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Электронный компонент: APBA3010PBVGKC

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SPEC NO: DSAD1095
REV NO: V.1
DATE:MAR/20/2003
PAGE: 1 OF 5
APPROVED : J. Lu
CHECKED :Allen Liu
DRAWN: X.T.HU
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
0.15(0.006") unless otherwise noted.
3. Specifications are subject to change without notice.
Package Dimensions
3.0x1.0mm SMD CHIP LED LAMP
Features
!
3.0mmx1.0mm SMT LED, 2.0mm THICKNESS.
!
LOW POWER CONSUMPTION.
!
WIDE VIEWING ANGLE.
!
IDEAL FOR BACKLIGHT AND INDICATOR.
!
VARIOUS COLORS AND LENS TYPES AVAILABLE.
!
PACKAGE : 2000PCS / REEL.
APBA3010PBVGKC BLUE / GREEN
Description
The Blue source color devices are made with InGaN on
SiC Light Emitting Diode.
The Green source color devices are made with DH
InGaN on GaAs substrate Light Emitting Diode.
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SPEC NO: DSAD1095
REV NO: V.1
DATE:MAR/20/2003
PAGE: 2 OF 5
APPROVED : J. Lu
CHECKED :Allen Liu
DRAWN: X.T.HU
Selection Guide
Note:
1
.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Electrical / Optical Characteristics at T
)
=25


C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Absolute Maximum Ratings at T
)
=25


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SPEC NO: DSAD1095
REV NO: V.1
DATE:MAR/20/2003
PAGE: 3 OF 5
APPROVED : J. Lu
CHECKED :Allen Liu
DRAWN: X.T.HU
APBA3010PBVGKC
Blue
background image
SPEC NO: DSAD1095
REV NO: V.1
DATE:MAR/20/2003
PAGE: 4 OF 5
APPROVED : J. Lu
CHECKED :Allen Liu
DRAWN: X.T.HU
Green
background image
SPEC NO: DSAD1095
REV NO: V.1
DATE:MAR/20/2003
PAGE: 5 OF 5
APPROVED : J. Lu
CHECKED :Allen Liu
DRAWN: X.T.HU
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
APBA3010PBVGKC
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.