SPEC NO: DSAB3267
REV NO: V.2
DATE: MAR/17/2003
PAGE: 1 OF 4
APPROVED: J. Lu
CHECKED: Allen Liu
DRAWN: Z.Y.YANG
3.0x1.0 mm SMD CHIP LED LAMP
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
0.15(0.006") unless otherwise noted.
3. Specifications are subject to change without notice.
Features
!
3.0mm x 1.0mm SMT LED, 2.0mm THICKNESS.
!
LOW POWER CONSUMPTION.
!
WIDE VIEWING ANGLE.
!
IDEAL FOR BACK LIGHT AND INDICATOR.
!
VARIOUS COLORS AND LENS TYPES AVAILABLE.
!
PACKAGE : 2000PCS / REEL.
Package Dimensions
APA3010MBC BLUE
Description
The Blue source color devices are made with GaN on
SiC Light Emitting Diode.
Static electricity and surge damage the LEDS. It is
recommended to use a wrist band or anti-electrostatic
glove when handling the LEDs.
All devices, equipment and machinery must be
electrically grounded.
SPEC NO: DSAB3267
REV NO: V.2
DATE: MAR/17/2003
PAGE: 2 OF 4
APPROVED: J. Lu
CHECKED: Allen Liu
DRAWN: Z.Y.YANG
Selection Guide
Absolute Maximum Ratings at T
A
=25
C
Electrical / Optical Characteristics at T
A
=25
C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Note:
1.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
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(
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(
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(
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2
2
2
2
2
2
/
1 2
/
1 2
/
1 2
/
1 2
/
1
C
B
M
0
1
0
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A
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)
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a
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(
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B
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C
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T
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W
4
0
1
0
2
1
SPEC NO: DSAB3267
REV NO: V.2
DATE: MAR/17/2003
PAGE: 4 OF 4
APPROVED: J. Lu
CHECKED: Allen Liu
DRAWN: Z.Y.YANG
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
APA3010MBC
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
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