SPEC NO:DSAD1107
REV NO: V.1 DATE:MAR/19/2003
PAGE: 1 OF 5
APPROVED: J. Lu
CHECKED: Allen Liu DRAWN:Y.H.LI
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
0.1(0.004") unless otherwise noted.
3. Specifications are subject to change without notice.
Package Dimensions
3.2x2.4mm SMD CHIP LED LAMP
Features
l
3.2x2.4mm SMT LED, 2.4mm THICKNESS.
l
LOW POWER CONSUMPTION.
l
IDEAL FOR BACKLIGHT AND INDICATOR.
l
VARIOUS COLORS AND LENS TYPES AVAILABLE.
l
PACKAGE : 1500PCS / REEL.
APBD3224PBVGKC BLUE/GREEN
Description
The Blue source color devices are made with InGaN
on SiC Light Emitting Diode.
The Green source color devices are made with DH
InGaN on GaAs substrate Light Emitting Diode.
SPEC NO:DSAD1107
REV NO: V.1 DATE:MAR/19/2003
PAGE: 2 OF 5
APPROVED: J. Lu
CHECKED: Allen Liu DRAWN:Y.H.LI
Absolute Maximum Ratings at T
A
=25
C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Selection Guide
Note:
1.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Absolute Maximum Ratings at T
A
=25
C
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
eu
lB eu
lB eu
lB eu
lB eu
lB
ne
er
G ne
er
G ne
er
G ne
er
G ne
er
G
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
no
ita
pi
ss
id
re
w
o
P
20
1
50
1
W
m
tn
err
u
C
dr
a
wr
oF
C
D
03
52
A
m
]1[
tn
err
u
C
dr
a
wr
oF
ka
e
P
06
1
03
1
A
m
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atl
oV
es
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ve
R
5
5
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er
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ar
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ar
ot
S/
gn
ita
re
p
O
04
-
58
+
oT
C
C
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N
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P
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N
tra
P
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
ec
iD ec
iD ec
iD ec
iD ec
iD
ep
yT
sn
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ep
yT
sn
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ep
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ep
yT
sn
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ep
yT
sn
eL
)d
c
m(
vI
)d
c
m(
vI
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c
m(
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)d
c
m(
vI
)d
c
m(
vI
A
m
02
@
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V elg
n
A
.ni
M .ni
M .ni
M .ni
M .ni
M
.p
yT .p
yT .p
yT .p
yT .p
yT
2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2
C
K
G
V
B
P
42
23
D
B
P
A
)N
a
G
nI(
E
U
L
B
R
A
E
L
C
R
E
T
A
W
63
00
1
0
2
)N
a
G
nI(
N
E
E
R
G
05
00
2
lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ec
iv
e
D ec
iv
e
D ec
iv
e
D ec
iv
e
D ec
iv
e
D
.p
yT .p
yT .p
yT .p
yT .p
yT
.x
a
M .x
a
M .x
a
M .x
a
M .x
a
M
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
ka
ep
ht
gn
el
ev
a
W
ka
e
P
eu
lB nee
rG
86
4 51
5
m
n
I
F
A
m
02
=
D
ht
gn
el
ev
a
W
et
an
im
o
D
eu
lB nee
rG
07
4 52
5
m
n
I
F
A
m
02
=
2/
1
ht
di
w-
fla
H
en
iL
lar
tc
ep
S
eu
lB nee
rG
52
03
m
n
I
F
A
m
02
=
C
ec
na
tic
ap
a
C
eu
lB nee
rG
56
54
F
p
V
F
z
H
M
1=
f;
V
0=
V
F
eg
atl
oV
dr
a
wr
oF
eu
lB nee
rG
56
.32.4
2.
4 8.
4
V
I
F
A
m
02
=
I
R
tn
err
u
C
es
re
ve
R
llA
01
A
u
V
R
V
5
=
SPEC NO:DSAD1107
REV NO: V.1 DATE:MAR/19/2003
PAGE: 5 OF 5
APPROVED: J. Lu
CHECKED: Allen Liu DRAWN:Y.H.LI
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
APBD3224PBVGKC
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
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