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Электронный компонент: APA3010F3C

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SPEC NO:DSAD1359
REV NO: V.1
DATE:MAR/31/2003
PAGE: 1 OF 4
APPROVED: J.LU
CHECKED: Allen Liu
DRAWN: L.ZHANG
3.0mmx1.0mm INFRA-RED EMITTING DIODE
Features
!
3.0mm x 1.0mm SMT LED, 2.0mm THICKNESS.
!
LOW POWER CONSUMPTION.
!
WIDE VIEWING ANGLE.
!
IDEAL FOR BACK LIGHT AND INDICATOR.
!
VARIOUS COLORS AND LENS TYPES AVAILABLE.
!
PACKAGE : 2000PCS / REEL.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
0.15(0.006") unless otherwise noted.
3. Specifications are subject to change without notice.
APA3010F3C
Description
F3 Made with Gallium Arsenide Infrared Emitting
diodes.
SPEC NO:DSAD1359
REV NO: V.1
DATE:MAR/31/2003
PAGE: 2 OF 4
APPROVED: J.LU
CHECKED: Allen Liu
DRAWN: L.ZHANG
Selection Guide
Electrical / Optical Characteristics at T
A
=25


C
Absolute Maximum Ratings at T
A
=25


C
Note:
1.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Note:
1. 1/100 Duty Cycle, 10us Pulse Width.
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SPEC NO:DSAD1359
REV NO: V.1
DATE:MAR/31/2003
PAGE: 3 OF 4
APPROVED: J.LU
CHECKED: Allen Liu
DRAWN: L.ZHANG
APA3010F3C
SPEC NO:DSAD1359
REV NO: V.1
DATE:MAR/31/2003
PAGE: 4 OF 4
APPROVED: J.LU
CHECKED: Allen Liu
DRAWN: L.ZHANG
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
APA3010F3C
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.