.L.HUANG
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
AP2012SEC
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.