SPEC NO:DSAB2895
REV NO: V.3
DATE:DEC/06/2002 PAGE: 1 OF 5
APPROVED:J.LU
CHECKED:Joe Lee DRAWN:Y.H.LI
Package Dimensions & Internal Circuit Diagram
Notes:
1. All dimensions are in millimeters (inches), Tolerance is
0.25(0.01")unless otherwise noted.
2. Specifications are subject to change whitout notice.
SURFACE MOUNT DISPLAY
Features
!
0.2INCH DIGIT HEIGHT.
!
LOW CURRENT OPERATION.
!
EXCELLENT CHARACTER APPEARANCE.
!
I.C. COMPATIBLE
!
MECHANICALLY RUGGED.
!
GRAY FACE,WHITE SEGMENT.
!
PACKAGE:1000PCS/REEL.
APBA02-41VGKWA GREEN
Description
The Green source color devices are made with
InGaN on SiC Light Emitting Diode.
SPEC NO:DSAB2895
REV NO: V.3
DATE:DEC/06/2002 PAGE: 2 OF 5
APPROVED:J.LU
CHECKED:Joe Lee DRAWN:Y.H.LI
Selection Guide
Electrical / Optical Characteristics at T
A
=25
C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Absolute Maximum Ratings at T
A
=25
C
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
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m
a
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r
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t
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m
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P
r
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m
a
r
a
P
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c
i
v
e
D
e
c
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D
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c
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c
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D
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c
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v
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D
.
p
y
T
.
p
y
T
.
p
y
T
.
p
y
T
.
p
y
T
.
x
a
M .
x
a
M .
x
a
M .
x
a
M
.
x
a
M
s
ti
n
U
s
ti
n
U
s
ti
n
U
s
ti
n
U
s
ti
n
U
s
n
o
it
i
d
n
o
C
t
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T
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it
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d
n
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T
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it
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t
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e
T
s
n
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it
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d
n
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C
t
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it
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d
n
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t
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T
k
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l
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W
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P
n
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r
G
5
1
5
m
n
I
F
A
m
0
2
=
D
h
t
g
n
e
l
e
v
a
W
e
t
a
n
i
m
o
D
n
e
e
r
G
5
2
5
m
n
I
F
A
m
0
2
=
2
/
1
h
t
d
i
w
-
fl
a
H
e
n
i
L
l
a
r
t
c
e
p
S
n
e
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r
G
0
3
m
n
I
F
A
m
0
2
=
C
e
c
n
a
ti
c
a
p
a
C
n
e
e
r
G
5
4
F
p
V
F
z
H
M
1
=
f;
V
0
=
V
F
e
g
a
tl
o
V
d
r
a
w
r
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F
n
e
e
r
G
2
.
4
8
.
4
V
I
F
A
m
0
2
=
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R
t
n
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r
r
u
C
e
s
r
e
v
e
R
n
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e
r
G
0
1
A
u
V
R
V
5
=
r
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t
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m
a
r
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P
r
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t
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P
r
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it
a
p
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5
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r
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C
D
5
2
A
m
]
1
[
t
n
e
r
r
u
C
d
r
a
w
r
o
F
k
a
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P
0
3
1
A
m
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g
a
tl
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V
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s
r
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R
5
V
e
r
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t
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r
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p
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e
T
e
g
a
r
o
t
S
/
g
n
it
a
r
e
p
O
0
4
-
5
8
+
o
T
C
C
.
o
N
t
r
a
P
.
o
N
t
r
a
P
.
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N
t
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.
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N
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c
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D e
c
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p
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T
s
n
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e
p
y
T
s
n
e
L
e
p
y
T
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p
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T
s
n
e
L
)
d
c
u
(
v
I
)
d
c
u
(
v
I
)
d
c
u
(
v
I
)
d
c
u
(
v
I
)
d
c
u
(
v
I
A
m
0
1
@
n
o
it
p
i
r
c
s
e
D
n
o
it
p
i
r
c
s
e
D
n
o
it
p
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r
c
s
e
D
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it
p
i
r
c
s
e
D
n
o
it
p
i
r
c
s
e
D
.
n
i
M .
n
i
M .
n
i
M .
n
i
M .
n
i
M
.
p
y
T .
p
y
T
.
p
y
T
.
p
y
T
.
p
y
T
A
W
K
G
V
1
4
-
2
0
A
B
P
A
)
N
a
G
n
I
(
N
E
E
R
G
D
E
S
U
F
F
I
D
E
T
I
H
W
0
0
0
2
1
0
0
5
5
5
l
a
m
i
c
e
D
d
n
a
H
.t
R
.
e
d
o
n
A
n
o
m
m
o
C
SPEC NO:DSAB2895
REV NO: V.3
DATE:DEC/06/2002 PAGE: 3 OF 5
APPROVED:J.LU
CHECKED:Joe Lee DRAWN:Y.H.LI
Green APBA02-41VGKWA
SPEC NO:DSAB2895
REV NO: V.3
DATE:DEC/06/2002 PAGE: 4 OF 5
APPROVED:J.LU
CHECKED:Joe Lee DRAWN:Y.H.LI
Recommended Soldering Pattern
(Units : mm)
APBA02-41VGKWA
SMT Reflow Soldering Instruction
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
SPEC NO:DSAB2895
REV NO: V.3
DATE:DEC/06/2002 PAGE: 5 OF 5
APPROVED:J.LU
CHECKED:Joe Lee DRAWN:Y.H.LI
Tape Specification
(Units : mm)
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