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Электронный компонент: KAF-1602E

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Eastman Kodak Company Image Sensor Solutions - Rochester, NY 14650-2010
Phone (716) 722-4385 Fax (716) 477-4947
Web: www.kodak.com/go/ccd E-mail: ccd@kodak.com
KAF-1602E
KAF- 1602E
1536 (H) x 1024 (V) Pixel
Full-Frame CCD Image Sensor
Performance Specification
Eastman Kodak Company
Image Sensor Solutions
Rochester, New York 14650-2010
Revision 1
April 3, 2001
Eastman Kodak Company Image Sensor Solutions - Rochester, NY 14650-2010
Phone (716) 722-4385 Fax (716) 477-4947
Web: www.kodak.com/go/ccd E-mail: ccd@kodak.com
2
Revision No. 1
KAF-1602E
TABLE OF CONTENTS
1.1 Features...............................................................................................................................................3
1.2 Description..........................................................................................................................................3
1.3 Image Acquisition...............................................................................................................................4
1.4 Charge Transport ................................................................................................................................4
1.5
Output Structure..................................................................................................................................4
1.6
Dark Reference Pixels ........................................................................................................................4
1.7
Dummy Pixels ....................................................................................................................................4
2.1 Package Drawing ................................................................................................................................5
2.2 Pin Description ...................................................................................................................................6
3.1 Absolute Maximum Ratings ...............................................................................................................7
3.2 DC Operating Conditions ...................................................................................................................8
3.3 AC Operating Conditions ...................................................................................................................9
3.4 AC Timing Conditions .......................................................................................................................9
4.1 Performance Specifications ..............................................................................................................11
4.2 Typical Performance Characteristics ................................................................................................12
4.3 Defect Classification.........................................................................................................................13
5.1 Quality Assurance and Reliability ....................................................................................................14
5.2 Ordering Information........................................................................................................................14
Revision Changes ...................................................................................................................................15
FIGURES
Figure 1 Functional Block Diagram ....................................................................................................3
Figure 2 Packaging Diagram ...............................................................................................................5
Figure 3 Packaging Pin Designations ..................................................................................................6
Figure 4 Recommended Output Structure Load Diagram ...................................................................8
Figure 5 Timing Diagrams.................................................................................................................10
Eastman Kodak Company Image Sensor Solutions - Rochester, NY 14650-2010
Phone (716) 722-4385 Fax (716) 477-4947
Web: www.kodak.com/go/ccd E-mail: ccd@kodak.com
3
Revision No. 1
KAF-1602E
1.1
Features
1.6M Pixel Area CCD
1536H x 1024V (9



m) Pixels
13.8 mm H x 9.2 mm V Photosensitive Area
2-Phase Register Clocking
Enhanced Responsivity
100% Fill Factor
High Output Sensitivity (10



V/e-)
Low Dark Current (<10pA/cm2 @ 25oC)
1.2
Description
The KAF-1602 is a high performance monochrome area
CCD (charge-coupled device) image sensor with 1536H
x 1024V photoactive pixels designed for a wide range
of image sensing applications in the 0.4nm to 1.0nm
wavelength band. Typical applications include military,
scientific, and industrial imaging. A 74dB dynamic
range is possible operating at room temperature.
The sensor is built with a true two-phase CCD
technology employing a transparent gate. This
technology simplifies the support circuits that drive the
sensor and reduces the dark current without
compromising charge capacity.
The transparent gate results in spectral response
increased ten times at 400nm, compared to a front side
illuminated standard poly silicon gate technology. The
sensitivity is increased 50% over the rest of the visible
wavelengths.
Total chip size is 13.8mm x 9.2mm and is housed in a
24-pin, 0.88" wide DIL ceramic package with 0.1" pin
spacing.
The sensor consists of 1552 parallel (vertical) CCD
shift registers each 1032 elements long. These registers
act as both the photosensitive elements and as the
transport circuits that allow the image to be sequentially
read out of the sensor. The elements of these registers
are arranged into a 1536 x 1024 photosensitive array
surrounded by a light shielded dark reference of 16
columns and 8 rows. The parallel (vertical) CCD
registers transfer the image one line at a time into a
single 1564 element (horizontal) CCD shift register.
The horizontal register transfers the charge to a single
output amplifier. The output amplifier is a two-stage
source follower that converts the photogenerated charge
to a voltage for each pixel.
Figure 1 - Functional Block Diagram
KAF - 1602E
Usable Active Image Area
1536(H) x 1024(V)
9 x 9
m pixels
3:2 aspect ratio
1536 Active Pixels/Line
4 Dark
10 Inactive
Vrd
R
Vdd
Vout
Vss
Sub
Vog
H1
H2
V1
V2
Guard
2 Inactive
12 Dark
4 Dark lines
4 Dark lines
Eastman Kodak Company Image Sensor Solutions - Rochester, NY 14650-2010
Phone (716) 722-4385 Fax (716) 477-4947
Web: www.kodak.com/go/ccd E-mail: ccd@kodak.com
4
Revision No. 1
KAF-1602E
1.3
Image Acquisition
An electronic representation of an image is formed when
incident photons falling on the sensor plane create
electron-hole pairs within the sensor. These photon-
induced electrons are collected locally by the formation
of potential wells at each photogate or pixel site. The
number of electrons collected is linearly dependent on
light level and exposure time and non-linearly dependent
on wavelength. When the pixel's capacity is reached,
excess electrons will leak into the adjacent pixels within
the same column. This is termed blooming. During the
integration period, the
V1 and
V2 register clocks are
held at a constant (low) level.
See Figure 5. - Timing Diagrams.
1.4
Charge Transport
Referring again to Figure 5 - Timing Diagrams, the
integrated charge from each photogate is transported to
the output using a two step process. Each line (row) of
charge is first transported from the vertical CCD's to the
horizontal CCD register using the
V1 and
V2 register
clocks. The horizontal CCD is presented a new line on
the falling edge of
V2 while
H1 is held high. The
horizontal CCD's then transport each line, pixel by
pixel, to the output structure by alternately clocking the
H1 and
H2 pins in a complementary fashion. On each
falling edge of
H2 a new charge packet is transferred
onto a floating diffusion and sensed by the output
amplifier
1.5
Output Structure
Charge presented to the floating diffusion (FD) is
converted into a voltage and current amplified in order
to drive off-chip loads. The resulting voltage change
seen at the output is linearly related to the amount of
charge placed on FD.
Once the signal has been sampled by the system
electronics, the reset gate (
R) is clocked to remove the
signal and FD is reset to the potential applied by VRD.
More signal at the floating diffusion reduces the voltage
seen at the output pin. In order to activate the output
structure, an off-chip load must be added to the Vout
pin of the device - see Figure 4.
1.6
Dark Reference Pixels
Surrounding the peripheral of the device is a border of
light shielded pixels. This includes 4 leading and 12
trailing pixels on every line excluding dummy pixels.
There are also 4 full dark lines at the start of every
frame and 4 full dark lines at the end of each frame.
Under normal circumstances, these pixels do not
respond to light. However, dark reference pixels in
close proximity to an active pixel, or the outer bounds
of the chip (including the first two lines out), can
scavenge signal depending on light intensity and
wavelength and therefore will not represent the true
dark signal.
1.7
Dummy Pixels
Within the horizontal shift register are 10 leading and 2
trailing additional shift phases that are not associated
with a column of pixels within the vertical register.
These pixels contain only horizontal shift register dark
current signal and do not respond to light. A few
leading dummy pixels may scavenge false signal
depending on operating conditions
Eastman Kodak Company Image Sensor Solutions - Rochester, NY 14650-2010
Phone (716) 722-4385 Fax (716) 477-4947
Web: www.kodak.com/go/ccd E-mail: ccd@kodak.com
5
Revision No. 1
KAF-1602E
2.1
Package Drawing
Figure 2 - Package Drawing