SPEC NO: CDA0370
REV NO: V.1
DATE:OCT/25/2001
PAGE: 1 OF 4
APPROVED: J.LU
CHECKED:
DRAWN: Y.F.XU
1.6x1.2mm BI-COLOR SMD CHIP LED LAMP
APTB1612SURKSGC HYPER RED/SUPER BRIGHT GREEN
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
0.2(0.0079") unless otherwise noted.
3. Lead spacing is measured where the lead emerge package.
4. Specifications are subject to change without notice.
Package Dimensions
Features
!
1.6mmx1.2mm SMT LED, 0.65mm THICKNESS.
!
BI -COLOR,LOW POWER CONSUMPTION.
!
WIDE VIEWING ANGLE.
!
IDEAL FOR BACKLIGHT AND INDICATOR.
!
VARIOUS COLORS AND LENS TYPES AVAILABLE.
!
PACKAGE : 2000PCS / REEL.
Description
The Hyper Red source color devices are made with DH
InGaAlP on GaAs substrate Light Emitting Diode.
The Super Bright Green source color devices are made
with Gallium Phosphide Green Light Emitting Diode.
SPEC NO: CDA0370
REV NO: V.1
DATE: OCT/25/2001
PAGE: 2 OF 4
APPROVED: J.LU
CHECKED:
DRAWN: Y.F.XU
Selection Guide
Electrical / Optical Characteristics at T
)
=25
C
Note:
1
.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Absolute Maximum Ratings at T
)
=25
C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
.
o
N
t
r
a
P
.
o
N
t
r
a
P
.
o
N
t
r
a
P
.
o
N
t
r
a
P
.
o
N
t
r
a
P
e
c
i
D e
c
i
D e
c
i
D e
c
i
D e
c
i
D
e
p
y
T
s
n
e
L
e
p
y
T
s
n
e
L
e
p
y
T
s
n
e
L
e
p
y
T
s
n
e
L
e
p
y
T
s
n
e
L
)
d
c
m
(
v
I
)
d
c
m
(
v
I
)
d
c
m
(
v
I
)
d
c
m
(
v
I
)
d
c
m
(
v
I
A
m
0
2
@
g
n
i
w
e
i
V
g
n
i
w
e
i
V
g
n
i
w
e
i
V
g
n
i
w
e
i
V
g
n
i
w
e
i
V
e
l
g
n
A
.
n
i
M .
n
i
M .
n
i
M .
n
i
M .
n
i
M
.
p
y
T .
p
y
T .
p
y
T .
p
y
T .
p
y
T
2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2
C
G
S
K
R
U
S
2
1
6
1
B
T
P
A
)
P
l
A
a
G
n
I(
D
E
R
R
E
P
Y
H
R
A
E
L
C
R
E
T
A
W
0
8
0
5
1
0
2
1
)
P
a
G
(
N
E
E
R
G
T
H
G
I
R
B
R
E
P
U
S
3
2
1
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
e
c
i
v
e
D
e
c
i
v
e
D
e
c
i
v
e
D
e
c
i
v
e
D
e
c
i
v
e
D
.
p
y
T .
p
y
T .
p
y
T .
p
y
T .
p
y
T
.
x
a
M .
x
a
M .
x
a
M .
x
a
M .
x
a
M
s
ti
n
U s
ti
n
U s
ti
n
U s
ti
n
U s
ti
n
U
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
k
a
e
p
h
t
g
n
e
l
e
v
a
W
k
a
e
P
d
e
R
r
e
p
y
H
n
e
e
r
G
t
h
g
ir
B
r
e
p
u
S
0
4
6
5
6
5
m
n
A
m
0
2
=
F
I
D
h
t
g
n
e
l
e
v
a
W
e
t
a
n
i
m
o
D
d
e
R
r
e
p
y
H
n
e
e
r
G
t
h
g
ir
B
r
e
p
u
S
0
3
6
8
6
5
m
n
A
m
0
2
=
F
I
2
/
1
h
t
d
i
w
fl
a
H
e
n
i
L
l
a
rt
c
e
p
S
d
e
R
r
e
p
y
H
n
e
e
r
G
t
h
g
ir
B
r
e
p
u
S
8
2
0
3
m
n
A
m
0
2
=
F
I
C
e
c
n
a
ti
c
a
p
a
C
d
e
R
r
e
p
y
H
n
e
e
r
G
t
h
g
ir
B
r
e
p
u
S
5
3
5
1
F
p
z
H
M
1
=
f;
V
0
=
R
V
V
F
e
g
a
tl
o
V
d
r
a
w
r
o
F
d
e
R
r
e
p
y
H
n
e
e
r
G
t
h
g
ir
B
r
e
p
u
S
5
9
.
1
2
.
2
5
.
2
5
.
2
V
A
m
0
2
=
F
I
I
R
t
n
e
rr
u
C
e
s
r
e
v
e
R
ll
A
0
1
A
u
V
5
=
R
V
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
d
e
R
r
e
p
y
H
d
e
R
r
e
p
y
H
d
e
R
r
e
p
y
H
d
e
R
r
e
p
y
H
d
e
R
r
e
p
y
H
n
e
e
r
G
t
h
g
ir
B
r
e
p
u
S
n
e
e
r
G
t
h
g
ir
B
r
e
p
u
S
n
e
e
r
G
t
h
g
ir
B
r
e
p
u
S
n
e
e
r
G
t
h
g
ir
B
r
e
p
u
S
n
e
e
r
G
t
h
g
ir
B
r
e
p
u
S
s
ti
n
U s
ti
n
U s
ti
n
U s
ti
n
U s
ti
n
U
n
o
it
a
p
i
s
s
i
d
r
e
w
o
P
0
7
1
5
0
1
W
m
t
n
e
rr
u
C
d
r
a
w
r
o
F
C
D
0
3
5
2
A
m
]
1
[
t
n
e
rr
u
C
d
r
a
w
r
o
F
k
a
e
P
5
8
1
0
4
1
A
m
e
g
a
tl
o
V
e
s
r
e
v
e
R
5
5
V
e
r
u
t
a
r
e
p
m
e
T
e
g
a
r
o
t
S
/
g
n
it
a
r
e
p
O
0
4
-
5
8
+
o
T
C
C
SPEC NO: CDA0370
REV NO: V.1
DATE: OCT/25/2001
PAGE: 4 OF 4
APPROVED: J.LU
CHECKED:
DRAWN: Y.F.XU
APTB1612SURKSGC
SMT Reflow Soldering Instructions
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process."
PDF 
ZIP